Optomec Showcases Aerosol Jet 3D Printing Systems at Flexible Electronics Conference
02.19.19
Dr. Kurt Christenson, Optomec senior scientist, delivers presentation titled “Fitting the Function into the Form.”
Optomec, a leading global supplier of production grade additive manufacturing systems for 3D printed electronics announced that the company will showcase its Aerosol Jet systems for 3D production-grade printed electronics at the FLEX Mems and Sensors Technical conference and expo, held this week at the Hyatt Regency in Monterey, CA.
Optomec will be in booth # 3011.
In addition to the exhibition, Dr. Kurt Christenson, Optomec senior scientist, will deliver a presentation titled “Fitting the Function into the Form” in the TechTalks afternoon Session at 3 p.m. on Tuesday, Feb. 19.
In his presentation, Dr. Christenson will discuss how Flexible Hybrid Electronics are driven by the need to fit an electrical function into a convenient and often an aesthetic form. In FHE, electrical components and interconnects need to be added to rigid 3D surfaces or flexible substrates that are later bent when put in place. Aerosol Jet technology offers a means of printing conductors and attaching discrete ICs, passives, LEDs, sensors, etc. to 3D and flex substrates.
Dr. Christenson’s talk will discuss the techniques and materials necessary to create 3D and flexible circuits using Aerosol Jet technology including discussions of design rules, materials, current limitations and plans to overcome those limitations.
Optomec will be in booth # 3011.
In addition to the exhibition, Dr. Kurt Christenson, Optomec senior scientist, will deliver a presentation titled “Fitting the Function into the Form” in the TechTalks afternoon Session at 3 p.m. on Tuesday, Feb. 19.
In his presentation, Dr. Christenson will discuss how Flexible Hybrid Electronics are driven by the need to fit an electrical function into a convenient and often an aesthetic form. In FHE, electrical components and interconnects need to be added to rigid 3D surfaces or flexible substrates that are later bent when put in place. Aerosol Jet technology offers a means of printing conductors and attaching discrete ICs, passives, LEDs, sensors, etc. to 3D and flex substrates.
Dr. Christenson’s talk will discuss the techniques and materials necessary to create 3D and flexible circuits using Aerosol Jet technology including discussions of design rules, materials, current limitations and plans to overcome those limitations.
