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FLEX 2019 Concludes with Smart MedTech, Inks and Design

By David Savastano, Editor | 02.20.19

The final segment, NBMC Opportunities for Smart MedTech, will include breakout sessions.

 2019FLEX, organized by SEMI-FlexTech, holds its closing session Feb. 21, with four concurrent sessions, with topics ranging from Smart MedTech and Inks to Design.
 
FLEX Session 16 will focus on Smart MedTech. The session will feature Arunan Skandarajah, program officer, Bill and Melinda Gates Foundation, Innovative Technology Solutions, will open the Smart MedTech session with a talk on “Toward A Smart Toolkit for Global Health.” Tamara A. Averett-Brauer, research thrust area and product line lead, Air Force Research Laboratory: 711th Human Performance Wing, will then offer her insights into “Aeromedical and Enroute Care Research and Applications.”
 
“Soft, Skin-Interfaced Systems with Integrated Biosensors and Microfluidics” will be the topic for Roozbeh Ghaffari, co-founder and CEO, Epicore Biosystems; Joan K. Vrtis, SVP, innovation and technology integration, Flex, will follow with “Soft Systems Integration: The Future of Personal Health Sensing.” A Smart MedTech Panel Discussion featuring the four previous speakers will close the segment.
 
Inks are the topic of FLEX Session 17, and will include talks by Robert Praino, COO and co-founder, Chasm Advanced Materials, who will discuss “Transparent Conductive Films: Hybrid Material Structures vs. Single Material Composition.” Christopher Tabor, research scientist, Air Force Research Laboratory, will follow with “Liquid Metal Networks for Stretchable Electronics.”
 
Don Veri, business development and sales director, MBT Systems, will discuss “Inkjet Printing for Hybrid Printed Electronics and Semiconductor Applications.” Ajay Virkar, CTO and co-founder, C3Nano, follows with “Engineering the Highest Performance Flexible Transparent Conductor.” Bruce Kahn, chief scientist and director of business development, RIT, will close the Inks session with “Preparation, Properties, and Applications of Aligned Ni Nanowires.”
 
Design, the focus of FLEX Session 18, will be covered by Devanshu Kant, senior R&D engineer, Flex, who will open the session with “Intelligent High Pressure Forming: Enabling Tools and Approaches.” Brian Zahnstecher, principal, PowerRox, will then analyze “Packaging Innovations Enable Flexible Electronics Systems to Shed Power Limitations.”
 
“Designing Toolpath for CAD to Fabrication of 3D Printed Circuit and Pick-n-Placed Components onto a Cube with a 5-axis Printer” will be covered by Harvey Tsang, electronics engineer, Army Research Laboratory. Edward Collins, principal engineer, Jabil (HIG) Hardware Innovation Group, will offer insights into “Test Methodology for Printed Force Sensing Resistors.” Pradeep Lall, director of the NSF Center for Advanced Vehicle and Extreme Environment Electronics, Auburn University, will close Design with “Performance of Thin Flexible Batteries in Wearable Applications Under Shallow Charging after Elevated Temperature Storage and Thermal Cycling.”
 
FLEX Session 19’s topic is NBMC Opportunities for Smart MedTech. After an introduction by SEMI - FlexTech CTO Melissa Grupen Shemansky, Doyle Edwards, director, government programs for Brewer Science, Inc., will discuss “Member Value Perspective.” Jeremy Ward, research scientist & program manager, Materials and Manufacturing Directorate of the US Air Force Research Laboratory (AFRL), will follow with “Mission Definition & Introduction to Breakouts.” He will be followed by Breakout Sessions.
 
For more information on 2019FLEX, see FlexTech’s web site at flex.semi.org.