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New Applications, Technologies are Focus for 2019FLEX

By David Savastano, Editor | 02.19.19

Sessions will cover Applications, Manufacturing, Sensors, Devices, Printing, Smart Transportation, Emerging Technologies and more.

2019FLEX, organized by SEMI-FlexTech, continues on to its second day on Feb. 20, with a wide range of sessions, including Applications, Manufacturing, Sensors, Devices, Printing, Smart Transportation, Emerging Technologies and more.
FLEX Session 5: Applications II, will begin with “Printed Electronics – A Benchmark Study,” delivered by John Pan, professor, California Polytechnic State University. “Batteryless Monitoring System for Real-World Automotive & Flex Applications” is the topic for Silent Sensors Ltd. CEO Marcus Taylor. Tekscan, Inc. CTO Robert Podoloff will follow with “Development of a High Speed System for Measuring Dynamic Tire Footprints.” Yun-Soung Kim, postdoctoral research fellow, Georgia Institute of Technology, will close the session with “Wireless Skin-Like Electronics (SKINTRONICS) for Persistent Human-Machine Interfaces.”
FLEX Session 6 is centered on Flex Manufacturing I, and will begin with “Innovations in Materials for Low Temperature Flexible Assemblies,” a talk by Bawa Singh, EVP for technology and corporate development, Alpha Assembly Solutions. Frank Bruening, global product director, desmear and metallization, Atotech Group, will follow with “Effect and Control of Underlying Copper Structures on the Electrolytic Plating Characteristics in Flexible PCB Applications.”
Wei Wu, principal investigator, DuPont Electronics and Imaging, will discuss “Dupont Thin and Flexible Materials Enabling Smart Applications.” Wilfried Bair, VP engineering, NextFlex, who will conclude the Flex Manufacturing I session with “FHE Applications for Structural Health Monitoring in Transportation.”
Sensors I is the focus of FLEX Session 7. The presenters include Novasentis CTO Michael Vestel, who will start the session off with “Flexible Actuators for Sensational Haptics.” William Beckenbaugh, chief scientific adviser and board member, Peratech Holdco, will analyze “Force Sensing as a New Dimension for Smart Devices.” Tae-Woo Lee, associate professor, Seoul National University, Korea,” will cover “Neuromorphic Flexible Organic Afferent Nerves for Bio-inspired Electronics,” and Aline Eid, PhD, student, Georgia Institute of Technology, will conclude the session with “How the Future of 5G Will Be Printed.”
MSTC Session 4, Smart Transportation, will begin with an introduction by Strategic World Ventures CEO Stephen Whalley. Hans Stork, SVP and CTO, ON Semiconductor, will follow with a keynote talk on “Smart Semiconductor Sensors to Enable Eyes-off Autonomous Driving.”
Becky Oh, president and CEO, PNI Sensor, will focus on “It’s No Longer Just About the Sensor.” Tony Zarola, GM inertial sensors, Analog Devices, follows with “Inertial Sensors are Breaking Through the Autonomous Vehicle Hype Cycle.” Balaji Sundaram, principal, Enterprise IoT for Smart Cities, Campuses & Venues, Verizon Enterprise Solutions, then will give a presentation on “The Sensor Systems to Reduce Traffic Death,” and Angela Suen, head of marketing, FABU America, Inc., will close the segment with her talk on “Sensors in Autonomous Driving.”
After the break, FLEX Session 8 will feature Flexible Hybrid Electronics Technology. The segment will open with David Grierson, co-founder and CTO, systeMECH, Inc., will discuss “Direct Die-placement Technology: A New Approach to Thin and Ultra-thin Die Placement for FHE Applications.”
Douglas Hackler, president and CEO, American Semiconductor , will then follow with two talks: “Automated High-Volume Flip-Chip Assembly for FHE” and “Ultra-Thin and Flexible Bluetooth Low Energy ICs.” Jean-Charles Souriau, project leader and scientific leader at CEA LETI, will close the session with “Development of Silicon Bare Die Integration by Flip-Chip within a Flexible Label.”
FLEX Session 9 covers Flex Manufacturing II. The talks will be given by Scott Gordon, new business development manager, DuPont Teijin Films, who will discuss “Polyester Film Substrates for Flexible and Formable Electronics.” Tony Flaim, corporate fellow, Brewer Science, Inc., will follow with “Novel, Fast-Etching Plastic Packaging Materials for Laser Processing of Flexible Circuits and Printed Electronics.”
