CPES2018 Now Open for Registration, Speaker and Exhibitor Submissions
11.22.17
It will take place from May 23-24 at Centennial College’s Conference Centre in Toronto.
Organized by the intelliFLEX Innovation Alliance, CPES2018, Canada’s premier conference and trade show exhibition for flexible and hybrid electronics (FHE), will take place from May 23-24 at Centennial College’s Conference Centre in Toronto.
The deadline for academic poster and speaker abstract submissions is Jan 18. The submission deadline for our Innovation Awards is March 22. Details will be forthcoming on our new Women in STEM award.
Register now for early Early Bird pricing: Save $200 off the regular admission until Jan. 15, and then $100 until March 31. And don’t wait to book your tabletop exhibit space – we booked up early last year.
What’s new for CPES2018?
• Past attendees of CPES have spoken and we have listened. CPES2018 delivers more of what you need:
• More time to network, to develop the partnerships that are key to your success.
• Fewer product-focused presentations and more industry panels that tackle the challenges facing your organization.
• Greater focus on helping startups and early-stage companies with the addition of a Startup Launchpad to our existing Startup of the Year Award and mentoring program.
• An emphasis on supporting diversity across the industry ecosystem with our new Women in STEM program.
“What hasn’t changed is how we help you make contacts that matter – this distinguishes CPES2018 from other industry events,” said Peter Kallai, CPES2018 co-chair and President and CEO of intelliFLEX.
CPES2018 will cover the broad spectrum of flexible and hybrid electronics (FHE) and the value chain required to bring innovative products and applications to market. We explore technologies, opportunities and industry challenges through tabletop exhibits and academic posters, our Innovation Awards, presentations, an investor panel and industry panel discussions.
Technical areas to be covered include:
• 2D large area and 3D printable electronics
• Advances in inks, pastes, substrates, manufacturing methods
• Advances in flexible electronics
• Advances in wearable electronics
• Advances in components such as sensors, batteries, lights, displays antennas and memory.
• Hybrid electronics that connect printable and flexible electronics with integrated circuits or traditional electronics
If you want to get involved with key elements of the conference such as startup mentoring and the new Women in STEM program, contact Kallai at [email protected].
The deadline for academic poster and speaker abstract submissions is Jan 18. The submission deadline for our Innovation Awards is March 22. Details will be forthcoming on our new Women in STEM award.
Register now for early Early Bird pricing: Save $200 off the regular admission until Jan. 15, and then $100 until March 31. And don’t wait to book your tabletop exhibit space – we booked up early last year.
What’s new for CPES2018?
• Past attendees of CPES have spoken and we have listened. CPES2018 delivers more of what you need:
• More time to network, to develop the partnerships that are key to your success.
• Fewer product-focused presentations and more industry panels that tackle the challenges facing your organization.
• Greater focus on helping startups and early-stage companies with the addition of a Startup Launchpad to our existing Startup of the Year Award and mentoring program.
• An emphasis on supporting diversity across the industry ecosystem with our new Women in STEM program.
“What hasn’t changed is how we help you make contacts that matter – this distinguishes CPES2018 from other industry events,” said Peter Kallai, CPES2018 co-chair and President and CEO of intelliFLEX.
CPES2018 will cover the broad spectrum of flexible and hybrid electronics (FHE) and the value chain required to bring innovative products and applications to market. We explore technologies, opportunities and industry challenges through tabletop exhibits and academic posters, our Innovation Awards, presentations, an investor panel and industry panel discussions.
Technical areas to be covered include:
• 2D large area and 3D printable electronics
• Advances in inks, pastes, substrates, manufacturing methods
• Advances in flexible electronics
• Advances in wearable electronics
• Advances in components such as sensors, batteries, lights, displays antennas and memory.
• Hybrid electronics that connect printable and flexible electronics with integrated circuits or traditional electronics
If you want to get involved with key elements of the conference such as startup mentoring and the new Women in STEM program, contact Kallai at [email protected].
