David Savastano, Editor06.07.17
Opportunities for flexible hybrid electronics are emerging rapidly, and 2017FLEX will be highlighting the newest technologies in this field, as well as the significant advances being made by NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute.
Organized by FlexTech, a SEMI Strategic Association Partner, 2017FLEX will run from June 19-22 in Monterey, CA. Mike Ciesinski, president, FlexTech, a SEMI Strategic Association Partner, said that based on technical paper submissions and pre-registration figures, 2017FLEX will be its strongest event in its 16-year history.
“More people are now pre-registered for FLEX than attended in total just five years ago,” Ciesinski noted. “The Exhibition Hall is sold out and will feature exciting product demos, equipment and materials. Consequently, we expect 600+ people to gather at the Hyatt Regency Monterey – from June 19-22 – for the best conference on flexible hybrid electronics (FHE). The 2017FLEX exhibition hall brings together in one place the companies making the biggest impact on FHE.”
Ciesinski said that 2016FLEX was the first public opportunity to learn more about NextFlex, adding that this year, with NextFlex in operation, there is even more information to share on projects underway and the recent announcement of Project Call 3.
“Many of NextFlex’s meetings are open only to members, but on Thursday afternoon, they will be holding an open collaboration session for anyone interested, indicative of our belief that teams can more quickly move the development needle,” he added. “This event will take place right after the technical conference at the Hyatt Regency Monterey.”
With speakers from industry leaders such as GE, Lockheed Martin, Panasonic, Applied Materials, Flex, PARC, a Xerox Company and more, as well as talks by US Army and Air Force officials, there are plenty of opportunities to learn about the latest news in the field.
Ciesinski noted that the opening keynote sessions will be a highlight, as the speakers will address technology advancements and challenges, market size and scope, and explain some new areas where FHE is having impact.
“Flexible displays is one area that is clearly gaining traction and we have a strong program this year,” Ciesinski observed. “Brian Sheih from Applied Materials will provide the opening keynote on flexible displays, followed by several technical sessions to bring into focus what is becoming available for the next generation of smart phones, tablets/phablets, signage, and other communication devices in form factors new to the market. E Ink, a FLEX conference sponsor, will supplement this information with its own presentation, as well as a compelling exhibit.
“Flex, the global EMS provider, and NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, will combine to explain the challenges and solutions for manufacturing flexible and stretchable electronics,” Ciesinski reported. “Some of the issues discussed will include water ingress problems, flexibility/stretchability challenges, interconnection challenges, and the lack of acceptable standards for reliability testing.”
Ciesinski observed noted that promising emerging manufacturing technologies will also be discussed. “Stan Farnsworth of NovaCentrix, a FLEX conference sponsor, will reveal the OE-A Roadmap 2017, which gives an outlook on organic and printed electronics developments and prospects,” he said.
eHealth is a growing market where wireless sensor networks are providing new opportunities for telemedicine, auto-diagnosis and follow-up treatments.
“The new IoT platforms are integrating sensors to monitor and control the most important body parameters in small and portable devices,” said Ciesinski. “Libelium, of Zaragoza, Spain will show how these new achievements mean an improvement for more than two billion people that cannot access a healthcare system. Somewhat related is The Co-Creation Partnership - most famous for its Internet of Tomato project - offering 10 starting points for the development of flexible/hybrid sensors for agriculture and food.”
The Gartner Group, leaders in market research, will also share its view of when flexible electronics will reach critical mass.
“Materials have progressed significantly over the past five years, as have manufacturing techniques, giving rise to increased expectations,” Ciesinski observed. “The growth of the IoT is helping to create some of those increased expectations, while small flexible power sources and sensors can help to drive compact or unique form factors for electronic devices.”
Conference Schedule
2017FLEX starts on Monday, June 19, with five three-hour Short Courses:
• Printing, Placement and Packaging of Flexible Hybrid Electronics – Mark Poliks, Binghamton University and James J. Watkins, University of Massachusetts, Amherst.
