David Savastano, Editor02.10.16
Flexible and printed electronics are showing much promise, and 2016FLEX, organized by FlexTech Alliance, will be showcasing the latest advancements and research in the field.
2016FLEX will be held Feb. 29-March 3 in Monterey, CA. With more than 550 industry professionals and more than 120 speakers expected, 2016FLEX should have something for everyone in the field.
Michael Ciesinski, president, FlexTech – a SEMI Strategic Association Partner, said that 500 to 550 registrants is always a successful conference as it provides depth and breadth, but not so large that networking and one-on-one discussions are impeded. He added that pre-registration shows a powerful group of industry players.
“Some leading companies already registered for 2016 FLEX are Amazon/Lab126, Apple, Applied Materials, BASF, Bosch, Dassault Systems, DuPont, Fitbit, GE, Google Life Sciences, Kodak, Microsoft, PPG Industries, Texas Instruments, and United Technologies Research Center. R&D Organizations include Fraunhofer Institute, GE Global Research, Holst Center, ITRI, NREL, SRI International, SLAC, VTT, and Xerox/PARC,” he reported.
“Our diverse audience always brings different perspectives and good energy to the networking events,” he added. “We constantly hear from attendees about the intriguing person they met who came with a vision or concept and wants to create a new product. Attendees never know who is going to approach them at their booth – and they always appreciate the time and space for an in-depth conversation with potential new customers or partners.
Ciesinski noted that 2016FLEX offers some new features, as the integration of silicon semiconductor devices onto flexible substrates enables a whole new class of electronics, now known as flexible hybrid electronics (FHE).
“Maturing and manufacturing FHE technology is the focus of the NextFlex Manufactuing Institute,” he said. “We are excited to introduce sessions on FHE Technology, FHE Design and FHE Applications.
“We are introducing a few new short course topics, including 3D Printing, Textiles as a Platform for Flexible Electronics and Fundamentals of Technology and Manufacturing Readiness Levels,” Ciesinski added. “NextFlex brings a new energy to the event as well. They have member meetings scheduled during and at the end of the week, including some extensive roadmapping sessions on Thursday and Friday.
“The Flex Conference always has a strong emphasis on manufacturing, principally through presentations on tools, materials and processes,” noted Ciesinski. “We have buttressed that this year with sessions on sensors and batteries.”
The conference begins Monday, Feb. 29 with five three-hour Short Courses. The two morning short courses are “Introducing Printed Electronics - All the Basics and More!” and “TRL/MRL Assessment.” The three afternoon short courses are “Flexible Hybrid Electronics,” “Fusion of Fashion and Function: Textiles as a Platform” and “3D Printing on Plastics – Developments & Trends.”
“Technically speaking, the Flex Conference is once again very strong in printed electronics (PE) with sessions on PE Tools and Methods, PE In-Line Processing, PE Patterning, and PE RF Applications,” Ciesinski said. “We will conduct a short course on Printed Electronics, as well as short courses on 3D Printing, Textiles as a Platform for Flexible Electronics, Fundamentals of TRLs and MRLs, and Flexible Hybrid Electronics.”
The full conference begins on Tuesday, March 1. After introductory remarks by Ciesinski, Adele Ratcliff, US Department of Defense; Manufacturing Technology Program, will present a talk on “The U.S. Manufacturing Base for Advanced Electronics - a Case for NextFlex.”
Tolis Voutsas of Sharp Labs of America will cover “The Hybrid Electronics EcoSystem,” followed by Nancy Ferris, Eastman Kodak, whose topic is “Microscale Manufacturing for Printed Electronics: Evolution of Graphics Printing Processes.” Murad Kurwa, Flex International, will close the first Plenary session with a talk on “Manufacturing and Reliability Challenges for the New Generation of Wearable Products.”
The Plenary 2 session begins with a presentation by Steven Willoughby, DuPont, on “A View of the Smart (Electronics) Textiles and Fabrics Situation.” Thibaud Le Séguillon, Heliatek GmbH, will analyze “Organic Solar Films – A Novel and Truly Urban-fit Source of Energy.”
