A larger wafer diameter allows more semiconductor devices to be produced from a single wafer, doubling the amount of dies per wafer compared to existing 8-inch wafer formats. This increased utilization of existing materials simultaneously reduces both chemical and packaging waste and energy consumption.
“We worked closely with NXP to create a solution that would truly offer a higher production output and at the same time be more sustainable,” said George Dyche, director, global RFID innovation and product line management, Avery Dennison RFID.
The chips can also be incorporated into Avery Dennison’s SmartFace Technology, which removes the plastic material in RFID products and replaces it with a paper substrate to reduce environmental impact. SmartFace Technology has already been used in a number of Avery Dennison RFID inlays and the introduction of the new wafer will reduce the environmental impact of RFID solutions further.