• Challenges and Solutions for Flexible Sensor Systems Integration – Stephen Whalley, Strategic World Ventures; Frank Shemansky, MSIG I SEMI; Janos Veres, PARC; and Joseph Stetter, SPEC Sensors.
• 3D Printing and Additive Manufacturing – Denis Cormier, Rochester Institute of Technology; Mike Idacavage, Colorado Photopolymer Solutions; and Bruce E. Kahn, Rochester Institute of Technology.
• Energy: Harvesting, Storage and Management for Flexible Systems in the IOT – James W. Evans, University of California, Berkeley; Brian Zahnstecher, PowerRox LLC; Michail Kiziroglou, ATEI Thessaloniki; and Christine Ho, Imprint Energy Inc.
• Reliability Assessment Protocols for Flexible Hybrid Electronics - A Course Based on Experiments and Simulations – Suresh K. Sitaraman, Georgia Institute of Technology.
On June 20, the 2017FLEX Conference opens with two Plenary Sessions, followed by thre concurrent sessions. The first Plenary Session features an introduction by Keith Rollins of DuPont Teijin Films and welcoming remarks by SEMI’s Ajit Manocha.
The first keynote, “Technology Inflections in the Display Industry, will be presented by Brian Shieh of Applied Materials. Flex’s Anwar Mohammed and NextFlex’s Jason Marsh will follow with “Flexible and Stretchable Hybrid Electronics Manufacturing for Wearables: Challenges and Solutions.”
David Wiens of Mentor, a Siemens Business, will cover “Optimizing the Design Process for Flexible Hybrids,”and the 2017FLEX will host the FLEXI Awards Ceremony.
The second Plenary session will start with “eHealth new horizons with the Internet of Things,” presented by David Bordonada of Libelium. Francis Gouillart of The Experience Co-Creation Partnership (ECCP) will discuss “Ten Challenges for the Flex/Hybrid Industry in the Ag-Food Vertical.”
Stan Farnsworth of OE-A and NovaCentrix will analyze “Technology Roadmap: Trends and Needs in Printed and Flexible Electronics,” and Dean Freeman of Gartner will close the Plenary session with “When Flexible Electronics Reach Critical Mass.”
2017FLEX then breaks into three concurrent sessions, covering Flexible Displays, FPE Technologies and FHE Manufacturing Methods I. Session 3, Flexible Displays, will feature talks by Michael McCreary of E Ink; Eric Virey of Yole Développement; Mike Banach of FlexEnable; Pavel Kudlacek of Holst Centre; and Michael Cowin of SmartKem.
FPE Technologies is the focus of Session 4, with talks scheduled by Mani Thothadri, Applied Materials; Paul Brookes, EMD Performance Materials; Joseph Chang, Nanyang Technological University Singapore; Thomas Kolbusch, Coatema Coating Machinery GmbH; and Emmett Howard, Flexible Electronics and Display Center of Arizona State University.
Session 5 will cover FHE Manufacturing Methods I. Presented for this segment include Benjamin Leever of the Air Force Research Laboratory, Peter Hessney of Sensor Films, Val Marinov of Uniqarta, Inc., Tak Fukushima of University of California, Los Angeles, and Richard Chaney of American Semiconductor.
The June 21 schedule features 12 talks during four concurrent sessions. Session 6, Standards & Reliability, will be covered by Neil Bolding of MacDermid Enthone Industrial Solutions, Kei Hyodo of Konica Minolta, Douglas Hackler of American Semiconductor, and Naotsugu Ando from Yuasa System.
Session 7 will focus on FPE Manufacturing Facilities. Presenters includeMiguel Carrasco-Orozco, Cambridge Display Technology; Harri Kopola, VTT Technical Research Centre of Finland; Marcel Grooten, DoMicro BV; and Micael Charbonneau, CEA-LITEN.
