FHE devices combine printed conductors with bare die integration techniques on silicon to yield functional devices.
Jason Marsh, Director of Technology, NextFlex12.06.17
With the long talked about NextFlex Labs and Technology Hub coming online in the second half of 2017, the first question is, what will we find there? At the basic level, FHE devices combine printed conductors with bare die integration techniques on silicon to yield functional devices. Therefore, it reasons that both printing and bare die integration process tools will be centrally featured at the NextFlex Technology Hub.
Mike Mastropietro, senior engineering manager of Printing and Additive Processing at NextFlex, said that when complete, the Technology Hub will have more types of functional printing tools collocated together than in any other facility in the world. The tools that currently see a great deal of use include the semi-automated HMI screen printer (left), the Optomec 5 Axis aerosol jet and the Meyer Burger IP410 inkjet tools. In addition, we have a Fuji Dimatix printer and Nordson dispensing tools that can deposit functional materials, dielectrics, encapsulants and a
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