“Advanced Applications of Photonic Curing Tools to Enhance Manufacturing of Flexible Hybrid Electronics” will be discussed by Vahid Akhavan, global applications engineering lead, NovaCentrix, and Harvey Tsang, electronics engineer, Army Research Laboratory, will close Flex Manufacturing II with “3D Transitions onto an Elevated Surface.”
FLEX Session 10: Sensors II, will be the focus of talks by Hylke B. Akkerman, program manager, Holst Centre, who will open the session with “Printed Organic Biometric Scanners for Edge-free Smartphone Displays.” Giuseppe Di Benedotto, chemical engineer, Advanced Materials Technology Branch, U.S. Army Research, Development, and Engineering Command, Armament Research, Development and Engineering Center, will then discuss “Printed Fractal Antenna Elements for the Marine Corps Innovation Challenge.”
Miko Cakmak, professor, Purdue University, will discuss “Field Assisted Alignment of Nanoparticles in Flexible Films to Produce Ultrasensitive Sensors.” Pamela Bhatti, associate professor, Georgia Tech/Emory School of Medicine, closes the session with “Flexible Microcoils for Micromagnetic Stimulation of the Cochlea: A New Paradigm in Overcoming Hearing Loss.”
After lunch, FLEX Session 11 will cover Flex Interconnect. The presenters include Subramanian S. Iyer, director, UCLA Center for Heterogeneous Integration and Performance Scaling, who will present on “The Role of Advanced Packaging in AI Systems and Medical Engineering Devices.” Marius Ivan, co-founder and senior research scientist, Pricos Technologies, will offer insights into “Exceptionally Stretchable, Bendable, and Rollable Inter-connectors for the Next Generation of Flexible Hybrid Electronics.”
“Low-Temperature Stretchable Bonding Technology Applicable to Flexible Substrates” will be discussed by Hiroshi Komatsu, director, CONNECTEC JAPAN Corporation. “Advanced Assembly of Fine-Pitched Electrical Components” will be the topic for Rob Irwin, engineering manager, Printed and Hybrid Electronics Development Group, Molex, and Martin Karl Anselm, PhD assistant professor, Rochester Institute of Technology and director of RIT’s Center for Electronics Manufacturing and Assembly (CEMA).
FLEX Session 12 will cover Printing, and will include Hayley Katz, materials engineer, US Army Armaments Research, Development and Engineering Center at Picatinny Arsenal, who will open the session with “Materials and Processes for Multi-Material Printing.” Denis Cormier, Earl Brinkman professor and director of the AMPrint Center, Rochester Institute of Technology, will then focus on “Magnetohydrodynamic Jet Printing Technology and Applications.”
James Zunino, materials engineer, US Army, will discuss “US Army’s Transformative Manufacturing Techniques for Hybrid Printed Solutions.” “Inkjet Printing Beyond Color - Towards Digital Fabrication of Layer Stacks for Printed Electronics,” is the focus of the talk by Reinhard R. Baumann, professor, Fraunhofer Institute for Electronic Nanosystems ENAS. Pradeep Lall, director of the NSF Center for Advanced Vehicle and Extreme Environment Electronics, Auburn University, closes the Printing segment with “Interaction of Manufacturing Process Parameters with Long-run Print Consistency and Material Properties of Additively Printed Electronics.”
Devices I is the focus of FLEX Session 13. The speakers are Brian Berland, chief science officer, ITN Energy Systems, Inc., who will present on “Ultra-Thin, Self-Charging Solid-State Battery for Flexible Hybrid Electronic Devices.” Pavel Dutta, research assistant professor, Department of Mechanical Engineering, University of Houston, wil discuss “Flexible Electronics and Energy Devices Using Single-Crystalline-like Semiconductors Made by High-Temperature Roll-to-Roll Processing.”
Victor Plotnikov, senior scientist, Lucintech Inc., will focus on “Thin-film CdTe PV Minimodules on Flexible Ceramic Superstrates.” Thad Druffel, theme leader, solar manufacturing R&D, University of Louisville, will give a talk on “Rapid Processing of SnO2 Thin Films for Flexible Perovskite Solar Cells.” “Development of a Wearable Flexible Hybrid Electronics ECG Monitor,” presented by Mark D. Poliks, Empire Innovation professor engineering, professor systems science and industrial engineering, and director, Center for Advanced Microelectronics Manufacturing, Binghamton State University, closes the Devices I session.
