• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    NextFlex Initiates $10.5 Million Worth of Projects with Lockheed Martin, HPE and Others

    Awards contracts totaling $45 million to date for developing FHE into a commercially vialable US industry.

    Related CONTENT
    • Brewer Science to Show Smart Devices, Printed Electronics Capabilities at Innovation Days
    • Aionx’s CleanSURFACES Uses Conductive Traces for Antimicrobial Mats
    • Argonne National Laboratory Hosting Materials for Printed Hybrid Electronics Webinar
    • NextFlex Announces 2021 Fellow Awards Winners
    • Binghamton University Offering NextFlex FlexPro Training
    04.27.17
    NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, announced it will oversee $10.5 million in funding ($4.26 million cost-share) for five development agreements stemming from Project Call 2.0 from May 2016. This brings the total cost-shared value of contracts from all Project Calls to $45 million, demonstrating the continued confidence of industry leaders to bring FHE to widespread adoption.

    FHE exists at the intersection of printed circuitry, passive devices and sensor systems and thin, flexible silicon chips. The result is a new class of lightweight, low cost, flexible, stretchable, conformable and efficient devices for the Internet of Things (IoT), medical, robotics and communication markets. Specifically, Project Call 2.0 focuses on the areas identified in the NextFlex Manufacturing Roadmap that strive to bridge industries such as pharmaceutical, food and agriculture with IoT and wireless communications for real-time data and analysis (e.g., temperature, UV exposure and other environmental conditions for perishable products).

    As seen with several of the contract winners, Project Call 2.0 is funding advanced manufacturing processes, equipment, materials and workforce development initiatives needed for production of these FHE devices. To build on this momentum, NextFlex reports that it will be releasing Project Call 3.0 in May.

    “We’ve seen incredible interest from industry, academia and government leaders for bringing FHE to the mainstream, with $45 million in funding as proof of this united commitment,” Dr. Malcolm Thompson, executive director of NextFlex, noted. “Our mission at NextFlex is clear – to catalyze US manufacturing by accelerating development of a sustainable supply chain, establishing manufacturing excellence and growing the advanced manufacturing workforce, all of which are essential to cost-effective, high-volume manufacture of FHE-based products.”

    More details on the five projects chosen for this latest round of awards are below:

    • Meyer Burger – (NextFlex member partners: DuPont, Eastman Chemical Co. and Intrinsiq Materials)
    Project: Microfab multiprocessing R&D and pilot system for FHE applications
    Meyer Burger’s fully automated GEN2.5 multi-process tool for manufacturing of FHE devices will leverage key partners’ materials for development and product prototyping. The dual-station dual-head inkjet printing capability enables real-time metrology for advanced process control and world-record sub-15-micron feature-size printing. Maximum flexibility in product prototyping is achieved by quick change-outs of digital image, recipe and print head assembly thereby substantially shortening time-to-market and significantly reducing risk in volume ramp-up.

    • Georgia Institute of Technology – (NextFlex member partners: DuPont and Binghamton University)
    Project: Development of test methods and standards to assess reliability of FHE systems
    Georgia Tech will develop various mechanical test methods that are intended to assess the performance and reliability of FHE. In particular, this proposal will focus on monotonic stretch tests, bending tests of different radii and twisting tests of different angles to assess the mechanical fracture limits as well as fatigue tests under stress/strain conditions.

    • SI2 Technologies – (NextFlex member partners: Raytheon and University of Mass-Lowell)
    Project: FHE X-Band antenna arrays for next generation deployable antennas
    SI2 is teaming with its partners to develop an FHE X-band antenna array. A flexible FHE array will be manufactured, which will represent a subsection of a full FHE array that can be mounted on a rigid frame for testing. This will open new market applications for phased arrays.