Harry Zervos, IDTechEx Inc., will examine “Flexible and Hybrid Electronics: An Updated Forecast for the Next Decade.” “Building Self-diagnostic Fly-by-feel Vehicles with Stretchable, Flexible Sensors and Electronics Network” is the topic of a talk by Fu-Kuo Chang, Stanford University, Department of Aeronautics and Astronautics that closes the second Plenary session.
“The 2016FLEX opening presentations are especially strong and compelling this year,” Ciesinski said. “Adele Ratcliff, who oversees all of the Defense Department’s manufacturing institutes, will keynote. The institutes encompass 3D printing, lightweight metals and materials, digital manufacturing and design, among other manufacturing topics. FlexTech was awarded a $75M grant to form the Flexible Hybrid Electronics Manufacturing Innovation Institute (now known as NextFlex) last August.
“Flex International (formerly Flextronics) will address the wearables market,” he added. “DuPont explains smart textiles and fibers, and Stanford University closes the keynotes with a visionary presentation on self-diagnostic, fly-by-feel, vehicles with stretchable, flexible sensors.”
During the afternoon on March 1, 2016FLEX breaks up into three concurrent sessions. Session 3 covers Displays & Lighting, with talks by Jerry Kang of IHS, Dr. Mike Banach of FlexEnable, Dr. Michael Cowin of SmartKem Ltd., Dr. Jakob Nilsson of Thin Film Electronics, Dr. Jay Yu, AU Optronics and Dr. Michael Boroson, OLEDWorks LLC.
Session 4, FHE Opportunities includes presentations by Dr. Dan Berrigan, Air Force Research Laboratory; Dr. Janos Veres, PARC, a Xerox Company; Dr. Annjoe Wong-Foy, SRI International; Dr. Tony Sun, Lux Research; Dr. Anirban Basu, SABIC; and Dr. Mangilal Agarwal, Indiana University-Purdue University Indianapolis.
Session 5, Technology & Roadmaps, will feature talks by Bill Bader, iNEMI; Malcolm Thompson, NextFlex; Neil Bolding, MacDermid Autotype; Tom Salmon, SEMI; and Christopher Soles, National Institute of Standards and Technology.
Wednesday, March 2, offers 12 concurrent sessions. The focus of the 12 sessions include FHE Design; PE Tools & Methods; Substrates, Barriers, Encapsulation; FHE Applications; PE In-line Processsing, Patterning Technology, FHE Manufacturing, Interconnect 1, Sensors, FHE Technology, Backplanes and Interconnect 2.
March 2 also features the Women in Flex Breakfast (WFLEX). “The ‘Women in Flex’ breakfast is a superb networking venue for the women professionals in our industry,” Ciesinski noted. “Combined with the Welcoming Reception and Exhibitor Reception, there are plenty of ways to make new friends.”
Session 6, FHE Design, will be led by Dr. Naveen Verma, Princeton University; Doug Hackler, American Semiconductor; Dr. James Sturm, Princeton University; Josue Sanz-Robinson, Princeton University; and Dr. Madhavan Swaminathan, Georgia Institute of Technology.
Session 7 focuses on PE Tools & Methods. Speakers for this session include Dr. Neil Morrison, Applied Materials Web Coating GmbH; Emmett Howard, Flexible Electronics and Display Center of Arizona State University; Dr. Kenneth Church, nScrypt; Don Veri, Meyer Burger; and Tim Potts, Dark Field Technologies, Inc.
Session 8, Substrates, Barriers, Encapsulation, includes talks by Scott Gordon, DuPont Teijin Films; Dr. Hylke B. Akkerman, Holst Centre; Ahmed Salem, TNO/Holst Centre; Dr. Stefano Tominetti, SAES Group; and John Olenick, ENrG International
FHE Applications is the focus of Session 9. Speakers include Dr. Nanshu Lu, University of Texas at Austin; Dr. Gregory Whiting, PARC, a Xerox Company; Dr. Gregory Auner, Visca LLC; Anna Duff, TWD Sports LLC; and Hugh Chung, Arizona State University.
The presenters for Session 10 will offer their insights into PE In-line Processsing. The speakers include Mark Wegner, Northfield Automation Systems, Inc.; Drew Devitt, New Way Air Bearings; John Gaddum, Bosch Rexroth Printing Group; Dr. Jan B. Bouwstra, Fujifilm Manufacturing Europe BV; and Naoki Rikita, MMC RYOTEC by Mitsubishi Materials.
