• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Add Your Company
      • Suppliers Guide
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    Brewer Science Delivers Key Semiconductor Materials to Leading-Edge Manufacturers in Taiwan

    Company experts address front- and back-end trends driving the global semiconductor industry at SEMICON Taiwan.

    Related CONTENT
    • Brewer Science Celebrates 40th Anniversary
    • Printed Electronics Now’s Top Stories for 2020
    • Brewer Science Bringing Sensors to the Factory
    • COVID-19 and the Printed Electronics Industry
    • Brewer Science Announces Employee Ownership Program
    09.18.17
    Brewer Science, Inc. announced its participation in SEMICON Taiwan 2017. The company will share in a knowledge exchange about semiconductor-manufacturing trends in Taiwan that are emerging in both front- and back-end materials, and process steps for next-generation manufacturing.
     
    Today’s consumer electronics, networking, high-performance computing (HPC) and automotive applications rely on semiconductor devices that offer more performance and functionality while generating less heat and operating at lower power, all packed into a small form factor.
     
    Leading foundries and integrated device manufacturers (IDMs) continue to push the limits of device scaling beyond 7 nm toward 3 nm, with Moore’s law driving front-end process development. At the same time, all eyes are on the innovative advanced-packaging approaches being developed by outsourced semiconductor assembly and test (OSAT) companies that are offering another very strong approach to achieving these requirements.
     
    Brewer Science recognizes that the industry needs the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration capabilities that require advanced-packaging innovations. The company has invested in developing specialty materials and processes that support both, from its robust portfolio of temporary bond/debond materials and processes for fan-out packaging (FO) and 3D IC manufacturing processes to its EUV and DSA materials for advanced lithography processes.
     
    Taiwan’s semiconductor-manufacturing industry is committed to advanced-node lithography as well as the high-volume manufacturing (HVM) of advanced wafer-level packaging. Additionally, the region has a strong display-industry infrastructure.
     
    “Taiwan’s leading-edge foundries, research institutes and OSATs have always been highly regarded as leaders in semiconductor manufacturing,” said Dr. Terry Brewer, president and CEO, Brewer Science. “We are committed to supporting Taiwanese innovation, from device design through high-volume manufacturing, with leading-edge material sets and processes that address the supply chain needs of both front-end silicon and back-end advanced wafer-level packaging architectures.”
     
    Back-end Trends
     
    Discussions surrounding FO architectures, at both the wafer and panel levels, are dominating the packaging scene for system-in-package and heterogeneous-integration applications. The focus is primarily on the chips-first approach, which has been in production for almost nine years, and the RDL-first approach, which is targeted at more advanced architectures. Both must accommodate more die in the same package, which is increasing stress and contributing to wafer bow. This calls for temporary carrier support throughout the process. Additionally, while not yet adopted into manufacturing, OSATs are gearing up for FO panel-level processes (FO-PLP).
     
    Adoption of these approaches is driving interest in laser-release debond approaches that are suited to glass-substrate support processes for RDL first and FO-PLP. Brewer Science’s latest generation of debond materials is designed for laser release.
     
    “In Taiwan, we are working closely with research institutes and OSATs to implement both our wafer- and panel-level bonding materials in all approaches to FO, as well as 2.5D and 3D integration schemes,” said Jim Lamb, deputy CTO, Brewer Science.
     
    Brewer Science CTO Dr. Tony Flaim presented the company’s latest wafer bond/debond solutions for advanced packaging during SEMI’s co-located 3D Technology Forum on, Sept. 14.
     
    Front-end Trends
     
    Leading-edge manufacturing is now at 10 nm, with dimensions under 10 nm and beyond not far off now that the extreme ultraviolet (EUV) lithography process is becoming a reality. Many companies have committed to a roadmap that extends beyond 3 nm.
     
