Conference featured more than 50 exhibits, 100 presentations in 26 sessions.
The 2017FLEX exhibition featured “FLEXTALK,” a dedicated area to innovations and presentations by the authors of 16 papers from the technical sessions. Demo units were showcased in the lounge area prior and after the talks.
Jason Marsh, director of technology at NextFlex and Anwar Mohammed of Flex Intl., take questions from the audience after their presentation. Keith Rollins, DuPont Teijin Films, stands by as the session moderator.
Ajit Manocha, CEO of SEMI, shares his recollections of early semiconductor industry days with attendees at 2017FLEX General Session.
Dimitur Bentchev and Sondre Brandso discuss Carpe Diem Technologies’ products with Stan Farnsworth of NovaCentrix.
Mike Ciesinski and Daren Heidgerkn award Vinit Singh of NuCurrent, Inc., with the award for Product Innovation for their development of efficient antennas for wireless power transfer.
Doyle Edwards of Brewer Science accepts the Technology Leadership award for their outstanding company culture that fosters creativity and innovation.
Dalen Keys accepts the Industry Leadership Award in recognition of the technical acumen and business development work in the advancements in FHE.
Mike Ciesinski and Daren Heidgerkn award Yashuhisa Okazaki, of Yuasa Systems with the award for Product Innovation for their tension and friction free test jig.
Jeff Morris explains the FHE research taking place at University of Massachusetts Amherst.
More than 625 attendees enjoyed 2017FLEX. Here, many of them attend the General Session before breaking into 24 technical sessions over 2.5 days.
Attendees listen intently at the 2017FLEX general session.