David Savastano, Editor04.08.15
As the technology is growing, end users are studying the potential that flexible and printed electronics (PE) can bring to their products. Printed Electronics Europe 2015, which will be held April 28-29 in Berlin Germany, will highlight new applications and technologies. Coordinated by IDTechEx, PE Europe 2015 is expected to welcome more than 2,000 attendees.
“With still almost a month to go to the event, we have exceeded the numbers from last year for the entire show,” said CEO Raghu Das, CEO of IDTechEx. “We have more than 120 exhibitors and expect another 30 or so to confirm over the next few weeks, and are on track for over 2,000 attendees. It is volume with quality too – with strong growth of attendees from end user and system integration companies.”
Das noted that there are strong end user themes covering transportation, infrastructure, consumer goods, wearable electronics and IoT/Industry 4.0 with speakers including Qualcomm, Jaguar Land Rover, Stora Enso, Sony, AugustaWestland, United Technologies Research Center, Ericsson, Sharp, Flextronics and Shell, among others. He added that companies are more focused how the technology can benefit their applications.
“Companies are now much more solutions focused, which is a great thing for users,” said Das. “We have also noticed that end users are now more familiar with the technology and are requesting specific components or products to suppliers. We have designed the event so that participants can evaluate and create business. We are excited to build this into Europe’s largest event on printed electronics.”
There are a lot of hot technologies that PE is intertwined with, and Printed Electronics Europe 2015 will co-locate many of these innovative fields. The co-located programs include 3D Printing Europe; Energy Harvesting & Storage Europe; Electric Vehicles; Graphene & 2D Materials; Internet of Things Applications Europe; and Wearable Technology Europe.
“The event includes several co-located conferences on the topics of graphene, 3D printing, wearable technology, electric vehicles, IoT and energy harvesting and storage,” Das noted. “There is a common tradeshow and all conference attendees can access any conference track. These topics are either complimentary topics to printed electronics or represent end user markets for printed electronics. By bringing them together we showcase the entire supply chain at one event, meaning there is more market perspective, customers and ability for people to meet and do business. This has been extremely well received by attendees and exhibitors at recent events. Attendees can see the full range of related applications in one place.
Das said there will be plenty of highlights ahead for attendees and exhibitors alike, beginning with new product launches and interest in wearables and sensors.
“These are complete solutions being launched,” Das said. “Our keynote speaker lineup gives a glimpse of some of the names who will be announcing for the first time new products based on printed electronics.
“Strong interest from wearable technologies, where flexibility and premium prices can be commanded, has meant that there are many attending and speaking from the wearable technology community and many new solutions will also be presented in this area,” Das continued. “Sensors are a major segment of this event, with sessions on printed and flexible sensors; stretchable and textile based sensors; touch sensors, and complete sensor solutions. Then we have sessions on wearable technologies, automotive and IoT where end users and integrators discuss their needs from sensors (and other technologies).”
Other highlights will include 3D printed electronics and printed electronics from around the world, with speakers from Japan, the Middle East, China, Korea, U.S. and Canada.
The opening session of Day 1 offers a look at what is in store at Printed Electronics Europe 2015. After an introduction by Das, Stein Lundby, R&D manager for Qualcomm will discuss “Creating Value-Added Products Using Surface Electronics.” United Technologies Research Center scientist Sameh Dardona will cover “Printed Electronics for Aerospace and Building Industries.” Jan Hederen, DU Radio, strategy manager at Ericsson, will focus on “The Power of Touch - Exploring the Real World Web.”
Keith Churches, head of innovation services for Flextronics, will offer his insights into “Wearable Technologies: The Design & Manufacturing Challenges.” After Das returns to discuss “State of the Market,” Ashutosh Tomar, principal engineer (Research) for Jaguar Land Rover Research, will assess “Automotive Applications for Printed Electronics at Jaguar Land Rover.” Eric Calle, head of innovation R&D at JCDecaux, will close the keynote session with “The Need for Large Area Printed & Organic Electronics in Outdoor Displays & Media.”