Session 11, Patterning Technology, will feature insights from Corné Rentrop, Holst Centre; Thomas Kolbusch, Coatema Coating Machinery GmbH; Tim Luong, Ceradrop MGI Group; Dr. Rahul Panat, Washington State University; and Dr. Shelby Nelson, Eastman Kodak.
FHE Manufacturing, the subject of Session 12, includes talks by Antti Kemppainen, VTT Technical Research Centre of Finland; Rich Chaney, American Semiconductor; Dr. John Heitzinger, Molex, LLC; Dr. Jayna Sheats, Terecircuits; and Dr. Paul Abel, NovaCentrix.
Session 13’s topic, Interconnect 1, will be analyzed by Dr. Brian Laughlin, DuPont; Dr. Manuela Junghaehnel, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; Dr. Arnold Kell, National Research Council Canada; Dr. Martin Bolduc, INO – National Optics Institute; and Kiran Yadav, SMITA Research Lab, Department of Textile Technology, Indian Institute of Technology Delhi.
Sensors is an important topic, and Session 14 will feature insights from Steve Whalley, MEMS & Sensors Industry Group; Jeffrey Bergman, Acellent Technologies; Dr. Greg Jursich, University of Illinois at Chicago; Dr. Yuzheng Zhang, NextGen Aeronautics; and Dr. Albert Lu, Interlink Electronics.
FHE Technology will be the focus of Session 15, with talks by Nicholas Herrick, Alpha; Eduardo Salcedo, Indiana University - Purdue University Indianapolis; Dr. Val Marinov, Uniqarta, Inc.; Dr. Stephen Bedell, IBM Research; and Dr. Miltos Hatalis, Lehigh University.
Session 16, Backplanes, will be discussed by Nils Greinert, Merck KGaA; Dr. Kai Exner, BASF New Business; Dr. Huaping Li, Atom Nanoelectronics; Dr. Marius Ivan, National Research Council; and Juergen Kreis, AIXTRON SE.
Session 17, Interconnect 2, will be covered by Don Novotny, Intrinsiq Materials; Dr. Stephen Farias, NanoDirect LLC; Dr. Rahul Panat, Washington State University; Dr. Babak Ziaie, Purdue University and Birck Nanotechnology Center; and Ravi Bhatkal, Alpha.
The Industry Dinner and FLEXI Awards Ceremony will be held following the close of the March 2 sessions.
Thursday, March 3 features nine concurrent sessions, with topics ranging from Manufacturing of Wearable Sensors for Human Health and Performance Monitoring, FE Patterning, Dielectrics, PE RF Apps, PV/OPV/Batteries, C based Materials for FE, PE for Energy Harvesting, Modelling & Simulation and Flexible Materials, Components & Applications.
Session 18, Manufacturing of Wearable Sensors for Human Health and Performance Monitoring, features talks by Azar Alizadeh, GE Global Research; Ana Arias, UC Berkeley; Jonathan Rivnay, PARC, a Xerox Company; James Turner, Binghamton University; and Subhanshu Gupta, Washington State University.
Session 19’s topic is FE Patterning. Speakers on FE Patterning include Christopher Merian, MIT; Scott Lauer, Advantech U.S.; Dr. Timothy McComb, nLIGHT; Dr. Thomas Harvey, Centre for Process Innovation Limited; and Raymond C. Wiley, Sun-Tec America, LLC.
Dielectrics, the focus of Session 20, will be covered by Dr. Yu Xia, Polyera; Mike Merwin, FLEXcon; Dr. Mark Schadt, i3 Electronics; Mahdi Haghzadeh, University of Massachusetts Lowell; and Dr. Samuel Graham, Georgia Institute of Technology.
Session 21, PE RF Apps, will offer presentations by Dr. Craig Armiento, University of Massachusetts Lowell; Dr. P Markondeya Raj, Georgia Tech - Packaging Research Center; Dr. Billyde Brown, Georgia Tech Manufacturing Institute; Richard Hecht, Sensor Films Inc.; and Jacob Rhoads, Thin Blue Line Reporting.