    • Lockheed Martin – (NextFlex member partners: Binghamton University, General Electric Company, Optomec, Intrinsiq Materials and University of Maryland)
    Project: Conformal printing of conductor and dielectric materials on complex 3D surfaces
    Lockheed, together with its partners, will enable 3D conformal electronics by advancing tooling, software and processes to deposit functional materials on complex 3D geometries. The company will install pilot lines at the NextFlex Technology Hub and in New York using an aerosol jet print system with 10-micron feature size, 10-micron repeatability and software to generate high-fidelity 3D toolpath from CAD model import and program control of a multi-axis drive motion printer. As a result, Lockheed will deliver conformal sensors, 3D antenna structures and non-planar circuit routing demonstrators.

    • Hewlett Packard Enterprise (HPE) – (NextFlex member partners: Georgia Institute of Technology, Stanford University and University of California, Santa Barbara)
    Project: FHE process design kit
    HPE will create an integrated, open-source FHE design and simulation flow process design kit (FHE-PDK) that can be applied to all kinds of FHE technologies and thinned silicon chips to create an application-design-manufacture ecosystem as done by the semiconductor industry today. Once a reliable PDK is developed, various use cases of FHE can be simulated for manufacturability.
    Related Searches
    • iot
    • electronics
    • sensors
    • dupont
    Suggested For You
    Brewer Science to Show Smart Devices, Printed Electronics Capabilities at Innovation Days Brewer Science to Show Smart Devices, Printed Electronics Capabilities at Innovation Days
    Aionx’s CleanSURFACES Uses Conductive Traces for Antimicrobial Mats Aionx’s CleanSURFACES Uses Conductive Traces for Antimicrobial Mats
    Argonne National Laboratory Hosting Materials for Printed Hybrid Electronics Webinar Argonne National Laboratory Hosting Materials for Printed Hybrid Electronics Webinar
    NextFlex Announces 2021 Fellow Awards Winners NextFlex Announces 2021 Fellow Awards Winners
    Binghamton University Offering NextFlex FlexPro Training Binghamton University Offering NextFlex FlexPro Training
    FLEX 2021 Looks at Sensors and MEMS, Flexible Power FLEX 2021 Looks at Sensors and MEMS, Flexible Power
    NextFlex Massachusetts Provides Node Update NextFlex Massachusetts Provides Node Update
    FLEX 2021 Opens Virtually with Sessions on FHE, Materials FLEX 2021 Opens Virtually with Sessions on FHE, Materials
    Bayflex Solutions Expands Endurance Test Capabilities at NextFlex Technology Hub Bayflex Solutions Expands Endurance Test Capabilities at NextFlex Technology Hub
    NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations NextFlex Launches $14 Million Funding Round for Flexible Hybrid Electronics Innovations
    FLEX Conference Has Come a Long Way in 20 Years FLEX Conference Has Come a Long Way in 20 Years
    Sustainability, Innovation Will Be Highlights for 2021 FLEX Sustainability, Innovation Will Be Highlights for 2021 FLEX
    FlexFactor Debuts in South Carolina FlexFactor Debuts in South Carolina
    Brewer Science Bringing Sensors to the Factory Brewer Science Bringing Sensors to the Factory
    NextFlex Virtual Workshop: FHE for Automotive Applications NextFlex Virtual Workshop: FHE for Automotive Applications

    Related Breaking News

    • Breaking News | Photovoltaics | Research Institutions
      NREL Creates Highest Efficiency 1-Sun Solar Cell

      NREL Creates Highest Efficiency 1-Sun Solar Cell

      Researchers created a solar cell with a record 39.5% efficiency under 1-sun global illumination.
      05.19.22

    • Breaking News | Manufacturers News | Sensors and Wearables
      Emerson Earns Third Consecutive 2022 ENERGY STAR Partner of the Year Award

      Emerson Earns Third Consecutive 2022 ENERGY STAR Partner of the Year Award

      As a three-time winner, Sensi is the only smart thermostat to win the Sustained Excellence Award from ENERGY STAR.
      05.18.22

