David Savastano, Editor11.11.15
Even as flexible and printed electronics products begin to reach commercialization, other projects remain on the drawing board. Manufacturers and suppliers offer their thoughts on what challenges that remain ahead for the technology.
“The most challenging hurdles always seem to be identifying the optimum materials set (carrier + inks) that will then perform per the customer requirements, and at a customer’s ‘target’ price,” said Jaye Tyler, president/CEO, Si-Cal Technologies Inc. A Nissha Company.
“We generally face different challenges at different stages of client involvement,” said Stan Farnsworth, VP of marketing at NovaCentrix. “In the early stages of engagement, we often play the role of technology educators, helping to inspire our clients to reach beyond their normal application constraints. Then, as we work more specifically at the project level, we help our clients innovate in applying our photonic curing or conductive ink
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