• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    Qualcomm Appoints Junko Sunaga as VP and President of Qualcomm Japan

    Sunaga joined Qualcomm in 1997 and has played a key role in driving strategic planning for Japan.

    Related CONTENT
    • Qualcomm Announces Quarterly Cash Dividend
    • Qualcomm Director Paul Jacobs Will Not Be Re-Nominated to Qualcomm Board
    • Qualcomm Receives Presidential Order Prohibiting Broadcom’s Proposed Takeover
    • Qualcomm Board Names Jeffrey Henderson Non-Executive Chairman
    • Samsung Electronics, Qualcomm Expand Foundry Cooperation on EUV Process Technology
    04.25.18
    Qualcomm Incorporated announced the appointment of Junko Sunaga as VP and president of Qualcomm Japan. Sunaga’s appointment will be effective immediately and she will continue reporting directly Jim Cathey, SVP and president of Asia Pacific and India.
     
    Sunaga joined Qualcomm in 1997, and during her tenure she has played a key role in driving the strategic planning for Japan and expanding the business opportunities in-country. In her most recent role, she was responsible for overseeing Qualcomm Japan’s operations as well as inter-regional coordinator of technical marketing and carrier relations.
     
    Prior to joining Qualcomm, Sunaga was at NEC Corporation, where she worked on software development of digital signal processor and personal digital cellular/ GSM baseband LSI as well as product and business development of chipsets for mobile phones for North America.
     
    “Junko is widely recognized for her technical knowledge and industry expertise by both customers and partners globally,” said Cathey. 
    Related Searches
    • qualcomm
    Suggested For You
    Qualcomm Announces Quarterly Cash Dividend Qualcomm Announces Quarterly Cash Dividend
    Qualcomm Director Paul Jacobs Will Not Be Re-Nominated to Qualcomm Board Qualcomm Director Paul Jacobs Will Not Be Re-Nominated to Qualcomm Board
    Qualcomm Receives Presidential Order Prohibiting Broadcom’s Proposed Takeover Qualcomm Receives Presidential Order Prohibiting Broadcom’s Proposed Takeover
    Qualcomm Board Names Jeffrey Henderson Non-Executive Chairman Qualcomm Board Names Jeffrey Henderson Non-Executive Chairman
    Samsung Electronics, Qualcomm Expand Foundry Cooperation on EUV Process Technology Samsung Electronics, Qualcomm Expand Foundry Cooperation on EUV Process Technology
    Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal Qualcomm Board of Directors Unanimously Rejects Revised Broadcom Proposal
    Qualcomm, USI to Form JV for Semiconductor Module Factory in Brazil Qualcomm, USI to Form JV for Semiconductor Module Factory in Brazil
    Qualcomm Confirms Receipt of Revised Proposal from Broadcom Qualcomm Confirms Receipt of Revised Proposal from Broadcom
    Qualcomm Receives Authorization from EC, KFTC for NXP Semiconductors Acquisition Qualcomm Receives Authorization from EC, KFTC for NXP Semiconductors Acquisition
    Cristiano R. Amon Named President of Qualcomm Cristiano R. Amon Named President of Qualcomm

    Related Breaking News

    • Breaking News | Semiconductors and Quantum Dots

      Qualcomm Announces Quarterly Cash Dividend

      The new dividend rate represents a 9% increase above the prior quarterly dividend.
      04.18.18

    • Breaking News | Personnel | Semiconductors and Quantum Dots
      Qualcomm Director Paul Jacobs Will Not Be Re-Nominated to Qualcomm Board

      Qualcomm Director Paul Jacobs Will Not Be Re-Nominated to Qualcomm Board

      Dr. Jacobs has decided to explore the possibility of making a proposal to acquire Qualcomm.
      03.19.18

    • Qualcomm Receives Presidential Order Prohibiting Broadcom’s Proposed Takeover

      All of Broadcom’s director nominees are also disqualified from standing for election as directors of Qualcomm.
      03.13.18


    • Breaking News | Personnel | Semiconductors and Quantum Dots
      Qualcomm Board Names Jeffrey Henderson Non-Executive Chairman

      Qualcomm Board Names Jeffrey Henderson Non-Executive Chairman

      Paul Jacobs to continue to serve on board; executive chairman role discontinued.
      03.13.18

