CPI, as part of its Necomada (Nano-Enabled Conducting Materials Accelerating Device Applicability) project, has created new ink and adhesive formulations aimed at reducing the cost of future Internet of Things (IoT) devices. This benefits the production of flexible printable electronics by greatly increasing the effectiveness, productivity and speed involved in the automated process.
 
The ambition of Necomada is to develop materials such as conductive inks and adhesives that are necessary to enable high-speed roll to roll flexible electronics. In doing so, a pilot line will be established that will integrate the materials, printing, component placement capabilities and other conversion processes essential to deliver high volume electronic devices, machine to machine communications and the IoT. The project’s ultimate aim is to use this line as an open access facility for commercial use.
 
Products with IoT applications incorporate Near Field Communication (NFC) and RFID tags, which can provide product information to consumers via mobile devices, among other things. Such devices have the potential to enable brand owners to directly communicate with consumers, offering opportunities for direct marketing in high volume consumer products.
 
To address this, CPI will deliver cost-effective inks and adhesives with optimized electrical conductivity and adhesion, and transfer these inks to its pilot production line. Working alongside twelve other partners in the European Commission H2020-funded consortium, these materials will then be used to make the RFID and NFC tags’ antennae that transmit the signals needed for IoT connectivity.
 
Currently halfway through the consortium’s three-year timeline, the Necomada project will conclude in the last quarter of 2019.