11.14.23
NextFlex Flexible Hybrid Electronics (FHE) Manufacturing Institute announced $6.49 million in funding for seven new projects. Funding includes $3.29 million in cost-share contribution from participants. Funding will support projects part of its Project call 8.0 to promote FHE development and adoption throughout the U.S. advanced manufacturing sector.
The projects represent a diverse set of companies and universities that are focused on maturing industry capabilities and leveraging a strong foundation for Project Calls. Project Call 8.0 emphasize critical hybrid electronics manufacturing challenges supporting the transition for FHE devices.
Several Project Calls 8.0 address critical needs in domestic advanced semiconductor packaging capabilities. Selected projects also focus on using a hybrid electronics manufacturing process and materials to improve sustainability in electronics manufacturing. This includes low temperature cure water-based inks, electronics recycled/reworked for reduced E-waste production, and maturation of processes using biodegradable and recyclable substrates.
“This round of projects will build on our work in previous Project Calls as we continue to push U.S.-based hybrid electronics manufacturing forward in key areas. These projects address important needs and opportunities in environmentally sustainable electronics manufacturing, additive electronics packaging, and advancing the manufacturing readiness level of critical processes,” said director of technology Scott M. Miller.
With this round of funding the total amount invested in FHE developments to more than $134 million, including cost-share contributions from Project Call participants.
Project Call 8.0 funding awards will go to:
The Boeing Company, two projects for manufacturing additive die packaging for cryogenic and high temperature operations and developing sustainable additive printing and production of hybrid integrated receiver electronics and sensors.
Auburn University, two projects focused on maturing and demonstrating in-mold flexible electronics for hard automotive applications and biodegradable substrates, low-temperature cure water-based inks, room temperature interconnects, and rework for sustainable electronics.
Lockheed Martin and Binghamton University, one project for advancing high resolution copper printing for RF antenna and multi-layer balun structures.
Iowa State University, one project for validation and technology maturation of real-time process monitoring and control of aerosol jet printed electronics.
GE Research and Binghamton University, one project for developing and demonstrating the reliability of additively packaged microelectromechanical systems inertia measurement units for harsh environments.
The projects represent a diverse set of companies and universities that are focused on maturing industry capabilities and leveraging a strong foundation for Project Calls. Project Call 8.0 emphasize critical hybrid electronics manufacturing challenges supporting the transition for FHE devices.
Several Project Calls 8.0 address critical needs in domestic advanced semiconductor packaging capabilities. Selected projects also focus on using a hybrid electronics manufacturing process and materials to improve sustainability in electronics manufacturing. This includes low temperature cure water-based inks, electronics recycled/reworked for reduced E-waste production, and maturation of processes using biodegradable and recyclable substrates.
“This round of projects will build on our work in previous Project Calls as we continue to push U.S.-based hybrid electronics manufacturing forward in key areas. These projects address important needs and opportunities in environmentally sustainable electronics manufacturing, additive electronics packaging, and advancing the manufacturing readiness level of critical processes,” said director of technology Scott M. Miller.
With this round of funding the total amount invested in FHE developments to more than $134 million, including cost-share contributions from Project Call participants.
Project Call 8.0 funding awards will go to:
The Boeing Company, two projects for manufacturing additive die packaging for cryogenic and high temperature operations and developing sustainable additive printing and production of hybrid integrated receiver electronics and sensors.
Auburn University, two projects focused on maturing and demonstrating in-mold flexible electronics for hard automotive applications and biodegradable substrates, low-temperature cure water-based inks, room temperature interconnects, and rework for sustainable electronics.
Lockheed Martin and Binghamton University, one project for advancing high resolution copper printing for RF antenna and multi-layer balun structures.
Iowa State University, one project for validation and technology maturation of real-time process monitoring and control of aerosol jet printed electronics.
GE Research and Binghamton University, one project for developing and demonstrating the reliability of additively packaged microelectromechanical systems inertia measurement units for harsh environments.