PV/OPV/Batteries is the topic of Session 22. Speakers include Dr. Teresa Barnes, NREL; Dr. Yanping Wang, Solarmer Energy, Inc.; Dr. Pradeep Lall, Auburn University; Aminy Ostfeld, University of California, Berkeley; and Dr. Mangilal Agarwal, Indiana University-Purdue University Indianapolis.
Session 23, C based Materials for FE, will be analyzed by Bob Praino, Chasm Technologies; Dr. Anurag Kumar, Purdue University; Bilge Altay, Western Michigan University; H M Dipu Kabir, Department of ECE, The Hong Kong University of Science and Technology; and Dr. Jeongwon Park, SLAC National Accelerator Laboratory, Stanford University.
PE for Energy Harvesting will be featured during Session 24. Presenters for this session include Dr. Paul Wright, UC Berkeley; Dr. Bruce Kahn, Clemson University; Jimmy Hester, Georgia Institute of Technology; Dr. Bernard Kippelen, Georgia Institute of Technology; Dr. Sridhar Kasichainula, Nimbus Materials; and Taoran Le, Georgia Institute of Technology
Modelling & Simulation is the focus of Session 25, with talks being offered by Dr. Jeff Stuart, Lockheed Martin Advanced Technology Laboratory; Dr. Shashi Adiga, Lockheed Martin Advanced Technology Laboratory; Christine Taylor, Georgia Institute of Technology; Dr. Mathew Halls, Schrödinger Inc.; Bao Dong To, National Chung Cheng University; and Dr. Kan Wang, Georgia Institute of Technology.
Session 26, Flexible Materials, Components & Applications, will be covered by Dr. Jennifer Colegrove, Touch Display Research; Dr. Siyuan Ma, Microsoft Corporation; Nesrine Kammoun, University of Stuttgart, Institute for Large Area Microelectronics; Esat Yilmaz, UniPixel, Inc.; Bob Senior, Canatu; and Joey Mead, University of Massachusetts Lowell.
“All signs are strong for the largest attendance ever at the FLEX Conference, which clearly images the rapid development and huge interest in utilizing the form factor for advancing products and creating new and innovative concepts,” Ciesinski concluded.
For more information on 2016FLEX, see FlexTech’s web site at www.flextech.org.
2016FLEX will be held Feb. 29-March 3 in Monterey, CA. With more than 550 industry professionals and more than 120 speakers expected, 2016FLEX should have something for everyone in the field.
Michael Ciesinski, president, FlexTech – a SEMI Strategic Association Partner, said that 500 to 550 registrants is always a successful conference as it provides depth and breadth, but not so large that networking and one-on-one discussions are impeded. He added that pre-registration shows a powerful group of industry players.
“Some leading companies already registered for 2016 FLEX are Amazon/Lab126, Apple, Applied Materials, BASF, Bosch, Dassault Systems, DuPont, Fitbit, GE, Google Life Sciences, Kodak, Microsoft, PPG Industries, Texas Instruments, and United Technologies Research Center. R&D Organizations include Fraunhofer Institute, GE Global Research, Holst Center, ITRI, NREL, SRI International, SLAC, VTT, and Xerox/PARC,” he reported.
“Our diverse audience always brings different perspectives and good energy to the networking events,” he added. “We constantly hear from attendees about the intriguing person they met who came with a vision or concept and wants to create a new product. Attendees never know who is going to approach them at their booth – and they always appreciate the time and space for an in-depth conversation with potential new customers or partners.
Ciesinski noted that 2016FLEX offers some new features, as the integration of silicon semiconductor devices onto flexible substrates enables a whole new class of electronics, now known as flexible hybrid electronics (FHE).
“Maturing and manufacturing FHE technology is the focus of the NextFlex Manufactuing Institute,” he said. “We are excited to introduce sessions on FHE Technology, FHE Design and FHE Applications.
“We are introducing a few new short course topics, including 3D Printing, Textiles as a Platform for Flexible Electronics and Fundamentals of Technology and Manufacturing Readiness Levels,” Ciesinski added. “NextFlex brings a new energy to the event as well. They have member meetings scheduled during and at the end of the week, including some extensive roadmapping sessions on Thursday and Friday.
