IDTechEx Live! Looks at Opportunities for Flexible and Printed Electronics
By David Savastano, Editor | 11.15.17
Topics to be covered include flexible and printed electronics, sensors, wearables, IoT, 3D printing and graphene.
Flexible and printed electronics, sensors, wearables, the Internet of Things, 3D printing and graphene will be among the topics that will be covered today during the closing session of Printed Electronics USA 2017 in Santa Clara, CA.
Organized by IDTechEx, PE USA 2017 features eight co-located concurrent programs during its eight tracks, including sessions on 3D Printing, Energy Harvesting, Energy Storage Innovations, Graphene, Internet of Things (IoT) Applications, Printed Electronics, Sensors, and Wearables.
The focus of Track 1 today is 3D Printing. The opening session, Advances with 3D Printing with Plastics, wil be covered by SABIC, Eindhoven University of Technology, AREVO and DSM Sonos.
3D Printing with Metals will be discussed by speakers from Rochester Institute of Technology, Cytosurge AG, BotFactory, Exova and Voltera. 3D Bio Printing will be discussed by IDTechEx, regenHU, regemat 3D, Aspect Biosystems and IDTechEx. The closing session, Enabling Technologies for 3D Printing, will be analyzed by presenters from Elkem Silicones and Chemcubed.
Track 2 will continue the discussion on Electric Vehicles.Next-Generation Electric Vehicle Motors, Powertrains, Charging and Materials, the beginning session, will be discussed by Protean Electric, InvertedPower Pty Ltd, erzo Power Systems and IDXIE LLC.
Aerospace, Autonomous and Connected Vehicles will be presented by Panasonic, NEXT Future Transportation, Bye Aerospace, Xilinx and Elix Wireless. The session on Enabling Technologies for Autonomous and Electric Vehicles will feature talks from Alliance LLC, IDTechEx, Lord Corp., GBatteries and FenSens.
Track 3 covers Energy Harvesting, with wind the first session, solar the second and high powerapplications the third grouping. Wind, Motion and Vibration Energy Harvesting will be discussed by Motsai, National Institute of Aerospace, FRABA, University of Wisconsin-Madison and SolePower. Thermoelectric and Photovoltaic Energy Harvesting will be analyzed by UbiQD, Inc., Ubiquitous Energy, KELK Ltd., Saule Technologies and Snell & Wilmer. IDTechEx, Center for Energy Harvesting Materials and Systems (CEHMS), Ecoken, SolaLum amd Novacab will focus on the closing topic, High Power Energy Harvesting: Airborne Wind Energy, Light, Motion.
Track 4 will look at Energy Stporage, beginnign with Energy Storage for Stationary Applications, a topic forVoltaiq, Natron Energy, eChemion, EOS and Primus Power. Enabling Technologies for Energy Storage will be discussed by PARC, a Xerox company, CEA LETI, Lepidico, Electrovaya and Intel Corporation.First Graphite, Enerage, ZapGo, Murata Americas and The University of Waikatowill analyze the subject of Supercapacitors and Graphene.
The Internet of Things will be primarily the focus of Track 5, with RFID and Wearables also on the schedule. Track 5 opens with Industrial Internet of Things, featuring talks by Analog Devices/Linear Technology, ARM, Altair, Reality AI and Bioinspira. HID Global, ClearBlade, Johnson Controls, KONA and Totem Power will then give their perspectives on Intelligent Buildings.
Track 5 continues on with RFID and Bluetooth in Industry 4.0, with talks by RAIN RFID, Impinj, Avery Dennison RBIS, Infratab and Wiliot scheduled. Wearable Technology in Sports and Industrial Applications, featuring Suunto Oy, StretchSense Ltd., Victorise and HISEP Technology Ltd., closes Track 5.
Track 6 begins with two sessions on Display and Lighting Innovations, with presenters from Chromera, CLEARink, Etulipa, Universal Display, Kateeva, Nth Degree Technologies, Seoul National University, SiliconCore, NovaCentrix and FlexEnable leading the discussions.
After lunch, there are two sessions on Printed and Flexible Electronics Materials and Manufacturing, covered by Applied Materials Italia Srl., Ceradrop MGI Group, Xenon Corporation, CondAlign AS, N&B, Asahi Kasei, BASF New Business GmbH, Imprint Energy and Changzhou Institute of Printed Electronics Industry.
Track 7, which focuses on Printed Electronicas, begins with New Material Advances, discussed by Agfa-Gevaert, SAFI-Tech, DuPont Teijin Films, Fujikura Kasei and DUKSAN Hi-Metal Co., Ltd. Printed Electronics Systems and Smart Packaging, a promising growth area, will be the focus of talks by PragmatIC, Thin Film Electronics, PI Crystal, Electroninks and Molex.
Next-Generation Human-Machine Interaction (HMI) Technologies: Touch, Haptics, will feature talks by IDTechEx, Freer Logic, Cambridge Mechatronics Ltd., AxonVR and Ultrahaptics. The closing segment, Next-Generation Human-Machine Interaction (HMI) Technologies, will be covered by Texas Instruments, Elliptic Labs, Piezotech Arkema and Novasentis.
Healthcare and Strethcable Electronics are the focus of Track 8, the Wearables segment. Track 8 begins with speakers from Quvium, Kenzen, VitalConnect, Tekscan, NextFlex, IDTechEx, Biolinq, InSilixa, Profusa and Bainisha offering their perspective during two sessions on Healthcare: Diagnostics and Monitoring.