Session 8, FHE Manufacturing Methods II, will have talks by Choong Hoon Yi of UBI Research; Robert Street of PARC, a Xerox Company; Scott Goodwin of Micross Advanced Interconnect Technology; and Rob Irwin of Molex.
Conductors I is the topic of Session 9. Presenters will include Milan Saalmink of TNO/Holst Centre; Manuela Junghähnel from the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; Michael Hoffmann, also of Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; and Liang Liu of Binghamton University.
Session 10, FPE Applications, will feature Guillaume Chansin of IDTechEx, Shu-Hao Chang of AU Optronics, Kent Displays’ Erica Montbach and Jeffrey Morse of the University of Massachusetts, Amherst.
FHE Applications I is the topic of Session 11. Speakers in this session include GE’s Azar Alizadeh; Albert Lu of Interlink Electronics; Raymond C. Wiley from Sun-Tec America; and Richard Ellinger, American Semiconductor, Inc.
Session 12 will feature the topic of Conductors II. Talks will be given by Michael Carmody of Intrinsiq Materials, Henrik Hemmen of CondAlign, Scott Trevino from PalPilot International and Ning Xia of Georgia Institute of Technology.
Session 13, Substrates, will be led by John Olenick of ENrG, Tomoaki Sawada of Panasonic Automotive and Industrial Systems; Tolis Voutsas of Ares Materials and Shintaro Ozaki of Rikentechnos.
FHE Applications II is the topic for Session 14, with talks slated from Soumya Krishnamoorthy of Thin Film Electronics; Austin Shearin of Brewer Science; Abhilash Iyer of Saape Designs; and James Hayward of IDTechEx.
Inline Inspection is the topic of Session 15, with talks scheduled by Bryan Barney of NVision Instruments, Tim Potts of Dark Field Technologies, Erik Novak of 4D Technology, Juha Saily of FocalSpec, and Min Yang of Bruker Nano Surfaces.
Session 16, Encapsulation & Coating, will be discussed by Pavel Kudlacek of Holst Centre, John Fahlteich of Franhofer, Chris Stoessel of Eastman Chemical, Edward Clerkx of Meyer Burger (Netherlands) B.V. and Chris Orilall of Sartomer Americas.
Power Technology is the focus of Session 17. Presenters will include Brian Berland of ITN Energy Systems; Mehmet Ozturk of NC State University & ASSIST Engineering Research Center; Alla Zamarayeva of University of California Berkeley; In Gyoo Kim of ETRI; and Jim Manning of Custom Electronics.
2017FLEX concludes on June 22 with nine sessions. Session 18, Printing Technology, will be covered by Art Dobie of Chromaline, Dongwoo Kang of the Korea Institute of Machinery & Materials, Ryan Kohlmeyer from the Air Force Research Laboratory, Reza Mahboubfarof FH Aachen University of Applied Sciences and John Bergk, Carpe Diem Technologies, Inc.
3D Printing is the focus of Session 19. Prsenters include Dan Berrigan of the Air Force Research Laboratory; Optomec’s Matthew Schrandt; James Zunino of US Army ARDEC; Dave Keicher of Sandia National Laboratories and Jesse Tice of Northrop Grumman.
Sensors are the topic of Session 20, led by talks by Charles Woychik of i3 Electronics, Inc., Albert van Breemen of Holst Centre, Tse Nga Ng from the University of California San Diego, Ana Claudia Arias of the University of California Berkeley and Princeton University’s James Sturm.
Session 21 is Novel Conductor and Semiconductor Materials, with speakers including Bob Praino of Chasm Technologies, Tom Fedolak of Graphenea, Doug Freitag from The Coretec Group, Jeongwon Park of the University of Ottawa and Bruce Kahn of Rochester Institute of Technology on hand to deliver their expertise.
Session 22 will cover the subject of Direct Write. Talks will be given by Alan Shen of the United Technologies Research Center, Yongjin Kim of the Korea Institute of Machinery and Materials (KIMM), Meyer Burger’s Wouter Brok, Raj Bhakta of North Carolina State University, ASSIST Research Center and Ta-Ya Chu from the National Research Council Canada.