“The Flex Conference always has a strong emphasis on manufacturing, principally through presentations on tools, materials and processes,” noted Ciesinski. “We have buttressed that this year with sessions on sensors and batteries.”
The conference begins Monday, Feb. 29 with five three-hour Short Courses. The two morning short courses are “Introducing Printed Electronics - All the Basics and More!” and “TRL/MRL Assessment.” The three afternoon short courses are “Flexible Hybrid Electronics,” “Fusion of Fashion and Function: Textiles as a Platform” and “3D Printing on Plastics – Developments & Trends.”
“Technically speaking, the Flex Conference is once again very strong in printed electronics (PE) with sessions on PE Tools and Methods, PE In-Line Processing, PE Patterning, and PE RF Applications,” Ciesinski said. “We will conduct a short course on Printed Electronics, as well as short courses on 3D Printing, Textiles as a Platform for Flexible Electronics, Fundamentals of TRLs and MRLs, and Flexible Hybrid Electronics.”
The full conference begins on Tuesday, March 1. After introductory remarks by Ciesinski, Adele Ratcliff, US Department of Defense; Manufacturing Technology Program, will present a talk on “The U.S. Manufacturing Base for Advanced Electronics - a Case for NextFlex.”
Tolis Voutsas of Sharp Labs of America will cover “The Hybrid Electronics EcoSystem,” followed by Nancy Ferris, Eastman Kodak, whose topic is “Microscale Manufacturing for Printed Electronics: Evolution of Graphics Printing Processes.” Murad Kurwa, Flex International, will close the first Plenary session with a talk on “Manufacturing and Reliability Challenges for the New Generation of Wearable Products.”
The Plenary 2 session begins with a presentation by Steven Willoughby, DuPont, on “A View of the Smart (Electronics) Textiles and Fabrics Situation.” Thibaud Le Séguillon, Heliatek GmbH, will analyze “Organic Solar Films – A Novel and Truly Urban-fit Source of Energy.”
Harry Zervos, IDTechEx Inc., will examine “Flexible and Hybrid Electronics: An Updated Forecast for the Next Decade.” “Building Self-diagnostic Fly-by-feel Vehicles with Stretchable, Flexible Sensors and Electronics Network” is the topic of a talk by Fu-Kuo Chang, Stanford University, Department of Aeronautics and Astronautics that closes the second Plenary session.
“The 2016FLEX opening presentations are especially strong and compelling this year,” Ciesinski said. “Adele Ratcliff, who oversees all of the Defense Department’s manufacturing institutes, will keynote. The institutes encompass 3D printing, lightweight metals and materials, digital manufacturing and design, among other manufacturing topics. FlexTech was awarded a $75M grant to form the Flexible Hybrid Electronics Manufacturing Innovation Institute (now known as NextFlex) last August.
“Flex International (formerly Flextronics) will address the wearables market,” he added. “DuPont explains smart textiles and fibers, and Stanford University closes the keynotes with a visionary presentation on self-diagnostic, fly-by-feel, vehicles with stretchable, flexible sensors.”
During the afternoon on March 1, 2016FLEX breaks up into three concurrent sessions. Session 3 covers Displays & Lighting, with talks by Jerry Kang of IHS, Dr. Mike Banach of FlexEnable, Dr. Michael Cowin of SmartKem Ltd., Dr. Jakob Nilsson of Thin Film Electronics, Dr. Jay Yu, AU Optronics and Dr. Michael Boroson, OLEDWorks LLC.
Session 4, FHE Opportunities includes presentations by Dr. Dan Berrigan, Air Force Research Laboratory; Dr. Janos Veres, PARC, a Xerox Company; Dr. Annjoe Wong-Foy, SRI International; Dr. Tony Sun, Lux Research; Dr. Anirban Basu, SABIC; and Dr. Mangilal Agarwal, Indiana University-Purdue University Indianapolis.
Session 5, Technology & Roadmaps, will feature talks by Bill Bader, iNEMI; Malcolm Thompson, NextFlex; Neil Bolding, MacDermid Autotype; Tom Salmon, SEMI; and Christopher Soles, National Institute of Standards and Technology.
