The 6,000 square foot center houses a collaboration and training area, as well as a lab space where Avery Dennison engineers and scientists can work with customers’ engineering teams in three key areas to create application solutions.
• Rapid Prototyping: On-site library of adhesives, carriers, liners and lamination equipment facilitates custom sample turnaround as quickly as same-day. Laser and flatbed die cutting performs custom die cut geometry and optimization.
• Material and Substrate Characterization: Measures mechanical properties such as force deflection, fracture toughness, tensile and elongation, wetting and surface energy characterization.
• Performance Testing: Industry-standard testing focuses on semi-structural adhesive tapes, impact resistance, chemical resistance and waterproof testing.
Avery Dennison’s new center is the region’s only facility providing full service prototyping, custom testing and material characterization for functional bonding solutions at a single location.
“Avery Dennison’s investment in facilities, equipment and human resources reflects the business potential we see in the electronics sector for high performance adhesive tapes,” said Dr. Robert Medsker, senior director, global R&D, Performance Tapes industrial segment.
The Electronics Solutions and Technology center is now open to customers for same day solutions. The official open house will take place in early July.
Primary applications serviced at the lab include laptops, tablets, notebooks, mobile phones and other electronics requiring engineered pressure sensitive adhesives (PSA) solutions.