    • Breaking News | Semiconductors and Quantum Dots

      Samsung Electronics, Qualcomm Expand Foundry Cooperation on EUV Process Technology

      Qualcomm anticipates its future Snapdragon 5G mobile chipsets will use Samsung’s 7nm LPP EUV process technology.
      02.26.18

    Loading, Please Wait..
    Trending
    • EMagin Receives Coveted Display Week Award, Looks Ahead To Future
    • EMagin Awarded $2.5 Million US Army Contract For OLED Microdisplay Prototype Project
    • JDI Further Develops Its Transparent Rælclear Display Technology
    • LG Display Announces Winners Of This Year’s OLEDs GO! Competition
    • Identiv-Powered CVS Spoken Rx Wins NFC Forum 2022 Innovation Award
    Breaking News
    • Avery Dennison Highlights New Approach to Apparel with ADX Lab
    • trinamiX Face Authentication Protects Users from Fraud Attacks During Mobile Payments
    • Hugo Boss Partners with Nedap for Global RFID Roll-out
    • Identiv-Powered CVS Spoken Rx Wins NFC Forum 2022 Innovation Award
    • LG Display Announces Winners of This Year’s OLEDs GO! Competition
    View Breaking News >
    CURRENT ISSUE

    Winter 2021

    • Printed Electronics Now’s International Suppliers’ Directory
    • The Automotive Market and Flexible and Printed Electronics
    • Flexible and Printed Electronics in Healthcare
    • Flexible and Printed Electronics Make Gains in Smart Packaging
    • PAPERONICS: Low-cost multisensory paper and packaging applications
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    Kensing Acquires Vitae Naturals
    CoQ10 and Royal Jelly Supplementation May Improve High Intensity Exercise
    Shiitake Mushroom Extract Appears Helpful in HPV Infections
    Coatings World

    Latest Breaking News From Coatings World

    PPG to Increase U.S. Aerospace Products Manufacturing Output to Meet Rising Demand
    Solvay to Discontinue Use of Fluorosurfactants for Production of Fluoropolymers
    AkzoNobel Names New CEO
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    Varian Receives IDE Exemption from FDA to Advance Flash Clinical Research Program
    Enhatch Partners with Holo-Light to Deliver New Extended Reality Streaming Platform
    Study Confirms Safety, Accuracy of Vectorious' V-LAP In-Heart Sensor
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Shimadzu Scientific Instruments Extends HQ Campus
    Vetter’s Newest Clinical Manufacturing Site Completes First Customer Fills
    Batavia Enters Commercial Manufacturing Business
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    Naples Soap Company to Open New Store in Venice, Florida
    Nectar Recruits 8-Year-Old YouTube Star to Launch Her Own Bath & Body Line
    L'Oreal Exec Joins Function of Beauty
    Happi

    Latest Breaking News From Happi

    Rhode Island’s Department of Health, Raw Elements and Partners Expand Touch-Free Mineral Sunscreen
    Julee Wilson Named Executive Director of BeautyUnited
    Arey Launches Unisex Leave-In Conditioner
    Ink World

    Latest Breaking News From Ink World

    Amcor Lift-Off Initiative Shortlists Start-ups for Seed Funding
    Barentz Highlights Lincoln MFG’s New ISO 9001:2015 Certification
    Ingevity Appoints Christine Stunyo as Chief Human Resources Officer
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    Eaglewood introduces Sitexco Label L10 anilox cleaning system
    Germark makes double press investment in Bobst
    UPM Raflatac to enhance service capabilities at Mills River factory
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Rockline's Springdale Campus Achieves 15 Million Safe Work Hours
    Emmanuelle Picard to Join Ahlstrom-Munksjö's Executive Management Team
    Alkegen Completes Luyang Acquisition
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    Researchers Develop Microfluidic Sensors to Improve Implant Survival Rates
    Lawrence Yellin Appointed as Fuse Medical CFO
    Researchers Discover Novel Patching Material for Bone Defects
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    Avery Dennison Highlights New Approach to Apparel with ADX Lab
    trinamiX Face Authentication Protects Users from Fraud Attacks During Mobile Payments
    Hugo Boss Partners with Nedap for Global RFID Roll-out

    Copyright © 2022 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login