Another dual session, Stretchable Electronics and E-Textiles, follows in the afternoon, with presenters from Superflex, OMsignal, SRI International, Stanford University, MacDermid Performance Solutions, Cotton Incorporated, infi-tex Ltd., Houlihan Lokey and 360Fashion Network.
Organized by IDTechEx, PE USA 2017 features eight co-located concurrent programs during its eight tracks, including sessions on 3D Printing, Energy Harvesting, Energy Storage Innovations, Graphene, Internet of Things (IoT) Applications, Printed Electronics, Sensors, and Wearables.
The focus of Track 1 today is 3D Printing. The opening session, Advances with 3D Printing with Plastics, wil be covered by SABIC, Eindhoven University of Technology, AREVO and DSM Sonos.
3D Printing with Metals will be discussed by speakers from Rochester Institute of Technology, Cytosurge AG, BotFactory, Exova and Voltera. 3D Bio Printing will be discussed by IDTechEx, regenHU, regemat 3D, Aspect Biosystems and IDTechEx. The closing session, Enabling Technologies for 3D Printing, will be analyzed by presenters from Elkem Silicones and Chemcubed.
Track 2 will continue the discussion on Electric Vehicles.Next-Generation Electric Vehicle Motors, Powertrains, Charging and Materials, the beginning session, will be discussed by Protean Electric, InvertedPower Pty Ltd, erzo Power Systems and IDXIE LLC.
Aerospace, Autonomous and Connected Vehicles will be presented by Panasonic, NEXT Future Transportation, Bye Aerospace, Xilinx and Elix Wireless. The session on Enabling Technologies for Autonomous and Electric Vehicles will feature talks from Alliance LLC, IDTechEx, Lord Corp., GBatteries and FenSens.
Track 3 covers Energy Harvesting, with wind the first session, solar the second and high powerapplications the third grouping. Wind, Motion and Vibration Energy Harvesting will be discussed by Motsai, National Institute of Aerospace, FRABA, University of Wisconsin-Madison and SolePower. Thermoelectric and Photovoltaic Energy Harvesting will be analyzed by UbiQD, Inc., Ubiquitous Energy, KELK Ltd., Saule Technologies and Snell & Wilmer. IDTechEx, Center for Energy Harvesting Materials and Systems (CEHMS), Ecoken, SolaLum amd Novacab will focus on the closing topic, High Power Energy Harvesting: Airborne Wind Energy, Light, Motion.
Track 4 will look at Energy Stporage, beginnign with Energy Storage for Stationary Applications, a topic forVoltaiq, Natron Energy, eChemion, EOS and Primus Power. Enabling Technologies for Energy Storage will be discussed by PARC, a Xerox company, CEA LETI, Lepidico, Electrovaya and Intel Corporation.First Graphite, Enerage, ZapGo, Murata Americas and The University of Waikatowill analyze the subject of Supercapacitors and Graphene.
The Internet of Things will be primarily the focus of Track 5, with RFID and Wearables also on the schedule. Track 5 opens with Industrial Internet of Things, featuring talks by Analog Devices/Linear Technology, ARM, Altair, Reality AI and Bioinspira. HID Global, ClearBlade, Johnson Controls, KONA and Totem Power will then give their perspectives on Intelligent Buildings.
Track 5 continues on with RFID and Bluetooth in Industry 4.0, with talks by RAIN RFID, Impinj, Avery Dennison RBIS, Infratab and Wiliot scheduled. Wearable Technology in Sports and Industrial Applications, featuring Suunto Oy, StretchSense Ltd., Victorise and HISEP Technology Ltd., closes Track 5.
Track 6 begins with two sessions on Display and Lighting Innovations, with presenters from Chromera, CLEARink, Etulipa, Universal Display, Kateeva, Nth Degree Technologies, Seoul National University, SiliconCore, NovaCentrix and FlexEnable leading the discussions.
After lunch, there are two sessions on Printed and Flexible Electronics Materials and Manufacturing, covered by Applied Materials Italia Srl., Ceradrop MGI Group, Xenon Corporation, CondAlign AS, N&B, Asahi Kasei, BASF New Business GmbH, Imprint Energy and Changzhou Institute of Printed Electronics Industry.
Track 7, which focuses on Printed Electronicas, begins with New Material Advances, discussed by Agfa-Gevaert, SAFI-Tech, DuPont Teijin Films, Fujikura Kasei and DUKSAN Hi-Metal Co., Ltd. Printed Electronics Systems and Smart Packaging, a promising growth area, will be the focus of talks by PragmatIC, Thin Film Electronics, PI Crystal, Electroninks and Molex.
Next-Generation Human-Machine Interaction (HMI) Technologies: Touch, Haptics, will feature talks by IDTechEx, Freer Logic, Cambridge Mechatronics Ltd., AxonVR and Ultrahaptics. The closing segment, Next-Generation Human-Machine Interaction (HMI) Technologies, will be covered by Texas Instruments, Elliptic Labs, Piezotech Arkema and Novasentis.
Healthcare and Strethcable Electronics are the focus of Track 8, the Wearables segment. Track 8 begins with speakers from Quvium, Kenzen, VitalConnect, Tekscan, NextFlex, IDTechEx, Biolinq, InSilixa, Profusa and Bainisha offering their perspective during two sessions on Healthcare: Diagnostics and Monitoring.
Another dual session, Stretchable Electronics and E-Textiles, follows in the afternoon, with presenters from Superflex, OMsignal, SRI International, Stanford University, MacDermid Performance Solutions, Cotton Incorporated, infi-tex Ltd., Houlihan Lokey and 360Fashion Network.
