Optomec to Present New Micro Dispense Process Using Aerosol Jet Printer for High Density 3D Packaging


Posted on January 22, 2013 @ 03:48 pm



Optomec announced that Dr. Mike Renn, Optomec advanced applications lab director, will give a presentation titled "Aerosol Jet Printing of Conductive Epoxy for 3D Packaging” in the Advanced Materials track at the Pan Pacific Microelectronics Symposium in Hawaii. The conference will be held Jan. 22-24 at the Makena Beach and Golf resort in Maui.

Dr. Renn will discuss how traditional dispensing technologies are typically limited to feature sizes above 100 microns and have limited 3D capability due to near or direct-surface contact with the substrate. Conductive adhesives for these systems typically contain large metallic flakes which lead to inconsistent conductivity in small features such as dots.

The presentation will explain how a new, nanoparticle conductive adhesive when dispensed with an Aerosol Jet Printer, demonstrated non-contact printing over 3D surfaces and into recesses such as through silicon vias (TSV). The conductive adhesive, manufactured by Resin Designs, is a high-solids, nanoparticle system.

The adhesive has superior thermal conductivity, adhesion and elasticity, which are desirable for fabricating heterogeneous connections, such as between IC chips and circuit boards. The material can be Aerosol Jet dispensed with dot sizes down to 25 μm, which enables high-density die attach. Similarly, TSV filling has been demonstrated with via diameters down to 50 μm and depths of 300 μm. The high-solids formulation reduces the material shrinkage during curing resulting in a dense conductive plug.

Aerosol Jet printing has mainly been used for dispensing nanosilver inks for photovoltaics, printed circuits and printed antenna. One major advantage of this system is that fine feature printing, down to 10 μm feature size, can be achieved with a surprisingly large standoff height (up to 10 mm).

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