Dr. Malcolm G. Keif, professor and graduate coordinator, Printed Electronics & Functional Imaging for the Cal Poly State University’s Graphic Communication Department, said that the field is growing, with the news of the U.S. Department of Defense’s $75 million grant for FlexTech Alliance’s Manufacturing Innovation Institute for Flexible Hybrid Electronics (FHE MII) one piece of good news.
“I believe the new FHE MII will spur even more growth,” said Keif. “Integration is the next big area of research, how we integrate convention and thinned IC with flex printed substrates and components. It seems like a number of people are doing work with sensors too. Flexible sensors for wearables will remain hot for awhile.”
“My university initiated
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