Session 23, RF Technology, will feature talks by Jesse Cole of Molex, Jesse Tice of NG Next, Northrop Grumman, Syed Abdullah Nauroze of Georgia Institute of Technology, Hasan Shahariarof North Carolina State University and Yunsong Xie of Argonne National Laboratory.
Military & Security is the topic of Session 24. This segment will include Lockheed Martin’s Jon Nichols; Shiv Joshi of NextGen Aeronautics; Giuseppe Di Benedetto from the US Army ARDEC; Claire Lepont of the University of Massachusetts, Lowell; and Jeremy Ward of the Air Force Research Laboratory.
Session 25 will feature Emeging Capabilities, with presentations by Ahmed Busnaina of Nano OPS, Inc., Austin Shearin of Brewer Science, Devin MacKenzie of the University of Washington, Kwan Hyun Cho of the Korea Institute of Industrial Technology (KITECH) and Ara Parsekian of Georgia Institute of Technology.
The conference closes with Session 26, Biosensors & The Environment Around Us, with talks by Jim Turner of Binghamton University, Sundaresan Jayaraman of Georgia Institute of Technology, William Beckenbaugh of Peratech and Robert Norwood of University of Arizona.
In terms of new features, the show has multiple new points of interaction with, for example, the Technology Demonstration and Showcase Lounge in the middle of the floor, where visitors will find the FLEX Talks, its version of Author Interviews, short and interactive sessions with speakers to touch and feel their demos and products.
Ciesinski said that the increase in attendance shows the increasing interest in how FHE can become part of our daily lives.
“This interest clearly illustrates that the potential for flexibility in electronics products is a dynamic and enabling development, and designers and manufacturers are embracing the opportunity to think differently in their product design and function,” he added. “We believe that 2017FLEX gives those OEMs and applications, materials and process engineers the information and connections they need to understand the advancements and how they can exploit new technology in their products.”
For more information on 2017FLEX, check out the web at www.2017FLEX.com.
Organized by FlexTech, a SEMI Strategic Association Partner, 2017FLEX will run from June 19-22 in Monterey, CA. Mike Ciesinski, president, FlexTech, a SEMI Strategic Association Partner, said that based on technical paper submissions and pre-registration figures, 2017FLEX will be its strongest event in its 16-year history.
“More people are now pre-registered for FLEX than attended in total just five years ago,” Ciesinski noted. “The Exhibition Hall is sold out and will feature exciting product demos, equipment and materials. Consequently, we expect 600+ people to gather at the Hyatt Regency Monterey – from June 19-22 – for the best conference on flexible hybrid electronics (FHE). The 2017FLEX exhibition hall brings together in one place the companies making the biggest impact on FHE.”
Ciesinski said that 2016FLEX was the first public opportunity to learn more about NextFlex, adding that this year, with NextFlex in operation, there is even more information to share on projects underway and the recent announcement of Project Call 3.
“Many of NextFlex’s meetings are open only to members, but on Thursday afternoon, they will be holding an open collaboration session for anyone interested, indicative of our belief that teams can more quickly move the development needle,” he added. “This event will take place right after the technical conference at the Hyatt Regency Monterey.”
With speakers from industry leaders such as GE, Lockheed Martin, Panasonic, Applied Materials, Flex, PARC, a Xerox Company and more, as well as talks by US Army and Air Force officials, there are plenty of opportunities to learn about the latest news in the field.
Ciesinski noted that the opening keynote sessions will be a highlight, as the speakers will address technology advancements and challenges, market size and scope, and explain some new areas where FHE is having impact.
“Flexible displays is one area that is clearly gaining traction and we have a strong program this year,” Ciesinski observed. “Brian Sheih from Applied Materials will provide the opening keynote on flexible displays, followed by several technical sessions to bring into focus what is becoming available for the next generation of smart phones, tablets/phablets, signage, and other communication devices in form factors new to the market. E Ink, a FLEX conference sponsor, will supplement this information with its own presentation, as well as a compelling exhibit.