    Directed self-assembly (DSA), in which the material itself forms the lithography pattern, is a paradigm shift in lithography that complements EUV. Best suited for devices with multiple, repeating, regular fine-pitch features, DSA can achieve 30-nm feature sizes without requiring additional masks. EUV can be used to pattern lower-resolution features on a wafer and create spacers for subsequent DSA deposition.
     
    “While still in its developmental stages, DSA is on target to be production-ready within two years,” said Lamb. “Together, DSA and EUV offer a complementary set of benefits for IDMs and foundries to advance their manufacturing capabilities. Taiwanese manufacturers are leading the way with continued scaling efforts that comprise both DSA and EUV technologies.”
     
    Lamb delivered a presentation titled Extending Lithography with Advanced Materials and Manufacturing Excellence during SEMI’s IC Forum at SEMICON Taiwan, on Sept. 15.
    Related Searches
    • display
    • inc
    • brewer science
    • semiconductor
    Suggested For You
    Brewer Science Celebrates 40th Anniversary Brewer Science Celebrates 40th Anniversary
    Printed Electronics Now’s Top Stories for 2020 Printed Electronics Now’s Top Stories for 2020
    Brewer Science Bringing Sensors to the Factory Brewer Science Bringing Sensors to the Factory
    COVID-19 and the Printed Electronics Industry COVID-19 and the Printed Electronics Industry
    Brewer Science Announces Employee Ownership Program Brewer Science Announces Employee Ownership Program
    Brewer Science Earns Perfect Quality Score from ON Semiconductor Brewer Science Earns Perfect Quality Score from ON Semiconductor
    Brewer Science Adds Dr. Srikanth (Sri) Kommu to Senior Executive Leadership Team Brewer Science Adds Dr. Srikanth (Sri) Kommu to Senior Executive Leadership Team
    Brewer Science Receives Top Workplace Ranking for Culture of Creativity Brewer Science Receives Top Workplace Ranking for Culture of Creativity
    Brewer Science Recognized with FLEXI Award Brewer Science Recognized with FLEXI Award
    Brewer Science Celebrates 10 Years of Technological Discoveries at JVIC Brewer Science Celebrates 10 Years of Technological Discoveries at JVIC
    Brewer Science Showcases Enabling Sensor Technology for Smart Cities at COMPUTEX TAIPEI 2017 Brewer Science Showcases Enabling Sensor Technology for Smart Cities at COMPUTEX TAIPEI 2017
    Brewer Science Announces Sale of Equipment Unit Brewer Science Announces Sale of Equipment Unit
    Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill Certification Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill Certification
    Brewer Science CTO Tony Flaim to Give Keynote at Symposium Brewer Science CTO Tony Flaim to Give Keynote at Symposium
    Performance, Cost are Key Drivers for Selecting Conductive Inks Performance, Cost are Key Drivers for Selecting Conductive Inks

    Related Breaking News

    • Breaking News | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Sensors and Wearables | Suppliers News

      Canatu Earns Honors in Finland from Deloitte Technology Fast 50

      Canatu had fiscal year revenue growth of 399% during the period of 2016 to 2019, placing Canatu 42nd on the list.
      David Savastano, Editor 01.27.21

    • Breaking News | Semiconductors and Quantum Dots
      North American Semiconductor Equipment Industry Posts December 2020 Billings

      North American Semiconductor Equipment Industry Posts December 2020 Billings

      The billings figure is 2.6% higher than the final November 2020 billings of $2.61 billion.
      Anthony Locicero, Associate editor 01.27.21

    • Breaking News | Mergers and Acquisitions | Photovoltaics
      First Solar Signs Definitive Agreement to Sell US Development Platform to Leeward

      First Solar Signs Definitive Agreement to Sell US Development Platform to Leeward

      Acquisition comprises 1.8 GWDC of First Solar modules, of which 744 MWDC represent new bookings.
      Anthony Locicero, Associate editor 01.27.21


    • Breaking News | Photovoltaics
      Midsummer Signs Cooperation Agreement in Spanish Market