After the keynote talks, Day 1 offers eight concurrent sessions, with Tracks a, B and C focused on Printed Electronics. Track A offers sessions on New Products and Low Power Displays. Track B covers Printed and Flexible Sensors. Track C offers talks on OPV, DSSC & Perovskites and Other PV Trends: Can it Match the Hype? as well as Lighting.
Track D covers Wearable Technology, Track E discusses both Internet of Things Applications and Energy Harvesting & Storage and Track F offers analysis of Graphene and 2D Materials. Track G will analyze 3D Printing and Track H showcases talks on Electric Vehicles.
Day 2 also features eight concurrent sessions, with three again analyzing Printed Electronics. Track A focuses on the topics of Transparent Conductive Films; Touch Sensors: The Next Phase; Batteries: What’s New; Barrier Films; and Conductive Ink Developments: New Materials, New Applications.
Track B focuses on New Display Technologies; Substrates for Displays; OLED Displays; Logic & Memory: New Breakthroughs; Smart Windows/Smart Glass; and The Global Picture.
Track C offers sessions on Inkjet Printing: Progress & Markets; Curing/Sintering for Printed Electronic: Key to High Performance Devices; 3D Printed Electronics; High Performance Printed Electronics Manufacturing; and 3D Printing of Electronics.
The co-located events – Wearable Technology (Track D), Energy Harvesting (Track E), Internet of Things (Track F), Graphene (Track G) and Electric Vehicles (Track H) – have their own sessions.
There will also be Manufacturing Street and Demonstration Street, which will show end users the possibilities of flexible and printed electronics. Das noted that IDTechEx has expanded Demonstration Street and Manufacturing Street, which will feature live manufacturing, with lead exhibitor Ceradrop taking a 90 square meter booth which will include smart 3D Printing platforms, inkjet printing systems for printed electronics and large area digital printing industrial solutions, in addition to other companies.
“New this year is the conference on wearables and vehicles which bring together needs and the user community with printed electronics,” Das added.
“Our ongoing primary goal is to create an experience for attendees and exhibitors that progresses their business and personal networks and opportunities,” Das concluded. “We have the event to focus on creating market engagement between users and suppliers, by providing insight into end user requirements in addition to assessing the latest technology progress and their roadmaps.”
“With still almost a month to go to the event, we have exceeded the numbers from last year for the entire show,” said CEO Raghu Das, CEO of IDTechEx. “We have more than 120 exhibitors and expect another 30 or so to confirm over the next few weeks, and are on track for over 2,000 attendees. It is volume with quality too – with strong growth of attendees from end user and system integration companies.”
Das noted that there are strong end user themes covering transportation, infrastructure, consumer goods, wearable electronics and IoT/Industry 4.0 with speakers including Qualcomm, Jaguar Land Rover, Stora Enso, Sony, AugustaWestland, United Technologies Research Center, Ericsson, Sharp, Flextronics and Shell, among others. He added that companies are more focused how the technology can benefit their applications.
“Companies are now much more solutions focused, which is a great thing for users,” said Das. “We have also noticed that end users are now more familiar with the technology and are requesting specific components or products to suppliers. We have designed the event so that participants can evaluate and create business. We are excited to build this into Europe’s largest event on printed electronics.”
There are a lot of hot technologies that PE is intertwined with, and Printed Electronics Europe 2015 will co-locate many of these innovative fields. The co-located programs include 3D Printing Europe; Energy Harvesting & Storage Europe; Electric Vehicles; Graphene & 2D Materials; Internet of Things Applications Europe; and Wearable Technology Europe.
“The event includes several co-located conferences on the topics of graphene, 3D printing, wearable technology, electric vehicles, IoT and energy harvesting and storage,” Das noted. “There is a common tradeshow and all conference attendees can access any conference track. These topics are either complimentary topics to printed electronics or represent end user markets for printed electronics. By bringing them together we showcase the entire supply chain at one event, meaning there is more market perspective, customers and ability for people to meet and do business. This has been extremely well received by attendees and exhibitors at recent events. Attendees can see the full range of related applications in one place.