“Flex, the global EMS provider, and NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, will combine to explain the challenges and solutions for manufacturing flexible and stretchable electronics,” Ciesinski reported. “Some of the issues discussed will include water ingress problems, flexibility/stretchability challenges, interconnection challenges, and the lack of acceptable standards for reliability testing.”
Ciesinski observed noted that promising emerging manufacturing technologies will also be discussed. “Stan Farnsworth of NovaCentrix, a FLEX conference sponsor, will reveal the OE-A Roadmap 2017, which gives an outlook on organic and printed electronics developments and prospects,” he said.
eHealth is a growing market where wireless sensor networks are providing new opportunities for telemedicine, auto-diagnosis and follow-up treatments.
“The new IoT platforms are integrating sensors to monitor and control the most important body parameters in small and portable devices,” said Ciesinski. “Libelium, of Zaragoza, Spain will show how these new achievements mean an improvement for more than two billion people that cannot access a healthcare system. Somewhat related is The Co-Creation Partnership - most famous for its Internet of Tomato project - offering 10 starting points for the development of flexible/hybrid sensors for agriculture and food.”
The Gartner Group, leaders in market research, will also share its view of when flexible electronics will reach critical mass.
“Materials have progressed significantly over the past five years, as have manufacturing techniques, giving rise to increased expectations,” Ciesinski observed. “The growth of the IoT is helping to create some of those increased expectations, while small flexible power sources and sensors can help to drive compact or unique form factors for electronic devices.”
Conference Schedule
2017FLEX starts on Monday, June 19, with five three-hour Short Courses:
• Printing, Placement and Packaging of Flexible Hybrid Electronics – Mark Poliks, Binghamton University and James J. Watkins, University of Massachusetts, Amherst.
• Challenges and Solutions for Flexible Sensor Systems Integration – Stephen Whalley, Strategic World Ventures; Frank Shemansky, MSIG I SEMI; Janos Veres, PARC; and Joseph Stetter, SPEC Sensors.
• 3D Printing and Additive Manufacturing – Denis Cormier, Rochester Institute of Technology; Mike Idacavage, Colorado Photopolymer Solutions; and Bruce E. Kahn, Rochester Institute of Technology.
• Energy: Harvesting, Storage and Management for Flexible Systems in the IOT – James W. Evans, University of California, Berkeley; Brian Zahnstecher, PowerRox LLC; Michail Kiziroglou, ATEI Thessaloniki; and Christine Ho, Imprint Energy Inc.
• Reliability Assessment Protocols for Flexible Hybrid Electronics - A Course Based on Experiments and Simulations – Suresh K. Sitaraman, Georgia Institute of Technology.
On June 20, the 2017FLEX Conference opens with two Plenary Sessions, followed by thre concurrent sessions. The first Plenary Session features an introduction by Keith Rollins of DuPont Teijin Films and welcoming remarks by SEMI’s Ajit Manocha.
The first keynote, “Technology Inflections in the Display Industry, will be presented by Brian Shieh of Applied Materials. Flex’s Anwar Mohammed and NextFlex’s Jason Marsh will follow with “Flexible and Stretchable Hybrid Electronics Manufacturing for Wearables: Challenges and Solutions.”
David Wiens of Mentor, a Siemens Business, will cover “Optimizing the Design Process for Flexible Hybrids,”and the 2017FLEX will host the FLEXI Awards Ceremony.
The second Plenary session will start with “eHealth new horizons with the Internet of Things,” presented by David Bordonada of Libelium. Francis Gouillart of The Experience Co-Creation Partnership (ECCP) will discuss “Ten Challenges for the Flex/Hybrid Industry in the Ag-Food Vertical.”