      Midsummer Signs Cooperation Agreement in Spanish Market

      This is Midsummer’s third major cooperation agreement signed on the Iberian Peninsula.
      Anthony Locicero, Associate editor 01.27.21

    • Breaking News | Conductive Inks and Coatings | Flexible and Printed Electronics
      PRINTING United Alliance Announces TAGA Presents Virtual Event

      PRINTING United Alliance Announces TAGA Presents Virtual Event

      Registration is free and now open for the two-day session.
      Anthony Locicero, Editor 01.26.21

    • Breaking News | Research Institutions | Semiconductors and Quantum Dots
      ITRI, DuPont Jointly Inaugurate Semiconductor Materials Lab

      ITRI, DuPont Jointly Inaugurate Semiconductor Materials Lab

      DuPont, in collaboration with ITRI, will conduct semiconductor material research, development and enhancement, and accelerate pilot testing.
      Anthony Locicero, Associate editor 01.26.21


    • Breaking News | Personnel | RFID and NFC
      Identiv Appoints Leigh Dow as VP of Marketing

      Identiv Appoints Leigh Dow as VP of Marketing

      Newly created role is part of the company’s ongoing transformation to become the leading provider of security and identity solutions.
      Anthony Locicero 01.26.21

    • Breaking News | Flexible and Printed Electronics | Research Institutions
      Imec Technology Taking Off to Space

      Imec Technology Taking Off to Space

      Imec will validate three of its technologies in a spaceflight environment. Being compact and sophisticated makes these systems attractive for implementation.
      Anthony Locicero, Associate editor 01.26.21

    • Breaking News | Displays and Lighting
      Osram in Top 25 of World’s 100 Most Sustainable Companies

      Osram in Top 25 of World’s 100 Most Sustainable Companies

      Out of approximately 7,400 worldwide companies, Osram ranks 23rd.
      Anthony Locicero, Associate editor 01.26.21


    • Breaking News | Graphene, Perovskites and Carbon Nanotubes | Research Institutions
      Graphene Flagship Study Predicts Increased Market Penetration by 2025

      Graphene Flagship Study Predicts Increased Market Penetration by 2025

      Most immediate applications of graphene, such as composites, inks and coatings are already commercially available.
      Anthony Locicero, Associate editor 01.25.21

    • Breaking News | RFID and NFC
      STMicroelectronics Powers NFC Applications with Message Content, Anti-Tamper in New Type-5 Tags

      STMicroelectronics Powers NFC Applications with Message Content, Anti-Tamper in New Type-5 Tags

      Tags deliver advantages such as extended communication range with superior reliability.
      Anthony Locicero, Associate editor 01.25.21

    • Breaking News | Suppliers News
      DuPont, Corteva, Chemours Announce Resolution of Legacy PFAS Claims

      DuPont, Corteva, Chemours Announce Resolution of Legacy PFAS Claims

      Companies also settle remaining Ohio multi-district PFOA litigation.
      Anthony Locicero, Associate editor 01.25.21


    • Breaking News | Displays and Lighting

      UDC Subsidiary Adesis' Website Wins 2020 MarCom Platinum Award

      “Our website is one of the primary thresholds to our brand," said Andrew Cottone, president of Adesis, Inc.
      Anthony Locicero, Associate editor 01.25.21

    • Breaking News | Semiconductors and Quantum Dots
      Ambiq Wins IoT Semiconductor Company of the Year Award

      Ambiq Wins IoT Semiconductor Company of the Year Award

      Ambiq believes that innovation is essential to the advancement of human society.
      Anthony Locicero, Associate editor 01.22.21

    • Breaking News | Displays and Lighting | Flexible and Printed Electronics | Personnel | Suppliers News
      Ynvisible Names Michael Robinson CEO, Jani-Mikael Kuusisto SVP Ventures

