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IDTechEx Show! USA 2019 Looks Ahead at Printed and Flexible Electronics

Smart packaging, in-mold electronics, flexible displays and more are among the topics for today’s sessions.

IDTechEx Show! USA 2019 Looks Ahead at Printed and Flexible Electronics

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David Savastano, Editor11.20.19

Led by speakers from corporate giants including AB-inbev, United Technologies Research Center, Microsoft and Intel, IDTechEx Show! USA 2019 in Santa Clara, CA will hold its closing session today in Santa Clara, CA with an eye on end users as well as the latest developments in the industry.

Organized by IDTechEx, PE USA 2019 features seven co-located concurrent programs during its eight tracks, including two sessions on Printed Electronics as well as single sessions on Sensors, Wearables, Internet of Things, Graphene, Electric Vehicles and Energy Storage.

Printed Electronics is the focus of two tracks. The first track opens with Smart Packaging and Integrated Systems, with presenters from United Technologies Research Center, AB-inbev, Inuru GmbH, SES RFID Solutions GmbH and US ARMY RDECOM ARDEC (US).

3D Printed Electronics and In-Mold Electronics is up next, and will be covered by

Continue reading this story and get 24/7 access to The Independent Global Source for the Flexible and Printed Electronics Industry. for FREE

Stay ahead of the fast growing field of flexible and printed electronics, an emerging industry that promises to revolutionize the methods in which electronic components and systems are manufactured. Flexible and printed electronics covers smart packaging and labels, sensors and wearables, solar cells, displays and lighting, batteries, medical devices, military equipment, and much more.

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