Equipment Center
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Breaking News | Manufacturing | Semiconductors and Quantum Dots | Sensors and Wearables
Applied Venture, Empire State Development Aim to 'Accelerate Innovation' in Upstate NY
New co-investment initiative targets technology startups across a broad range of established and emerging industries.11.16.18
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3D Printing | Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturers News | Manufacturing | Nanomaterials | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | Product Design and Testing | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities
PE USA 2018 Opens with Look at New Technologies
Attendees learn about smart elevators, new manufacturing strategies, gas sensors, printed displays and more.David Savastano, Editor 11.15.18
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3D Printing | Breaking News | Suppliers News
BASF, Materialise, Essentium Join to Advance Industrial Additive Manufacturing
BASF leads a Series A investment round with Materialise as one of the co-investors.11.15.18
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Breaking News | Manufacturing | Printing | Suppliers News
TUT Targets New Printed Intelligence Applications with CeraPrinter F-Serie by CERADROP-MGI
The CERADROP F-Serie is operating in the Laboratory for Future Electronics of Tampere University of Technology (Finland).11.13.18
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Breaking News | Manufacturing | Printing
Optomec Demonstrates Simultaneous 5-Axis Hybrid Metal Printing at FormNext 2018
At its booth (Hall 3.1 Stand J10), Optomec will run demonstrations showcasing simultaneous 5-axis metal printing.11.13.18
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3D Printing | Breaking News | Flexible and Printed Electronics | Lab and Testing | Manufacturing | Suppliers News
Optomec Features Aerosol Jet HD System for High Density Electronics Packaging at PE USA 2018
Aerosol Jet HD System is a compact, configurable R&D to production platform.11.12.18
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Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturers News | Manufacturing | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities
Conference Gives Glimpse into Future of Printed Electronics, Conductive Inks
Smart packaging, displays, RFID and more are covered in inaugural Electronic and Conductive Ink Conference.David Savastano, Editor 11.09.18
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3D Printing | Adhesives, Barriers and Encapsulants | Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturers News | Manufacturing | Nanomaterials | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | Product Design and Testing | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities
PE USA 2018 Focuses on Flexible Printed Electronics, Senors and Related Technologies
Speakers from Jabil, Qualcomm, Hewlett Packard and US Army ARDEC are among the presenters today.David Savastano, Editor 11.09.18
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3D Printing | Adhesives, Barriers and Encapsulants | Chemicals, Metals and Powders | Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturers News | Manufacturing | Nanomaterials | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | Product Design and Testing | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities
PE USA 2018 Features Look at Flexible Electronics, Sensors and More
From healthcare and smart systems to wearables, sensors and more, IDTechEx LIVE! will highlight new technologies.David Savastano, Editor 11.09.18
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3D Printing | Breaking News
New KODAK Portrait 3D Printer Available
Debuts at Formnext. Available in North America and Europe.11.09.18
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Breaking News | Energy Curing/Sintering | Flexible and Printed Electronics | Manufacturing | Research Institutions
NovaCentrix: Photonic Soldering Enables Flexible Electronics Integration
Photonic soldering enables off-the-shelf solders to bond surface-mount electronics to polymer films in seconds.11.08.18
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Breaking News | Manufacturing | Photovoltaics
Meyer Burger Awarded Contract for Newest Generation Wafer Inspection System
A leading PV manufacturer from China has ordered 20 tools developed by Meyer Burger’s subsidiary, Hennecke Systems.11.08.18
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Breaking News | Energy Curing/Sintering | Manufacturing | Product Releases | Suppliers News
XENON Introduces XS-Series, Scalable Set of Pulsed Light Solutions for PE Sintering
Will be debuted at Santa Clara PE-USA, which takes place Nov. 14-15.11.06.18
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3D Printing | Adhesives, Barriers and Encapsulants | Breaking News | Chemicals, Metals and Powders | Conductive Inks and Coatings | Contract Manufacturing/Printing | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Lab and Testing | Manufacturing | Nanomaterials | Photovoltaics | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Printing | Research Institutions | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables | Smart Cards and Packaging | Touch Screens | Universities
Organic, Printed Electronics Industry Expects 9% Sales Revenue Increase in 2018
For OE-A members, the growth trend of this international industry remains stable.11.06.18
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3D Printing | Breaking News
BASF Invests in Chinese 3D Printing Specialist Prismlab
First direct investment by BASF Venture Capital in a company in China.11.06.18
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3D Printing | Breaking News
Eastman Kodak, Evolve Additive Solutions, Inc. Partner
The companies signed Joint Development Agreements for equipment and materials.11.06.18
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Breaking News | Lab and Testing
Harper Corporation of America Earns ISO 9001:2015 Recertification
Harper Corporation of America earned its initial certification in 1996 and has maintained compliance for more than 20 years.11.05.18
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Breaking News | Electronic Materials | Flexible and Printed Electronics | Graphene, Perovskites and Carbon Nanotubes | Manufacturing | Photovoltaics | Research Institutions | Sensors and Wearables
Large Canadian Contingent Expected at IDTechEx Show
Canada was well represented last year with more than 40 Canadian organizations on hand.11.05.18
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3D Printing | Breaking News
Henkel Launches New Materials, Adhesive Solutions for 3D Printing
The company will be in hall 3.1, booth H59 from Nov. 13-16.11.05.18
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Breaking News | Conductive Inks and Coatings | Energy Curing/Sintering | Flexible and Printed Electronics | Lab and Testing | Manufacturing | Mergers and Acquisitions
NovaCentrix Acquires Copper Ink Formulations in Asset Sale from Intrinsiq Materials
Dr. Michael Carmody, Intrinsiq Materials’ chief scientist, has joined NovaCentrix.11.01.18
