“One of the most significant hurdles in producing advanced chips is to selectively remove a specific material without damaging other exposed materials in the multi-layer device,” said Dr. Shankar Venkataraman, VP and GM of Applied’s Selective Removal Products Business Unit. “The Selectra system is the latest innovation in our etch portfolio of differentiated products, and creates new market opportunities by delivering the extreme selectivity required to advance Moore’s Law.”
Advanced microchips featuring increasingly complex structures and deep, narrow trenches are creating new manufacturing challenges. One of these challenges is the inability of wet chemistry to penetrate tiny structures; another is the removal of unwanted materials without causing damage.
The Selectra system accesses the smallest spaces, delivering unprecedented materials selectivity and atomic-level etch precision for a wide variety of dielectric, metal and semiconductor films. Its extensive range of processes and ability to achieve precisely controlled residue- and damage-free materials removal targets an expanding number of crucial etch applications for patterning, logic, foundry, 3D NAND and DRAM. The system’s versatility allows chipmakers to manufacture leading-edge 3D devices and to explore new architectures, materials and integration options.
Selectra systems are in volume production at foundry, logic and memory chipmakers.