Raw Materials
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Breaking News | Conductive Inks and Coatings | Flexible and Printed Electronics | Smart Cards and Packaging | Suppliers News
Siegwerk, Prismade Labs Collaborate on Interactive Packaging Innovations
Initial results show high degree of market potential for interactive packaging solutions for an increasingly digital world.09.20.18
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Breaking News | Semiconductors and Quantum Dots | Sensors and Wearables
STMicroelectronics to Show Solutions at Alibaba Computing Conference 2018
ST will showcase some of its products and solutions for IoT and Smart Driving.09.20.18
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Adhesives, Barriers and Encapsulants | Conductive Inks and Coatings | Contract Manufacturing/Printing | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Lab and Testing | Manufacturing | Printed Batteries | Printing | Research Institutions | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Universities
Nextflex Announces Two Affiliated ‘Nodes’ to Support FHE Community in Massachusetts, New York
Nodes to provide regional supply chain support and catalyze FHE development.09.19.18
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Breaking News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables
STMicroelectronics Looks to Make Everything Smarter at IoT World Asia 2018
Showcases comprehensive solutions in connectivity and NFC, AI, power management and sensors for the IoT.09.19.18
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Breaking News | Displays and Lighting | Semiconductors and Quantum Dots | Sensors and Wearables
Osram Emphasizes Semiconductor Technology for Photonics
The Opto Semiconductors (OS) division expects long term revenue growth of 10% over the industry cycle.09.19.18
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Breaking News | Displays and Lighting | Photovoltaics | Semiconductors and Quantum Dots
Quantum Materials Announces Capability to Mass Produce High Performance, Low-Cost Perovskite QDs
Paves the way for next generation solar and display applications incorporating PQD materials.09.18.18
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Breaking News | Conductive Inks and Coatings | Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Smart Cards and Packaging | Suppliers News
Smart Packaging in Cosmetics is Focus of Conductive Ink Panel
Panel discussion will look at how printed electronics are driving sales in retail.09.18.18
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Breaking News | Manufacturing | Mergers and Acquisitions | Semiconductors and Quantum Dots
Thermco Systems Expands Global Operations with Acquisition of CSD Epitaxy Inc.
CSD Epitaxy Inc. manufactures the Epi-pro epitaxy batch reactor.09.18.18
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Breaking News | Displays and Lighting | Electronic Materials
CYNORA Presents Status of Blue TADF Technology for Displays at OLEDs World Summit 2018
A high-efficiency deep-blue emitter for display is mandatory to reach the full potential of the OLED technology.09.18.18
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Breaking News | Conductive Inks and Coatings | Displays and Lighting | Film, Paper, Glass and Substrates | Personnel | Photovoltaics
DowDuPont Announces Senior Leaders of Future Independent Companies, Corteva Agriscience and DuPont
Ed Breen, CEO of DowDuPont, will become executive chairman of DuPont following the separation.09.18.18
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Breaking News | Semiconductors and Quantum Dots | Sensors and Wearables
NXP Semiconductors, Hitachi Solutions Collaborate on Secure DSRC-based V2X Solution for Japan
V2X technology allows vehicles to “see” around corners and communicate with other cars and infrastructure.09.18.18
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Breaking News | Financial News | Semiconductors and Quantum Dots
Qualcomm Initiates $16 Billion Accelerated Share Repurchase
Initial delivery to Qualcomm is approximately 178 million shares in the aggregate.09.17.18
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Breaking News | Mergers and Acquisitions | Semiconductors and Quantum Dots | Sensors and Wearables
Adesto Completes Acquisition of Echelon
Echelon develops open-standard networking platforms for connecting, monitoring and controlling devices.09.17.18
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Breaking News | Semiconductors and Quantum Dots
ON Semiconductor Wins Top 10 Power Product Award 2018 in China
Devices enable advances in high power density, high-efficiency USB-PD and Qualcomm Quick Charge compliant charger design.09.14.18
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3D Printing | Breaking News | Nanomaterials | Research Institutions
VTT, Carbodeon Speed Up 3D printing with Nanodiamonds
The uDiamond filament, patented by Carbodeon, broadens the applications of 3D printing.09.13.18
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Breaking News | Chemicals, Metals and Powders
Dow Announces Investment Plans to Meet Silicones Demand Growth
Incremental debottlenecking and capacity expansion projects to meet global demand for silicone-based solutions.09.13.18
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Breaking News | Conductive Inks and Coatings | Product Releases
DuPont Electronics & Imaging Announces Newest In-Mold Electronics Inks
Second generation materials address key industry needs; build on existing portfolio.09.12.18
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Breaking News | Conductive Inks and Coatings | Contract Manufacturing/Printing | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Manufacturers News | Nanomaterials | Research Institutions | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities
New Electronic and Conductive Inks Conference Shows Path to Future
Leading companies will be on hand to offer their insights into $2 billion market.09.12.18
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Breaking News | Conductive Inks and Coatings | Displays and Lighting | Film, Paper, Glass and Substrates | Financial News | Flexible and Printed Electronics | Photovoltaics
DowDuPont Announces Filing of Initial Form 10 Registration Statement for the New Dow
Form 10 filing continues process of separation of its Materials Science Division.09.12.18
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Breaking News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables
NXP Semiconductors Announces Initiation of a Quarterly Dividend Program
The initial interim dividend for the fourth quarter of 2018 will be $0.25 per ordinary share.09.11.18