Stan Farnsworth of OE-A and NovaCentrix will analyze “Technology Roadmap: Trends and Needs in Printed and Flexible Electronics,” and Dean Freeman of Gartner will close the Plenary session with “When Flexible Electronics Reach Critical Mass.”
2017FLEX then breaks into three concurrent sessions, covering Flexible Displays, FPE Technologies and FHE Manufacturing Methods I. Session 3, Flexible Displays, will feature talks by Michael McCreary of E Ink; Eric Virey of Yole Développement; Mike Banach of FlexEnable; Pavel Kudlacek of Holst Centre; and Michael Cowin of SmartKem.
FPE Technologies is the focus of Session 4, with talks scheduled by Mani Thothadri, Applied Materials; Paul Brookes, EMD Performance Materials; Joseph Chang, Nanyang Technological University Singapore; Thomas Kolbusch, Coatema Coating Machinery GmbH; and Emmett Howard, Flexible Electronics and Display Center of Arizona State University.
Session 5 will cover FHE Manufacturing Methods I. Presented for this segment include Benjamin Leever of the Air Force Research Laboratory, Peter Hessney of Sensor Films, Val Marinov of Uniqarta, Inc., Tak Fukushima of University of California, Los Angeles, and Richard Chaney of American Semiconductor.
The June 21 schedule features 12 talks during four concurrent sessions. Session 6, Standards & Reliability, will be covered by Neil Bolding of MacDermid Enthone Industrial Solutions, Kei Hyodo of Konica Minolta, Douglas Hackler of American Semiconductor, and Naotsugu Ando from Yuasa System.
Session 7 will focus on FPE Manufacturing Facilities. Presenters includeMiguel Carrasco-Orozco, Cambridge Display Technology; Harri Kopola, VTT Technical Research Centre of Finland; Marcel Grooten, DoMicro BV; and Micael Charbonneau, CEA-LITEN.
Session 8, FHE Manufacturing Methods II, will have talks by Choong Hoon Yi of UBI Research; Robert Street of PARC, a Xerox Company; Scott Goodwin of Micross Advanced Interconnect Technology; and Rob Irwin of Molex.
Conductors I is the topic of Session 9. Presenters will include Milan Saalmink of TNO/Holst Centre; Manuela Junghähnel from the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; Michael Hoffmann, also of Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; and Liang Liu of Binghamton University.
Session 10, FPE Applications, will feature Guillaume Chansin of IDTechEx, Shu-Hao Chang of AU Optronics, Kent Displays’ Erica Montbach and Jeffrey Morse of the University of Massachusetts, Amherst.
FHE Applications I is the topic of Session 11. Speakers in this session include GE’s Azar Alizadeh; Albert Lu of Interlink Electronics; Raymond C. Wiley from Sun-Tec America; and Richard Ellinger, American Semiconductor, Inc.
Session 12 will feature the topic of Conductors II. Talks will be given by Michael Carmody of Intrinsiq Materials, Henrik Hemmen of CondAlign, Scott Trevino from PalPilot International and Ning Xia of Georgia Institute of Technology.
Session 13, Substrates, will be led by John Olenick of ENrG, Tomoaki Sawada of Panasonic Automotive and Industrial Systems; Tolis Voutsas of Ares Materials and Shintaro Ozaki of Rikentechnos.
FHE Applications II is the topic for Session 14, with talks slated from Soumya Krishnamoorthy of Thin Film Electronics; Austin Shearin of Brewer Science; Abhilash Iyer of Saape Designs; and James Hayward of IDTechEx.
Inline Inspection is the topic of Session 15, with talks scheduled by Bryan Barney of NVision Instruments, Tim Potts of Dark Field Technologies, Erik Novak of 4D Technology, Juha Saily of FocalSpec, and Min Yang of Bruker Nano Surfaces.
Session 16, Encapsulation & Coating, will be discussed by Pavel Kudlacek of Holst Centre, John Fahlteich of Franhofer, Chris Stoessel of Eastman Chemical, Edward Clerkx of Meyer Burger (Netherlands) B.V. and Chris Orilall of Sartomer Americas.
