08.29.18
Versum Materials, Inc. said it will showcase its next-generation CMP slurries, ultra-thin dielectric and metal film precursors, formulated cleans and etching products, and delivery equipment at SEMICON Taiwan. The event takes place Sept. 5-7, 2018 at the Taipei Nangang Exhibition Center in Taiwan.
Visitors are invited to booth M148, located on the fourth floor, to meet with the company’s materials experts to learn about the optimal materials and equipment for use in the manufacture of next-generation semiconductors.
Versum will display the ION-X sub‐atmospheric dopant gas storage and delivery system for the safe storage and delivery of sub-atmospheric dopant gases such as arsine, phosphine and boron trifluoride. The system is offered through a global alliance between Versum Materials and NuMat Technologies. The CHEMGUARD Gen III CG400NT automated chemical delivery system, designed for maximum uptime and to meet the demanding needs of today’s fabs, will also be on display. It features a reduced footprint (457 mm by 533 mm) for multiple cabinet placements adjacent to each other, maximizing floor space while reducing exhaust requirements.
In addition to the exhibition, Versum Materials will be participating in the following presentations:
Visitors are invited to booth M148, located on the fourth floor, to meet with the company’s materials experts to learn about the optimal materials and equipment for use in the manufacture of next-generation semiconductors.
Versum will display the ION-X sub‐atmospheric dopant gas storage and delivery system for the safe storage and delivery of sub-atmospheric dopant gases such as arsine, phosphine and boron trifluoride. The system is offered through a global alliance between Versum Materials and NuMat Technologies. The CHEMGUARD Gen III CG400NT automated chemical delivery system, designed for maximum uptime and to meet the demanding needs of today’s fabs, will also be on display. It features a reduced footprint (457 mm by 533 mm) for multiple cabinet placements adjacent to each other, maximizing floor space while reducing exhaust requirements.
In addition to the exhibition, Versum Materials will be participating in the following presentations:
- Rick Chen, GM for the Surface Preparation and Cleaning at Versum Materials, will participate in the Advanced Packaging Technology Symposium – Innovative Leadership for 3D-SiP Advanced Packaging Technology on Tuesday, Sept. 4 at 4 p.m. in the Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang;
- Jose Arno, CTO for NuMat will participate in the Semiconductor Materials Forum – Advancements in Dopant Gas Storage and Delivery for Ion Implant Applications on Thursday, Sept. 6 at 11:50 a.m. on the Master Forum Stage, 4F, TWTC Nangang Exhibition Center Hall 1 about ION-X which Versum Materials is now offering for safe storage and delivery of dopant gases