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    Breaking News

    STMicroelectronics Announced Availability of Latest NFC Devices for Contactless Payments

    STMicroelectronics delivers NFC technology for secure contactless payments and IoT applications.

    Related CONTENT
    • STMicroelectronics Designs Miniature Multi-Sensor Module for IoT and Wearables
    • Graphene Enables Fully Flexible NFC Antennas
    • STMicroelectronics Advances Single-Chip Telematics/Connectivity Processors
    • STMicroelectronics Creates Turnkey, Certification-Ready Solution for Wearable Devices
    • Smartrac Technology Blends Convenience, Safety for Vitamix
    02.22.17
    STMicroelectronics has announced availability of its latest-generation NFC devices for contactless payments and data exchange.
     
    The new devices include the ST21NFCD NFC controller featuring the booster technology ST has recently acquired, and two new members in the ST54 System-in-Package (SiP) family that integrate the company’s latest Secure Element technology.
     
    The ST21NFCD chip features active load modulation for faster, smoother transactions over longer distances, delivering better user experiences in mobiles, wearables, or IoT devices.
     
    ST’s latest NFC devices will be on show at Mobile World Congress in Barcelona, Feb 27-March 2.
     
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    • iot
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    • stmicroelectronics
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    STMicroelectronics Offers NFC Reader and Discovery Kit STMicroelectronics Offers NFC Reader and Discovery Kit
    NXP Delivers New Secure Element Chip to Protect Data across Mobile, IoT Devices NXP Delivers New Secure Element Chip to Protect Data across Mobile, IoT Devices
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    STMicroelectronics Delivers More than One Million Developer Kits for STM32 Microcontrollers STMicroelectronics Delivers More than One Million Developer Kits for STM32 Microcontrollers
    Senet, STMicroelectronics and myDevices Show Benefits of LPWAN Technology at CES 2017 Senet, STMicroelectronics and myDevices Show Benefits of LPWAN Technology at CES 2017
    Smartrac Technology Blends Convenience, Safety for Vitamix Smartrac Technology Blends Convenience, Safety for Vitamix

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      New attendance record at the event featuring speakers from Airbus, Continental, IBM and Polar.
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      Meyer Burger Acquires Stake in Oxford PV

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      VTT Posts Results for 2018

      VTT Posts Results for 2018

      Net turnover of the VTT parent company increased by 4.3% to €15.5 million.
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    • Breaking News | Research Institutions | Research Reports | Semiconductors and Quantum Dots
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      Meyer Burger Announces Fiscal Year 2018 Results; Re-sized Executive Board

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    • Breaking News | Financial News | Semiconductors and Quantum Dots

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      Reported revenue of $5.84 billion compared to $7.35 billion for the same period last year.
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    • Breaking News | RFID and NFC
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      IoT in Health Care Market to Grow at 19.9% CAGR Between 2019-2025: Research

      IoT in Health Care Market to Grow at 19.9% CAGR Between 2019-2025: Research

      Valued at USD$147.1 billion in 2018.
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    • Breaking News | Manufacturing | Photovoltaics

      Meyer Burger Awarded CHF 15 Million Contract for MAiA 6.1 Cell Coating Equipment

      Received an order from an existing Asian customer.
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    • Breaking News | Personnel | Research Institutions
      VTT CEO Antti Vasara Appointed President of EARTO

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      The objective of EARTO is to promote the views of research and technology organizations in the EU and its decision-making.
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    • Breaking News | Flexible and Printed Electronics | Semiconductors and Quantum Dots

      Largest SEMICON China Opens

      Smart tech, industry growth and workforce development in focus.
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    Breaking News
    • LOPEC: Printed Electronics Conquering Numerous Application Sectors
    • Meyer Burger Acquires Stake in Oxford PV
    • VTT Posts Results for 2018
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    View Breaking News >
    CURRENT ISSUE

    Spring 2019
    • New Opportunities in the Automotive Industry
    • RFID and the Future of Retail
    • The Conductive Ink and Materials Market
    • Equipment Manufacturers Report Growth in Flexible Electronics
    • Flexible Electronics in Healthcare
      • View More >

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