Closing Day of LOPEC 2019 Features New Technologies and Opportunities

By David Savastano, Editor | 03.20.19

Technical Conference includes session on wearables, smart textiles, displays, HMI, functional materials and more.

LOPEC 2019, organized by the OE-A and held at Messe Munich, concludes today with its Technical and Scientific Conferences, and a record number of exhibitors that have spilled out onto the Messe foyer.
New technologies will be again be showcased, with Technical Conference sessions on wearables, smart textiles, displays, HMI, functional materials and more. The Scientific Conference sessions will feature six segments, including ones on flexible and printed electronics, processes and three sessions on devices.
The March 21 Plenary Session includes:
• LOPEC general chair Wolfgang Mildner, founder and CEO of MSW.
• Prof. Korina Molla, international project manager, AITEX – “Worth Partnership Project: An Opportunity to Bring Your Ideas to the Market.”
• Dennis Hahn, project leader, Airbus –  “Applications for Printed Electronics in the Aviation Industry.”
• Dr. Jyrki Schroderus, director, Polar Electro – “Evolution and Latest Developments of Biosensing Wearables in Sports.”
• Prof. Steve Beeby, University of Southampton – “Printed and Flexible Electronics for Electronic Textile Applications.”
Thera are seven Technical Conference sessions on Day 3. Dr. Edzer Huitema of Apple Inc. will lead the session on Flexible Displays, featuring talks by Dr. Michael McCreary, chief innovation officer, E Ink Corporation and Dr. Mark James, R&D director, head of organic electronics,  Merck Chemicals Ltd.
The Human-Machine-Interfaces (HMI) session will be chaired by Arne Casteleyn, sales director and business development manager, Quad-Industries. This session will feature Novares innovation director Christophe Cazes, Peratech CTO Dr. Tolis Voutsas and Quad Industries R&D director Dr. Wim Christiaens. 
Dr. Jerome Gavillet, CEA-Liten’s printed electronic program director, will lead the session on Publicly Funded Projects. This segment will include Dr. Rainer Günzler, head business development, Hahn-Schickard; Dr. (Sam) Yun Fu Chan, senior scientist, Centre for Process Innovation Ltd.; and Dr. Russel Torah, senior research fellow,  University of Southampton.
Dr. John Fahlteich, research group leader, Fraunhofer FEP Technical Conference, will lead the session on Substrates and Encapsulation. Talks in the session will be made by Valentijn von Morgen of DuPont Teijin Films;  Noel Clarke, strategic business development, DELO Industrial Adhesives; Dr. Mauro Riva, business manager, SAES Group; and Dr. Nizamidin Jappar, international marketing manager, Kimoto Tech Inc.
Dr. James will head up the session on Functional Materials. This topic will include talks by Dr. Nigel Pickett, Nanoco Technologies Limited CTO; imec researcher Dr. Cedric Rolin; Dr. Rakel Herrero, project manager, senior R&D researcher,  NAITEC; and Dr. Christoph Hunger, project manager R&D, Papierfabrik Louisenthal GmbH.
GE Healthcare’s Dr. Juha Virtanen will head up the session on Wearable Electronics. Speakers include Prof. Mark Poliks, professor and director, Binghamton University;  Dr. Laura Ortega Tañá, PhD student, Institute of Microelectronics of Barcelona (IMB-CNM, CSIC); and  Nicolas Glaser, senior R&D engineer, CSEM SA.
Wear It Berlin GmbH CEO Thomas Gnahm will host the session on Smart Textiles. The two speakers will be David Schmelzeisen, group leader 4D textiles, Institut für Textiltechnik der RWTH Aachen University, and Dr. Yves-Simon Gloy, managing scientific director,  Saechsisches Textilforschungsinstitut e.V.
The Scientific Conference will have six sessions split among two concurrent tracks.
Prof. Ronald Österbacka of Åbo Akademi University will serve as chair of the Flexible and Printed Electronics session as well as being the opening speaker. Prof.  Österbacka will be followed by Prof. Jana Zaumseil of Heidelberg University, Prof. Dr. Gyou-Jin Cho of Sunchon National University, Prof. Tse Nga Ng, associate professor of University of California San Diego, and Prof. Takhee Lee of Seoul National University.
Dr. Bertrand Fillon, general director of research, French Plastic Institute (IPC), will chair the Doping, Computations, and Characterization session, featuring five speakers: Prof. Alison Walker, professor of physics, University of Bath; Prof. Wolfgang Wenzel of Karlsruhe Institute of Technology; Dr. Gert-Jan Wetzelaer, group leader, Max Planck Institute for Polymer Research; Nanomatch GmbH CEO Dr. Tobias Neumann; and Paolo Melgari of CPI -Centre for Process Innovation.
Prof. Tse Nga Ng, associate professor at University of California San Diego, will lead the session on Processes II. Processes for Printing Electronics. Attendees will hear from Corne Rentrop, project manager, Holst Centre;  Dhanushkodi Mariappan, research assistant, Massachusetts Institute of Technology; Dr. J. Marcos Fernandez-Pradas, associate professor, Universitat de Barcelona; and Prof. Silvia Schintke, head of Laboratory of Applied NanoSciences (COMATEC-LANS).
Prof. Walker returns to lead the session on Devices III. Electrochemical TFTs and Devices. Dr. Simone Fabiano, assistant professor, Linköping University, leads off this session, followed by Dr. Chakrit Sriprachuabwong, researcher for National Science and Technology Development Agency;  and Dr. Sébastien Sanaur, associate professor, Ecole Nationale Supérieure des Mines de Saint-Etienne.
Dongguk University Prof. Yong-Young Noh serves as the chair for Devices IV. Sensors II. This session begins with Prof. Simone Genovesi, EM engineer, University of Pisa, and continues with  Prof. Sangyoon Lee of Konkuk University,  and Toba CEO Prof. Kee-Hyun Shin.
Dr. Fabiano chairs the session on Devices V. Printed and Flexible Devices for IoT Applications, which will lead off with Dr. Terho Kololuoma, research team leader, VTT Technical Research Centre of Finland. Dr. Kololuoma will be followed by  Dr. Adisorn Tuantranont, founding director of National Science and Technology Development Agency, and Douglas Hackler, president and CEO, American Semiconductor, Inc.