On the MSTC side, Session 5 will cover Enabling Sensors Technology. Talks will be given by Greg Lebsack, GM, ICDS Division Mentor, whose topic is “Beyond the Sensor: Integrated Co-design of MEMS/IC. “Inertial Calibration Protocols for MEMS 3-Axis Accelerometers” will be discussed by Michael Gaitan, project leader, NIST Physical Measurement Laboratory. Ken Foust, sensor technologist and researcher, Intel Corporation, will close the session with “Motivations for MIPI I3C, Its Impact and Where It’s Going.”
After the break, Reliability will be covered in FLEX Session 14. Speakers include Nathan Pretorius, printing technology engineer for NextFlex, whose topic is “Passive Component Joint Strength for FHE Substrates.” Kei Hyodo, executive officer and GM, Yuasa System Co. Ltd., will offer insights into “International Standards Reaches Industry, as IEC TC 119 is Expanding.” Naotsugu Ando, chief designer, Yuasa System Co. Ltd., will give a presentation on “Analysis of Mechanical Stresses on Flexible Devices.”
“Investigating the Mechanical Reliability of Barrier Films and Functional Inks for Flexible/Stretchable Electronics” is the topic for Olivier Pierron, associate professor, Georgia Institute of Technology. Mark D. Poliks, Empire Innovation professor engineering, professor systems science and industrial engineering, and director, Center for Advanced Microelectronics Manufacturing Binghamton State University, will then talk on “Reliability of Printed Flexible Hybrid Electronics.”
FLEX Session 15: Devices II, will feature Tae-Woo Lee, associate professor, Seoul National University, Korea, whose talk covers “High-efficiency Halide Perovskite Nanoparticle Light-emitting Diodes.” Chang Guo, research scientist, National Research Council Canada, will then discuss “Fully Printed Single-walled Carbon Nanotube Transistors/Sensors Via Inkjet Printing: from Materials to Fabrication.”
Rahul Raut, director, strategy and technology acquisition, Alpha Assembly Solutions, will analyze “Materials for Smart Structures and Next Generation Human Machine Interfaces (HMI).” Michael Filler, associate professor, Georgia Institute of Technology, follows with “Fully Bottom-Up Fabrication of Modular, High-Performance Transistors for Printed Electronics.” Ahmed Busnaina, WL Smith chair and university distinguished professor, Northeastern University - College of Engineering, concludes the session with “Fabrication of Electronics and Sensors Using a Directed Assembly-Based Printing Process.”
MSCT Session 6 is centered on Emerging Technologies, with presentations by Yun-Soung Kim, postdoctoral research fellow, Georgia Institute of Technology, who will begin the session with “Wireless Skin-Like Electronics (SKINTRONICS) for Persistent Human-Machine Interfaces.” “Autonomous Microsystems: Smart Dust, Smart Factories, and Micro Robots” is the topic for UC Berkeley professor Kristofer Pister. Mallik P. Moturi, VP of product management and business development, Syntiant Corp., will follow with “Moving Cloud- and Deep-Level Performance into Always-On Devices with Analog Neural Networks.”
There will also be TechTALKS on the exhibit floor, including:
Wednesday, Feb. 20:
• 10:30-10:45 a.m.: “Low Temperature Stretchable Bonding Technology Applicable to Flexible Substrates”
• 10:45-11:00 a.m.: “TechTALK: Dupont Thin and Flexible Materials Enabling Smart Applications” – Wei Wu, DuPont
• 11:00-11:15 a.m.: “TechTALK: Process Design Kit for Flexible Hybrid Electronics” – Sivapurapu Sridhar, Georgia Institute of Technology
• 11:15-11:30 a.m.: “TechTALK: Heterogeneously Integrated Foldable Display on Elastomeric Substrate Based on Fan-Out Wafer Level Packaging” – Arsalan Alam, University of California Los Angeles Center for Heterogeneous integration and Performance Scaling
• 11:30-11:45 a.m.: “TechTALK: Pushing the Envelope of Innovation in the Era of Artificial Intelligence and IoT - STMicroelectronics Introduces a New Generation of Sensors and Bluetooth Processors” – Jay Esfandyari, STMicroelectronics
• 1:45-2:00 p.m.: “TechTALK: Sensing for Autonomous Mobility”
• 2:00-2:15 p.m.: “TechTALK: Development of a High Speed System for Measuring Dynamic Tire Footprints” – Rob Podoloff, Tekscan, Inc.
• 2:15-2:30 p.m.: “TechTALK: Bonbouton Connected Insole for Diabetic Amputation Prevention - Developments Stages” – Linh Le, Bonbouton
Afterward, the FLEXI Awards and Student Poster Awards will be presented.