04.21.23
NXP Semiconductors N.V. announced the appointment of its newest NXP Senior Fellows. The appointment to NXP Senior Fellow is a distinction reserved for esteemed leaders who have significantly contributed to driving innovation across the company and the semiconductor industry.
The new NXP Senior Fellows are:
• Dr. Ulrich Neffe, Austria: Recognized as an industry expert for NFC technologies, Dr. Neffe currently leads NXP’s NFC and Ultra-Wideband (UWB) system architecture and NFC RF design teams. With NXP for nearly 18 years, he has been central to NXP’s development efforts for NFC, and the reapplication of that invention to the later UWB and wireless charging innovations.
Dr. Neffe has driven industry-wide growth and innovation for NFC technology, architecting several of the industry’s most consequential NFC designs, including automotive access and digital wallet technology.
• Dr. Alaa El Sherif, United States: An accomplished leader in power management and switched-mode power supplies (SMPS), Dr. El Sherif is currently the chief architect for advanced analog solutions, driving the architecture and innovation roadmaps of NXP’s power management intellectual properties (IPs).
A 36-year industry veteran, he holds 15 patents and was elected as an NXP Fellow in 2018. Dr. El Sherif’s vision for emerging trends and opportunities has enabled NXP to deliver differentiated system solutions to industry leaders of the IoT market and automotive industry.
With these appointments, Dr. Neffe and Dr. El Sherif are now part of an elite group that hold the title of NXP Senior Fellow. Only one other innovator at NXP has been awarded the prestigious title.
“We are very pleased to elect Ulrich and Alaa as NXP Senior Fellows. Both have demonstrated exceptional leadership, ingenuity, collaboration and expertise in their respective fields,” said Lars Reger, EVP and CTO at NXP. “Their significant IP contributions and dedication to tackling top technical challenges have been instrumental in fueling groundbreaking progress and innovation not just at NXP but to the industry.”
The new NXP Senior Fellows are:
• Dr. Ulrich Neffe, Austria: Recognized as an industry expert for NFC technologies, Dr. Neffe currently leads NXP’s NFC and Ultra-Wideband (UWB) system architecture and NFC RF design teams. With NXP for nearly 18 years, he has been central to NXP’s development efforts for NFC, and the reapplication of that invention to the later UWB and wireless charging innovations.
Dr. Neffe has driven industry-wide growth and innovation for NFC technology, architecting several of the industry’s most consequential NFC designs, including automotive access and digital wallet technology.
• Dr. Alaa El Sherif, United States: An accomplished leader in power management and switched-mode power supplies (SMPS), Dr. El Sherif is currently the chief architect for advanced analog solutions, driving the architecture and innovation roadmaps of NXP’s power management intellectual properties (IPs).
A 36-year industry veteran, he holds 15 patents and was elected as an NXP Fellow in 2018. Dr. El Sherif’s vision for emerging trends and opportunities has enabled NXP to deliver differentiated system solutions to industry leaders of the IoT market and automotive industry.
With these appointments, Dr. Neffe and Dr. El Sherif are now part of an elite group that hold the title of NXP Senior Fellow. Only one other innovator at NXP has been awarded the prestigious title.
“We are very pleased to elect Ulrich and Alaa as NXP Senior Fellows. Both have demonstrated exceptional leadership, ingenuity, collaboration and expertise in their respective fields,” said Lars Reger, EVP and CTO at NXP. “Their significant IP contributions and dedication to tackling top technical challenges have been instrumental in fueling groundbreaking progress and innovation not just at NXP but to the industry.”