    • 3D Printing | Breaking News | Contract Manufacturing/Printing | Manufacturers News
      Jabil Strengthens Additive Manufacturing Offerings

      Jabil Strengthens Additive Manufacturing Offerings

      Adds new PK 5000 engineered material and digital manufacturing expansions.
      05.17.22


    • 3D Printing | Breaking News | Manufacturers News
      HP Delivers Enhanced Platform Capabilities to Accelerate Additive Manufacturing Production at Scale

      HP Delivers Enhanced Platform Capabilities to Accelerate Additive Manufacturing Production at Scale

      Advancements to HP Jet Fusion 5200 platform deliver on speed, quality, cost, reliability.
      05.17.22

    • Breaking News | Graphene, Perovskites and Carbon Nanotubes | Manufacturers News | Photovoltaics | Sensors and Wearables
      Google Cloud, Saule Technologies and Columbus Energy Begin Strategic Cooperation

      Google Cloud, Saule Technologies and Columbus Energy Begin Strategic Cooperation

      Working on innovations in the energy and IoT sectors using perovskite solar cells.
      05.16.22

    • Breaking News | Graphene, Perovskites and Carbon Nanotubes | Research Institutions
      Graphene Flagship Launches Its First Customizable Wafer Run

      Graphene Flagship Launches Its First Customizable Wafer Run

      2D Experimental Pilot Line offers developers the chance to test graphene-based sensors on large scale and at low cost.
      05.16.22


    • Breaking News | Manufacturers News | Product Releases | Sensors and Wearables
      Tekscan, Calspan to Reveal Dynamic Tire Testing Approach at Tire Technology Expo

      Tekscan, Calspan to Reveal Dynamic Tire Testing Approach at Tire Technology Expo

      Has instrumented its flat track tire testing machine with Tekscan’s High-Speed TireScan pressure mapping sensors to measure tire contact patch pressure.
      05.10.22

    • Breaking News | Research Institutions | Sensors and Wearables
      POLYN Technology, Fraunhofer Mikroelektronik Design Ultra-Low-Power Tiny AI NASP Chips

      POLYN Technology, Fraunhofer Mikroelektronik Design Ultra-Low-Power Tiny AI NASP Chips

      The neurons are implemented using operational amplifiers and axons by using thin-film resistors.
      05.09.22

    • Breaking News | Financial News | RFID and NFC | Sensors and Wearables
      Emerson Reports 2Q 2022 Results

      Emerson Reports 2Q 2022 Results

      Net sales were $4.8 billion, up 8% from the year prior; underlying sales were up 10%.
      05.06.22


    • Breaking News | Displays and Lighting | Research Institutions
      Fraunhofer Launches New Addition to the Microdisplay Family

      Fraunhofer Launches New Addition to the Microdisplay Family

      Microdisplays for wearables must display information in a way that they are sufficiently bright under daylight conditions
      05.06.22

    • Breaking News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables
      STMicroelectronics Publishes 25th Annual Sustainability Report

      STMicroelectronics Publishes 25th Annual Sustainability Report

      On track to become carbon neutral by 2027 with more than 50% purchased electricity coming from renewable sources.
      05.04.22

    • Breaking News | Financial News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables
      NXP Semiconductors Reports 1Q 2022 Results

      NXP Semiconductors Reports 1Q 2022 Results

      Revenue was $3.14 billion, up 22.2% year-on-year, while GAAP gross margin was 56.7% and GAAP operating margin was 27.8%.
      05.04.22


    • Breaking News | Manufacturers News | Personnel | Sensors and Wearables
      Isorg Appoints Dieter May as New CEO

      Isorg Appoints Dieter May as New CEO

      May will pioneer new growth phase for sensors at Isorg, taking over from founder Jean-Yves Gomez, who becomes CIO.
      05.04.22

    • Breaking News | Research Institutions | Sensors and Wearables
      Plastics Get a Unique Digital Watermark Due to MEMS Technology