Wednesday, March 2, offers 12 concurrent sessions. The focus of the 12 sessions include FHE Design; PE Tools & Methods; Substrates, Barriers, Encapsulation; FHE Applications; PE In-line Processsing, Patterning Technology, FHE Manufacturing, Interconnect 1, Sensors, FHE Technology, Backplanes and Interconnect 2.
March 2 also features the Women in Flex Breakfast (WFLEX). “The ‘Women in Flex’ breakfast is a superb networking venue for the women professionals in our industry,” Ciesinski noted. “Combined with the Welcoming Reception and Exhibitor Reception, there are plenty of ways to make new friends.”
Session 6, FHE Design, will be led by Dr. Naveen Verma, Princeton University; Doug Hackler, American Semiconductor; Dr. James Sturm, Princeton University; Josue Sanz-Robinson, Princeton University; and Dr. Madhavan Swaminathan, Georgia Institute of Technology.
Session 7 focuses on PE Tools & Methods. Speakers for this session include Dr. Neil Morrison, Applied Materials Web Coating GmbH; Emmett Howard, Flexible Electronics and Display Center of Arizona State University; Dr. Kenneth Church, nScrypt; Don Veri, Meyer Burger; and Tim Potts, Dark Field Technologies, Inc.
Session 8, Substrates, Barriers, Encapsulation, includes talks by Scott Gordon, DuPont Teijin Films; Dr. Hylke B. Akkerman, Holst Centre; Ahmed Salem, TNO/Holst Centre; Dr. Stefano Tominetti, SAES Group; and John Olenick, ENrG International
FHE Applications is the focus of Session 9. Speakers include Dr. Nanshu Lu, University of Texas at Austin; Dr. Gregory Whiting, PARC, a Xerox Company; Dr. Gregory Auner, Visca LLC; Anna Duff, TWD Sports LLC; and Hugh Chung, Arizona State University.
The presenters for Session 10 will offer their insights into PE In-line Processsing. The speakers include Mark Wegner, Northfield Automation Systems, Inc.; Drew Devitt, New Way Air Bearings; John Gaddum, Bosch Rexroth Printing Group; Dr. Jan B. Bouwstra, Fujifilm Manufacturing Europe BV; and Naoki Rikita, MMC RYOTEC by Mitsubishi Materials.
Session 11, Patterning Technology, will feature insights from Corné Rentrop, Holst Centre; Thomas Kolbusch, Coatema Coating Machinery GmbH; Tim Luong, Ceradrop MGI Group; Dr. Rahul Panat, Washington State University; and Dr. Shelby Nelson, Eastman Kodak.
FHE Manufacturing, the subject of Session 12, includes talks by Antti Kemppainen, VTT Technical Research Centre of Finland; Rich Chaney, American Semiconductor; Dr. John Heitzinger, Molex, LLC; Dr. Jayna Sheats, Terecircuits; and Dr. Paul Abel, NovaCentrix.
Session 13’s topic, Interconnect 1, will be analyzed by Dr. Brian Laughlin, DuPont; Dr. Manuela Junghaehnel, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; Dr. Arnold Kell, National Research Council Canada; Dr. Martin Bolduc, INO – National Optics Institute; and Kiran Yadav, SMITA Research Lab, Department of Textile Technology, Indian Institute of Technology Delhi.
Sensors is an important topic, and Session 14 will feature insights from Steve Whalley, MEMS & Sensors Industry Group; Jeffrey Bergman, Acellent Technologies; Dr. Greg Jursich, University of Illinois at Chicago; Dr. Yuzheng Zhang, NextGen Aeronautics; and Dr. Albert Lu, Interlink Electronics.
FHE Technology will be the focus of Session 15, with talks by Nicholas Herrick, Alpha; Eduardo Salcedo, Indiana University - Purdue University Indianapolis; Dr. Val Marinov, Uniqarta, Inc.; Dr. Stephen Bedell, IBM Research; and Dr. Miltos Hatalis, Lehigh University.
Session 16, Backplanes, will be discussed by Nils Greinert, Merck KGaA; Dr. Kai Exner, BASF New Business; Dr. Huaping Li, Atom Nanoelectronics; Dr. Marius Ivan, National Research Council; and Juergen Kreis, AIXTRON SE.