Power Technology is the focus of Session 17. Presenters will include Brian Berland of ITN Energy Systems; Mehmet Ozturk of NC State University & ASSIST Engineering Research Center; Alla Zamarayeva of University of California Berkeley; In Gyoo Kim of ETRI; and Jim Manning of Custom Electronics.
2017FLEX concludes on June 22 with nine sessions. Session 18, Printing Technology, will be covered by Art Dobie of Chromaline, Dongwoo Kang of the Korea Institute of Machinery & Materials, Ryan Kohlmeyer from the Air Force Research Laboratory, Reza Mahboubfarof FH Aachen University of Applied Sciences and John Bergk, Carpe Diem Technologies, Inc.
3D Printing is the focus of Session 19. Prsenters include Dan Berrigan of the Air Force Research Laboratory; Optomec’s Matthew Schrandt; James Zunino of US Army ARDEC; Dave Keicher of Sandia National Laboratories and Jesse Tice of Northrop Grumman.
Sensors are the topic of Session 20, led by talks by Charles Woychik of i3 Electronics, Inc., Albert van Breemen of Holst Centre, Tse Nga Ng from the University of California San Diego, Ana Claudia Arias of the University of California Berkeley and Princeton University’s James Sturm.
Session 21 is Novel Conductor and Semiconductor Materials, with speakers including Bob Praino of Chasm Technologies, Tom Fedolak of Graphenea, Doug Freitag from The Coretec Group, Jeongwon Park of the University of Ottawa and Bruce Kahn of Rochester Institute of Technology on hand to deliver their expertise.
Session 22 will cover the subject of Direct Write. Talks will be given by Alan Shen of the United Technologies Research Center, Yongjin Kim of the Korea Institute of Machinery and Materials (KIMM), Meyer Burger’s Wouter Brok, Raj Bhakta of North Carolina State University, ASSIST Research Center and Ta-Ya Chu from the National Research Council Canada.
Session 23, RF Technology, will feature talks by Jesse Cole of Molex, Jesse Tice of NG Next, Northrop Grumman, Syed Abdullah Nauroze of Georgia Institute of Technology, Hasan Shahariarof North Carolina State University and Yunsong Xie of Argonne National Laboratory.
Military & Security is the topic of Session 24. This segment will include Lockheed Martin’s Jon Nichols; Shiv Joshi of NextGen Aeronautics; Giuseppe Di Benedetto from the US Army ARDEC; Claire Lepont of the University of Massachusetts, Lowell; and Jeremy Ward of the Air Force Research Laboratory.
Session 25 will feature Emeging Capabilities, with presentations by Ahmed Busnaina of Nano OPS, Inc., Austin Shearin of Brewer Science, Devin MacKenzie of the University of Washington, Kwan Hyun Cho of the Korea Institute of Industrial Technology (KITECH) and Ara Parsekian of Georgia Institute of Technology.
The conference closes with Session 26, Biosensors & The Environment Around Us, with talks by Jim Turner of Binghamton University, Sundaresan Jayaraman of Georgia Institute of Technology, William Beckenbaugh of Peratech and Robert Norwood of University of Arizona.
In terms of new features, the show has multiple new points of interaction with, for example, the Technology Demonstration and Showcase Lounge in the middle of the floor, where visitors will find the FLEX Talks, its version of Author Interviews, short and interactive sessions with speakers to touch and feel their demos and products.
Ciesinski said that the increase in attendance shows the increasing interest in how FHE can become part of our daily lives.
“This interest clearly illustrates that the potential for flexibility in electronics products is a dynamic and enabling development, and designers and manufacturers are embracing the opportunity to think differently in their product design and function,” he added. “We believe that 2017FLEX gives those OEMs and applications, materials and process engineers the information and connections they need to understand the advancements and how they can exploit new technology in their products.”
For more information on 2017FLEX, check out the web at www.2017FLEX.com.