      Plastics Get a Unique Digital Watermark Due to MEMS Technology

      Worked with matriq AG to develop a marking technology for plastics called DynamicMold.
      05.03.22

    • Breaking News | Research Institutions
      Imec honors Bill Gates with the Lifetime of Innovation Award

      Imec honors Bill Gates with the Lifetime of Innovation Award

      Microsoft created the PC DOS operating system which they delivered to IBM and introduced Microsoft Office in 1989.
      05.03.22

    Breaking News
    • InnovationLab Acquires Flexible Printed Battery Technology from Evonik
    • Canatu Receives IATF 16949:2016 Certification
    • Applied Materials Announces 2Q 2022 Results
    • ams OSRAM Supervisory Board to Elect Dr. Margarete Haase as Chairwoman
    • Weekly Recap: Graphene Flagship, Japan Display and LG Display Top This Week’s Stories
    View Breaking News >
    CURRENT ISSUE

    Winter 2021

    • Printed Electronics Now’s International Suppliers’ Directory
    • The Automotive Market and Flexible and Printed Electronics
    • Flexible and Printed Electronics in Healthcare
    • Flexible and Printed Electronics Make Gains in Smart Packaging
    • PAPERONICS: Low-cost multisensory paper and packaging applications
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    Thorne Relaunches Gut Health Test with Microbiome Wipe
    Alkemist Labs Announces Alkemist Assured Seal and Next Generation Transparency Reports
    GC Rieber Foundations Expand Philanthropic Efforts
    Coatings World

    Latest Breaking News From Coatings World

    PPG Hosts The Future of Coatings' Technology Innovation Day in Amsterdam
    Azelis Expands Presence in India with Acquisition of Chemo India and Unipharm Laboratories
    Teknos Publishes Sustainability Report
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    Pediatric Medical Device Competition Reveals Five Finalists
    Medical Device Packaging Market to Reach $34B by 2027
    Penumbra Secures CE Mark for its Advanced Mechanical Thrombectomy Tech
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Mirum Pharmaceuticals Acquires San Diego-based Satiogen
    Catalyst Biosciences Sells Complement Portfolio to Vertex Pharmaceuticals
    Insmed Appoints Drayton Wise as Chief Commercial Officer
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    La Roche-Posay Launches Matte Moisturizer for Oily Skin
    3 Amorepacific Employees Stole $2.3 Million
    L'Oreal CEO Nicolas Hieronimus On Sustainability Initiatives
    Happi

    Latest Breaking News From Happi

    Thayers Natural Remedies Celebrates 175 Years with Social Campaign
    Former Model Shirley Powell’s Indie Beauty Brand LaJeanell Comprises Gender Inclusive Skincare and Makeup
    L’Oréal's New UVMune 400 Sun Filtering Technology Protects Skin From Ultra-Long UVA Rays
    Ink World

    Latest Breaking News From Ink World

    Flint Group Flexible Packaging Europe Implements Further Price Increase
    Nazdar Launches 205 Series Inks for Roland TrueVIS SG2 and VG2 Series Printers
    Quad Adds Landa S10P Nanographic Printing Press
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    AWA to host 22nd Global Release Liner Industry Conference & Exhibition
    Domino assists Grace Label with supply chain disruptions
    Rotocon wins AI Business Excellence Award
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Rael Raises $35M in Series B Funding
    Schobertechnologies Offers Rotary Web-fed Converting Solutions
    Thorne Relaunches Gut Health Test with Microbiome Wipe
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    Study Confirms Knee Shapes are Highly Individualized
    Stryker Launches EasyFuse Dynamic Compression for Foot & Ankle
    Extremity Medical Rolls Out OMNI Stable Ankle Fracture System
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    InnovationLab Acquires Flexible Printed Battery Technology from Evonik
    Canatu Receives IATF 16949:2016 Certification
    Applied Materials Announces 2Q 2022 Results

    Copyright © 2022 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login