Henkel Highlights Pad Printing, Antenna Technologies at LOPEC 2023


Will demonstrate of printed electronics solutions and partner ecosystem for smart surfaces and digital healthcare.

During the LOPEC trade show on March 1 and 2, 2023 in Munich, Henkel will display its range of functional material innovations for printed electronics together with its broad ecosystem of partners. In addition to its solution portfolio for smart surfaces and digital healthcare, the company will focus on novel pad printing solutions for antenna applications.

“LOPEC is the leading international platform for printed electronics and brings together all relevant global players from research to application,” said Stijn Gillissen, head of printed electronics at Henkel. “This year we will showcase our expertise with a variety of material innovations and a special focus on novel pad printing solutions for antennas. We will also highlight our partnership network as we strongly believe that close collaborations across the entire value chain are key for future innovations.”

Henkel’s Loctite portfolio of functional inks includes silver inks, carbon inks, dielectric and other non-conductive inks as well as silver chloride inks. These materials enable Henkel´s partners to develop printed electronics applications tailored for the specific properties demanded by industrial customers – for example in healthcare, automotive and in consumer electronics.

During this year´s LOPEC Henkel will present its new materials tailored for printed antennas. The company has developed conductive inks that enable the efficient 3D pad printing for a variety of antenna solutions. The newly developed inks can be pad printed directly onto a 3D surface and integrated into the housings, for example of smartphones.

To highlight the pad printing technology and to demonstrate its potentials, Henkel will also exhibit pad printing equipment of its partner Teca-Print, to demonstrate the potentials of the technology.

“Pad printing is a proven processing method for antenna applications with advantages in efficiency, design flexibility and sustainability,” said Aad van der Spuij, business development manager printed electronics at Henkel. “In combination with Teca-Prints expertise our novel materials enable innovative printed electronics solutions for integrated antennas, for example in smartphone housings or other 3D shaped devices. The pad printing technology directly responds to the customer demands for further miniaturization or increasing functionalities and offers potentials in markets such as smart watches, semiconductor or automotive electronics.”

Besides the novel pad printing solutions Henkel will also showcase its growing portfolio for digital healthcare and smart surfaces. Among others, the company will present its INKxperience Kit, including different sensor technologies for leak detection, moisture level sensing and others that enable professional engineers to explore and experiment with the technology of printed electronics. In addition, Henkel will demonstrate a variety of solutions for automotive such as printed heaters and its newly launched sensor demonstrator for healthcare patches as well as smart diaper applications.