Session 17, Interconnect 2, will be covered by Don Novotny, Intrinsiq Materials; Dr. Stephen Farias, NanoDirect LLC; Dr. Rahul Panat, Washington State University; Dr. Babak Ziaie, Purdue University and Birck Nanotechnology Center; and Ravi Bhatkal, Alpha.
The Industry Dinner and FLEXI Awards Ceremony will be held following the close of the March 2 sessions.
Thursday, March 3 features nine concurrent sessions, with topics ranging from Manufacturing of Wearable Sensors for Human Health and Performance Monitoring, FE Patterning, Dielectrics, PE RF Apps, PV/OPV/Batteries, C based Materials for FE, PE for Energy Harvesting, Modelling & Simulation and Flexible Materials, Components & Applications.
Session 18, Manufacturing of Wearable Sensors for Human Health and Performance Monitoring, features talks by Azar Alizadeh, GE Global Research; Ana Arias, UC Berkeley; Jonathan Rivnay, PARC, a Xerox Company; James Turner, Binghamton University; and Subhanshu Gupta, Washington State University.
Session 19’s topic is FE Patterning. Speakers on FE Patterning include Christopher Merian, MIT; Scott Lauer, Advantech U.S.; Dr. Timothy McComb, nLIGHT; Dr. Thomas Harvey, Centre for Process Innovation Limited; and Raymond C. Wiley, Sun-Tec America, LLC.
Dielectrics, the focus of Session 20, will be covered by Dr. Yu Xia, Polyera; Mike Merwin, FLEXcon; Dr. Mark Schadt, i3 Electronics; Mahdi Haghzadeh, University of Massachusetts Lowell; and Dr. Samuel Graham, Georgia Institute of Technology.
Session 21, PE RF Apps, will offer presentations by Dr. Craig Armiento, University of Massachusetts Lowell; Dr. P Markondeya Raj, Georgia Tech - Packaging Research Center; Dr. Billyde Brown, Georgia Tech Manufacturing Institute; Richard Hecht, Sensor Films Inc.; and Jacob Rhoads, Thin Blue Line Reporting.
PV/OPV/Batteries is the topic of Session 22. Speakers include Dr. Teresa Barnes, NREL; Dr. Yanping Wang, Solarmer Energy, Inc.; Dr. Pradeep Lall, Auburn University; Aminy Ostfeld, University of California, Berkeley; and Dr. Mangilal Agarwal, Indiana University-Purdue University Indianapolis.
Session 23, C based Materials for FE, will be analyzed by Bob Praino, Chasm Technologies; Dr. Anurag Kumar, Purdue University; Bilge Altay, Western Michigan University; H M Dipu Kabir, Department of ECE, The Hong Kong University of Science and Technology; and Dr. Jeongwon Park, SLAC National Accelerator Laboratory, Stanford University.
PE for Energy Harvesting will be featured during Session 24. Presenters for this session include Dr. Paul Wright, UC Berkeley; Dr. Bruce Kahn, Clemson University; Jimmy Hester, Georgia Institute of Technology; Dr. Bernard Kippelen, Georgia Institute of Technology; Dr. Sridhar Kasichainula, Nimbus Materials; and Taoran Le, Georgia Institute of Technology
Modelling & Simulation is the focus of Session 25, with talks being offered by Dr. Jeff Stuart, Lockheed Martin Advanced Technology Laboratory; Dr. Shashi Adiga, Lockheed Martin Advanced Technology Laboratory; Christine Taylor, Georgia Institute of Technology; Dr. Mathew Halls, Schrödinger Inc.; Bao Dong To, National Chung Cheng University; and Dr. Kan Wang, Georgia Institute of Technology.
Session 26, Flexible Materials, Components & Applications, will be covered by Dr. Jennifer Colegrove, Touch Display Research; Dr. Siyuan Ma, Microsoft Corporation; Nesrine Kammoun, University of Stuttgart, Institute for Large Area Microelectronics; Esat Yilmaz, UniPixel, Inc.; Bob Senior, Canatu; and Joey Mead, University of Massachusetts Lowell.
“All signs are strong for the largest attendance ever at the FLEX Conference, which clearly images the rapid development and huge interest in utilizing the form factor for advancing products and creating new and innovative concepts,” Ciesinski concluded.
For more information on 2016FLEX, see FlexTech’s web site at www.flextech.org.
