As Printed Electronics Europe 2017 concludes today in Berlin, Germany, attendees will have the opportunity to learn how the worlds of flexible and printed electronics, sensors, wearables, the Internet of Things, 3D printing and energy harvesting are coming together. Under the heading of “Connecting Emerging Technologies With Global Brands,” conference organizer IDTechEx is showing how these growing markets are interconnected.
 
This year, there will be eight concurrent tracks covering co-located programs on 3D Printing Europe; Electric Vehicles; Energy Harvesting Europe; Energy Storage Innovations; Graphene & 2D Materials; Internet of Things Applications Europe; Sensors Europe and Wearables Europe. With more than 200 exhibitors on hand as well, visitors will have plenty of opportunities to learn about the latest technologies, and how they are interconnected.
 
Printed Electronics is the focus of Track 1, with topics ranging from displays and devices to manufacturing.
 
Display Innovations will be the early segment, with speakers on hand from FlexEnable Ltd., Industrial Technology Research Institute, Etulipa, Folium Optics and Brunel University London. The Printed Electronics track then heads to Printed Electronics Devices And Solutions, with interesting presentations by PragmatIC, Interlink Electronics, OLED Works, OSRAM OLED GmbH and TENFlecs.
 
In the afternoon session, the first of two topics is Printed and Flexible Electronics Manufacturing, led by presenters from Kateeva, iBeam Materials, Coatema Coating Machinery GmbH, NovaCentrix and Ceradrop. Advances In Electronics Closing Keynotes will close Track 1, with talks by Northeastern University, IMEC, Sharp Devices Europe and Google (X).
 
Track 2 looks covers materials, including graphene, beginning with the opening segment on Conductive Inks. Speakers from Fujikura Kasei Co Ltd., Agfa-Materials, Heraeus Electronics, Playtronica and Copprint will discuss new advances in conductive inks.  TCF, Graphene and Carbon Nanotube Ink Advances, the next topic, will by analyzed by speakers from IDTechEx, SURAGUS GmbH FGV Cambridge Nanosystems, XTPL and Ocsial.
 
Energy Storage and Graphene, the closing session, will feature talks by THALES Research and Technology, Graphenea, Skeleton Technologies, ZapGo Ltd. and AzTrong Inc.
 
E-Textiles and wearables are the focus of Track 3. E-Textiles, the focus of the morning session, will be analyzed by Primo1D, Flex, HISEP Technology Ltd., LifeSense Group, Karl Otto Braun & Co. KG., Argaman Technologies Ltd., Wearable Life Science GmbH, Statex Produktions & Vertriebs GmbH, AiQ Smart Clothing and TTRI.
 
The afternoon session opens with Wearables In Healthcare, featuring speakers from GSK, Qualcomm Life, Google, Gait Up and Henkel Electronic Materials. The Emerging Frontier of Wearable Technology, which closes Track 3, will feature talks by Tempdrop Ltd., Teiimo, Doppel and Enfucell Oy.
 
Track 4 features three segments on sensors. Wireless Communications, Security and Standards offers talks by Multos, Sigfox, Fraunhofer FOKUS, Icohup and Chirp. Real Time Locating Systems and RFID will fature Wittra Sweden AB, Imagotag GmbH, Bonbon Technology, Rezatec and endiio GmbH. Sensors for Smart Buildings and Cities will be covered by Analog Devices, Toposens GmbH, Attensys.io GmbH and microTEC Suedwest e.V.
 
Track 5 looks at advances in the world of 3D printing, starting with 3D Printing with Plastics, featuring HP, DSM, Ricoh Europe, EnvisionTEC GmbH and Fraunhofer IGB. 3D Printing with Metals, the next topic, will be covered by Exova, Cytosurge AG, Metalysis, BotFactory and Voltera.
 
New Materials for 3D Printing brings together speakers from ACEO, Materialise NV, Bluestar Silicones. 3D Ceram and Chemcubed, while the closing segment, Enabling Technologies for 3D Printing, will convene experts from myProductLab, Digits2Widgets (D2W), Photocentric and Frustum Inc.
 
The subject of Energy Harvesting will the center of the four sessions of Track 6, beginning with Thermoelectric Energy Harvesting Comes to Market, featuring talks by Sheetak Inc., TEGnology ApS, Tyndall National Institute, RGS Development BV and Otego. New and Emerging Energy Harvesting Technologies and Devices will be coverd by experts from Ecole Polytechnique Federal de Lausanne, EnerBee, Lightricity, Silent Sensors and KYMIRA Ltd.
 
The afternoon portion begins with a session on New Photovoltaics Technologies and Systems, led by talks by JCDecaux, 3GSolar Photovoltaics Ltd., VTree Energy, OPVIUS GmbH and IDTechEx. Track 6 closes with Energy Harvesting Technology Innovations, featuring presenters from ZHAW, Fraunhofer IPMS, University of Exeter and IDTechEx.
 
Track 7 will be split between sensors and advanced and post lithium-ion batteries. Sensors will be the focus of the morning segments, beginning with Sensors for Healthcare, with talks by ActLight, First Sensor AG, Siemens Healthineers, Tyndall National Institute and Fraunhofer IISB. Sensor Miniaturisation and Advanced Chips will have speakers from AMS, VTT, National Physical Laboratory, Delektre Ltd. and Vaporsens.
 
Advanced and Post Lithium-Ion Batteries, the topic of the afternoon session, features nine speakers, with experts on hand from TU Berlin, Leyden-Jar Technologies, Helmholtz Institute Ulm, Solvionic, ProLogium Technology, StoreDot, Poznan University, Northern Arizona University and PO-CELLTECH Ltd.
 
Track 8 will cover the subjects of Electric Vehicles and Energy Storage. Commercial, Off-Road, Fuel Cell, Supercapacitor and Charging, the opening session, will be covered by IDTechEx, Advanced System Design, Imperial College London, Ballard Power Systems and Hubject GmbH.
 
Enabling Technologies For Autonomous and Electric Vehicles is the subject of talks by University Ghent, Daimler AG, New Cable Corporation, Tanktwo Oy and IDTechEx. After lunch the final topic will be New Energy Storage, Power Conditioning And Transfer, led by presenters from LION Smart GmbH, Solvay, SAES Getters, Nabaltec AG and MAGMENT UG.