Das said there will be plenty of highlights ahead for attendees and exhibitors alike, beginning with new product launches and interest in wearables and sensors.
“These are complete solutions being launched,” Das said. “Our keynote speaker lineup gives a glimpse of some of the names who will be announcing for the first time new products based on printed electronics.
“Strong interest from wearable technologies, where flexibility and premium prices can be commanded, has meant that there are many attending and speaking from the wearable technology community and many new solutions will also be presented in this area,” Das continued. “Sensors are a major segment of this event, with sessions on printed and flexible sensors; stretchable and textile based sensors; touch sensors, and complete sensor solutions. Then we have sessions on wearable technologies, automotive and IoT where end users and integrators discuss their needs from sensors (and other technologies).”
Other highlights will include 3D printed electronics and printed electronics from around the world, with speakers from Japan, the Middle East, China, Korea, U.S. and Canada.
The opening session of Day 1 offers a look at what is in store at Printed Electronics Europe 2015. After an introduction by Das, Stein Lundby, R&D manager for Qualcomm will discuss “Creating Value-Added Products Using Surface Electronics.” United Technologies Research Center scientist Sameh Dardona will cover “Printed Electronics for Aerospace and Building Industries.” Jan Hederen, DU Radio, strategy manager at Ericsson, will focus on “The Power of Touch - Exploring the Real World Web.”
Keith Churches, head of innovation services for Flextronics, will offer his insights into “Wearable Technologies: The Design & Manufacturing Challenges.” After Das returns to discuss “State of the Market,” Ashutosh Tomar, principal engineer (Research) for Jaguar Land Rover Research, will assess “Automotive Applications for Printed Electronics at Jaguar Land Rover.” Eric Calle, head of innovation R&D at JCDecaux, will close the keynote session with “The Need for Large Area Printed & Organic Electronics in Outdoor Displays & Media.”
After the keynote talks, Day 1 offers eight concurrent sessions, with Tracks a, B and C focused on Printed Electronics. Track A offers sessions on New Products and Low Power Displays. Track B covers Printed and Flexible Sensors. Track C offers talks on OPV, DSSC & Perovskites and Other PV Trends: Can it Match the Hype? as well as Lighting.
Track D covers Wearable Technology, Track E discusses both Internet of Things Applications and Energy Harvesting & Storage and Track F offers analysis of Graphene and 2D Materials. Track G will analyze 3D Printing and Track H showcases talks on Electric Vehicles.
Day 2 also features eight concurrent sessions, with three again analyzing Printed Electronics. Track A focuses on the topics of Transparent Conductive Films; Touch Sensors: The Next Phase; Batteries: What’s New; Barrier Films; and Conductive Ink Developments: New Materials, New Applications.
Track B focuses on New Display Technologies; Substrates for Displays; OLED Displays; Logic & Memory: New Breakthroughs; Smart Windows/Smart Glass; and The Global Picture.
Track C offers sessions on Inkjet Printing: Progress & Markets; Curing/Sintering for Printed Electronic: Key to High Performance Devices; 3D Printed Electronics; High Performance Printed Electronics Manufacturing; and 3D Printing of Electronics.
The co-located events – Wearable Technology (Track D), Energy Harvesting (Track E), Internet of Things (Track F), Graphene (Track G) and Electric Vehicles (Track H) – have their own sessions.
There will also be Manufacturing Street and Demonstration Street, which will show end users the possibilities of flexible and printed electronics. Das noted that IDTechEx has expanded Demonstration Street and Manufacturing Street, which will feature live manufacturing, with lead exhibitor Ceradrop taking a 90 square meter booth which will include smart 3D Printing platforms, inkjet printing systems for printed electronics and large area digital printing industrial solutions, in addition to other companies.
“New this year is the conference on wearables and vehicles which bring together needs and the user community with printed electronics,” Das added.
“Our ongoing primary goal is to create an experience for attendees and exhibitors that progresses their business and personal networks and opportunities,” Das concluded. “We have the event to focus on creating market engagement between users and suppliers, by providing insight into end user requirements in addition to assessing the latest technology progress and their roadmaps.”