      Ynvisible Names Michael Robinson CEO, Jani-Mikael Kuusisto SVP Ventures

      Ynvisible is focusing on speed to market for customer products and sustainable financial growth.
      David Savastano, Editor 01.22.21

    Trending
    • Osram In Top 25 Of World’s 100 Most Sustainable Companies
    • DuPont, Corteva, Chemours Announce Resolution Of Legacy PFAS Claims
    • Phiaro Corporation Incorporates TactoTek IMSE Smart Surfaces Into Customer Projects
    • Graphene Flagship Study Predicts Increased Market Penetration By 2025
    • ITRI, DuPont Jointly Inaugurate Semiconductor Materials Lab
    Breaking News
    • Canatu Earns Honors in Finland from Deloitte Technology Fast 50
    • North American Semiconductor Equipment Industry Posts December 2020 Billings
    • Midsummer Signs Cooperation Agreement in Spanish Market
    • First Solar Signs Definitive Agreement to Sell US Development Platform to Leeward
    • PRINTING United Alliance Announces TAGA Presents Virtual Event
    View Breaking News >
    CURRENT ISSUE

    Fall 2020

    • Flexible Electronics Is Proving to Be Ideal for Healthcare
    • COVID-19 and the Printed Electronics Industry
    • Smart Packaging Looks to Move Forward
    • Electronic & Conductive Ink Conference Showcases Future of Ink Technology
    • Printed Electronics Now’s International Suppliers’ Directory
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    PepsiCo and Beyond Meat Partner to Develop Plant-Based Protein
    New Study on Sage Extract Formula Suggests Memory Enhancement
    Omega-3s Evidenced to Reduce Low-Grade Inflammation in Elderly Men
    Coatings World

    Latest Breaking News From Coatings World

    Mayzo Makes 2 Appointments
    Mississippi Lime Company Announces New Director of Safety
    IFS Coatings Launches IFS Puroplaz PE20 Texture
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    Spectrum Solutions Collaborates with UCLA School of Dentistry
    Kwivik Therapeutics, EirMed Partner to Accelerate Product Commercialization
    Europe Marks its First Successful Remote Robotic-Assisted Coronary Angioplasty
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Lilly, Vir, GSK Partner to Evaluate COVID Combo Therapies
    Novartis Invests in Credence MedSystems
    Ajinomoto Bio-Pharma, Humanigen Expand Manufacturing Agreement
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    Coty to Shut Down Manufacturing Site in Cologne, Germany
    L’Occitane Files for Bankruptcy in U.S.
    Bésame Cosmetics Collaborates with Disney on Mary Poppins Collection
    Happi

    Latest Breaking News From Happi

    CLT Introduces Private Label Solid Air Freshener Cones
    The Florida Sunscreen Symposium Is Back!
    TFF Opens Nominations for 2021 Awards
    Ink World

    Latest Breaking News From Ink World

    Epson Partner Creates Label Applicators for Pharmaceutical Products
    Smurfit Kappa Sets New Sustainability Targets with Better Planet 2050
    Georgia-Pacific Acquires 3rd HP PageWide Corrugated Press to Expand Hummingbird Digital Printing
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    Arjobex acquires MDV Group
    Fix-A-Form eyes global expansion
    McCracken Label installs Fujifilm water-wash plate system
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Nice-Pak Receives EPA Approval for Disinfecting Wipes
    Rockline to Invest $18 Million in Arkansas
    Essity’s Sales Negatively Impacted by Covid-19 Pandemic
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    ChoiceSpine's Tiger Shark Cervical Spacer Earns Additional 510(k)
    FDA Green Lights Inspired Spine's Trident SI Joint Screw System
    FDA Clears Method to Extract Bone Measurements From X-Rays
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    Osram Sees Jump in Profits in Preliminary 2020 Report
    LG Display Reports 4Q 2020 Results
    Xerox Releases 4Q, Full Year Results

    Copyright © 2021 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login