David Savastano, Editor06.02.21
There are all kinds of displays. Most of the time, we think of large TVs, phone screens and computer monitors. However, you could put a display on many more items if the technology is right. For example, imagine putting flexible displays onto stickers.
Omniply is working on just that, and is having success. Omniply CEO Harit Doshi is leading this fledgling company, which is using technology developed by Prof. Chi Wan Lee of Purdue University. Prof. Lee was working with Prof. John Rogers at University of Illinois – Urbana Champaign when he developed Omniply’s technology.
“His research focused on flexible electronics, with a dream of a world where any electronic devices can be pasted, just like stickers, to add smart functionality to everyday objects,” said Doshi. “He got inspired by this unique challenge of paint peeling off from the Golden Gate bridge in San Francisco. Science behind this inspired him to create a process for enabling sticker electronics and hence Omniply was born.
Prof. Lee’s work has been recognized with multiple awards globally. Since then, the Omniply team has developed the technology and filed additional patents, built demonstrators and have proven that the technology works in multiple configurations to suit different applications and customer device architectures.
“I can tell you that the application of this technology goes beyond sticker electronics but one key industry that we are disrupting is flexible OLED displays – we stay focused on the humble goal of displays,” Doshi observed.
Doshi noted that one key advantage of Omniply is that it enables larger fabs that are currently not possible with incumbent technology; this means lower priced products. Faster process times in the factory means quicker to market, and eliminating laser and the associated fumes is better for the factory and environment.
The technology itself is interesting.
“In simple words, Omniply’s release technology for flexible electronics is what parchment paper for baking,” said Doshi. “Omniply’s highly efficient and scalable solution will enable larger generations of flexible display manufacturing lines with our OmniPeel™ technology. Today, flexible displays are in its infancy in terms of market penetration; the market for flexible displays is projected to grow by DSCC by 10X by 2025, according to DSCC.”
Omniply’s initial focus is on flexible and foldable displays, but the company also has its eye on semiconductors and sensors.
“While one of the first markets we will address is flexible display manufacturing, it will also enable many new applications for flexible electronics, including printed flexible electronics, thinner ICs, nanostructured plasmonic films, epidermal patches and sensors that cannot withstand the exposure of lasers today,” said Doshi. “We are very excited about Omniply’s potential to help shape the future of flexible and stretchable electronics.”
To get to where they are now, Omniply had to overcome some challenges.
“We knew that to bring forward the next generation of Lift-off technology, we needed a step function improvement over the traditional Lift-off technology,” said Doshi. “Omniply’s Lift-off technology also incorporated a built-in moisture barrier layer with low WVTR (water vapor transmission rate), which is a major benefit to our customers. How did we achieve this? Mostly perspiration along with some inspiration to create new materials and processes that could improve upon the original inventions.”
Doshi reports that feedback is good among customers.
“We are seeing a lot of traction from customers who are developing next generation of production lines, especially Gen 8/8.5 for flexible displays,” said Doshi. “We are also seeing traction from the semiconductor industry on enabling a more efficient process for thinner ICs. Our sensor customers are able to use other inherent features of the technology to build sticker electronics.
“We are working with multiple customers now, hoping to have the first implementation in the coming few quarters; like with most ingredient brands, commercialization is driven by our customers,” Doshi concluded. “We are working hard to hit every milestone and get our technology to market as soon as our customers have completed their current qualification work.”
Omniply is working on just that, and is having success. Omniply CEO Harit Doshi is leading this fledgling company, which is using technology developed by Prof. Chi Wan Lee of Purdue University. Prof. Lee was working with Prof. John Rogers at University of Illinois – Urbana Champaign when he developed Omniply’s technology.
“His research focused on flexible electronics, with a dream of a world where any electronic devices can be pasted, just like stickers, to add smart functionality to everyday objects,” said Doshi. “He got inspired by this unique challenge of paint peeling off from the Golden Gate bridge in San Francisco. Science behind this inspired him to create a process for enabling sticker electronics and hence Omniply was born.
Prof. Lee’s work has been recognized with multiple awards globally. Since then, the Omniply team has developed the technology and filed additional patents, built demonstrators and have proven that the technology works in multiple configurations to suit different applications and customer device architectures.
“I can tell you that the application of this technology goes beyond sticker electronics but one key industry that we are disrupting is flexible OLED displays – we stay focused on the humble goal of displays,” Doshi observed.
Doshi noted that one key advantage of Omniply is that it enables larger fabs that are currently not possible with incumbent technology; this means lower priced products. Faster process times in the factory means quicker to market, and eliminating laser and the associated fumes is better for the factory and environment.
The technology itself is interesting.
“In simple words, Omniply’s release technology for flexible electronics is what parchment paper for baking,” said Doshi. “Omniply’s highly efficient and scalable solution will enable larger generations of flexible display manufacturing lines with our OmniPeel™ technology. Today, flexible displays are in its infancy in terms of market penetration; the market for flexible displays is projected to grow by DSCC by 10X by 2025, according to DSCC.”
Omniply’s initial focus is on flexible and foldable displays, but the company also has its eye on semiconductors and sensors.
“While one of the first markets we will address is flexible display manufacturing, it will also enable many new applications for flexible electronics, including printed flexible electronics, thinner ICs, nanostructured plasmonic films, epidermal patches and sensors that cannot withstand the exposure of lasers today,” said Doshi. “We are very excited about Omniply’s potential to help shape the future of flexible and stretchable electronics.”
To get to where they are now, Omniply had to overcome some challenges.
“We knew that to bring forward the next generation of Lift-off technology, we needed a step function improvement over the traditional Lift-off technology,” said Doshi. “Omniply’s Lift-off technology also incorporated a built-in moisture barrier layer with low WVTR (water vapor transmission rate), which is a major benefit to our customers. How did we achieve this? Mostly perspiration along with some inspiration to create new materials and processes that could improve upon the original inventions.”
Doshi reports that feedback is good among customers.
“We are seeing a lot of traction from customers who are developing next generation of production lines, especially Gen 8/8.5 for flexible displays,” said Doshi. “We are also seeing traction from the semiconductor industry on enabling a more efficient process for thinner ICs. Our sensor customers are able to use other inherent features of the technology to build sticker electronics.
“We are working with multiple customers now, hoping to have the first implementation in the coming few quarters; like with most ingredient brands, commercialization is driven by our customers,” Doshi concluded. “We are working hard to hit every milestone and get our technology to market as soon as our customers have completed their current qualification work.”