Brewer Science, Inc. will be participating for the 13th year in the annual SEMICON China Conference and Exhibition, to be held at the Shanghai New International Expo Center from March 20-22, 2019.
 
As China continues to build its local semiconductor manufacturing infrastructure, Brewer Science is strengthening its position as the region’s leading materials supplier. Brewer Science will also be heavily represented at the China Semiconductor Technology International Conference (CSTIC) immediately preceding SEMICON China at the same venue from March 18-19, 2019.
 
On March 19, Brewer Science will give three different presentations at CSTIC. Dr. Dongshun Bai, deputy director of business development, will start the day off in Session III of the Packaging and Assembly Symposium, beginning at 8:30 a.m. In the afternoon, Dr. Dan Sullivan, executive director, semiconductor technology, and Dr Zhimin Zhu, senior scientist, will both present during the Lithography & Patterning Symposium in Session VI: Materials/Toolings, which begins at 3:40 p.m.
 
When the SEMICON China exhibition opens on March 20, attendees will have the opportunity to stop by Booth 2608 in the exhibit hall and visit with Brewer Science experts regarding growing trends for wafer-level packaging. Additionally, longtime industry partner Nissan Chemical will have experts available at Booth 2531 to discuss front-end lithography materials.
 
Technology Trends
 
A number of key trends are driving technology development in China. One of the most prevalent is artificial intelligence (AI) – its increased adoption in the areas of entertainment and education in China is predicted to help reshape those sectors in the region. Smartphones and the impending rise of 5G technology are also atop the list of drivers. Top Chinese smartphone makers anticipate delivery of 5G-based phones to escalate in the year ahead, in concert with increased development and testing of next-generation wireless infrastructures by the world’s leading mobile operators.
 
Back-End Trends
 
The trend toward China’s outsourced semiconductor assembly and test service providers (OSATs) moving into providing fan-out wafer-level packaging (FOWLP) technology as part of their advanced packaging processes continues to increase. In the past year, Brewer Science added some key offerings to its leading line of advanced packaging solutions. Together, the BrewerBOND T1100 and BrewerBOND C1300 series materials create the company’s first complete, dual-layer system for temporary bonding and debonding. The BrewerBUILD thin spin-on packaging materials are specifically created for redistribution layer (RDL)–first FOWLP – a process that Brewer Science anticipates more Chinese companies will begin to explore in the near future.
 
Front-End Trends
 
While its advancement in technology nodes continues at a steady pace, China is looking to advance its leadership in driving innovation. In the interim, the region is benefiting from implementing legacy materials for lithographic processes, such as bottom anti-reflective coatings (BARCs) and older multilayer systems. Brewer Science’s established offerings in these areas combine with the company’s R&D investments in advanced next-generation lithography processes to create a broad arsenal of tools from which China can draw in order to continue making progress toward its front-end technology goals.