Product Releases
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Breaking News | Product Releases | RFID and NFC
Savi Technology Launches Sensor to Eliminate In-Transit Blind Spots
Cost-effective industrial IoT device protects billions in global multi-modal shipments.05.15.19
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Breaking News | Conductive Inks and Coatings | Film, Paper, Glass and Substrates | Nanomaterials | Product Releases | Touch Screens
C3Nano Announces Breakthrough Material for Flexible Touchscreen Displays
ActiveGrid Gen 7 Ink delivers excellent clarity, conductivity and flexibility.05.13.19
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Breaking News | Displays and Lighting | Product Releases | Sensors and Wearables
Japan Display Develops Flexible Fingerprint Sensor
Integrates capacitive-type glass-based fingerprint sensor technology and flexible display technology.05.10.19
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Adhesives, Barriers and Encapsulants | Breaking News | Manufacturing | Product Releases | RFID and NFC | Suppliers News
DELO, Mühlbauer, Impinj Achieve Milestone in Efficient RAIN RFID Label Manufacturing
New adhesive a key step towards delivering 100,000 RAIN RFID inlays per hour.05.09.19
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Breaking News | Product Releases | RFID and NFC
Checkpoint Systems’ S20 Reinvents Traditional EAS Antenna
New generation of EAS antenna is designed for retailers whose brand image and customer experience are everything.05.08.19
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Breaking News | Product Releases | RFID and NFC
Alien Technology Unveils Next Generation High-Memory RFID IC, Tags
Higgs 9 high-memory IC delivers industry-leading data integrity and reliability.04.03.19
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Breaking News | Product Releases | RFID and NFC
Schreiner MediPharm, Edelmann Group Develop Demo Version of Smart Packaging Solution
Includes digital and analog technologies for product authentication and tamper evidence.03.29.19
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Breaking News | Product Releases | RFID and NFC
Impinj Innovations Enabling IoT Functionality for Trillions of Everyday Items
New RAIN RFID endpoint IC series will enable connectivity to everyday items in the retail, grocery, consumer packaged goods and logistics markets.03.28.19
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Flexible and Printed Electronics | Printed Batteries | Product Releases
Batteries from the Printer: Evonik Presents New Technology at LOPEC 2019
Evonik highlights TAeTTOOz, a new material technology for printable batteries.03.20.19
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Breaking News | Flexible and Printed Electronics | Product Releases
American Semiconductor, HDM Announce JDA
Will produce world’s first high reliability ultra-thin packaged ICs.02.19.19
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Breaking News | Product Releases | Semiconductors and Quantum Dots | Sensors and Wearables
ON Semiconductor Introduces the RSL10 Sensor Development Kit
Out-of-the-box sensor platform provides enhanced sensor technology with industry’s lowest power Bluetooth Low Energy.02.14.19
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Breaking News | Product Releases | RFID and NFC
FEIG Electronics Designs New Line of Robust UHF Antennas
Operating from below freezing to extremely hot temperatures, the Robust UHF Antennas will work with any reader.02.13.19
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Breaking News | Conductive Inks and Coatings | Product Releases | Smart Cards and Packaging | Suppliers News
Ynvisible’s Displays to Be Used in the Smart Label Sector
The first two contracts are with leading companies in the field of smart labels and related verification and tracking services.02.12.19
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Breaking News | Flexible and Printed Electronics | Product Releases | Smart Cards and Packaging
PragmatIC Launches ConnectIC Family of RFID ICS
ConnectIC family of flexible RFID circuits brings cost-effective digital traceability and interactivity to everyday objects.02.07.19
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Breaking News | Product Releases | Sensors and Wearables
Melexis Launches High Operating Temperature Thermal Sensor Array
Extended temperature range opens up multiple new applications.02.05.19
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Breaking News | Product Releases | RFID and NFC
Identiv, NXP to Make IoT Applications Accessible with Ultra-Low-Cost NFC Inlay
New cost-effective, high-performance inlay designed for customer engagement NFC applications.01.30.19
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3D Printing | Adhesives, Barriers and Encapsulants | Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturers News | Manufacturing | Nanomaterials | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | Product Design and Testing | Product Releases | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Touch Screens | Universities
IDTechEx LIVE! 2018 Shows New Applications for Flexible and Printed Electronics
Foldable smartphones, sensors, smart packaging among the topics that were covered during the second day of the conference.David Savastano, Editor 11.20.18
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Breaking News | Displays and Lighting | Product Releases
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Breaking News | Energy Curing/Sintering | Manufacturing | Product Releases | Suppliers News
XENON Introduces XS-Series, Scalable Set of Pulsed Light Solutions for PE Sintering
Will be debuted at Santa Clara PE-USA, which takes place Nov. 14-15.11.06.18
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Breaking News | Displays and Lighting | Product Releases
Royole Introduces World’s First Commercial Foldable Smartphone
Royole FlexPai has fully flexible display, a combination of mobile phone and tablet.11.02.18
