12.07.23
TOPPAN Inc., a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc., has announced that on Nov. 28, 2023, it entered into a sale and purchase agreement with OLED developer and manufacturer JOLED Inc. for the land and buildings at the JOLED Nomi Site in Nomi, Ishikawa Prefecture, Japan.
TOPPAN plans to use the site to develop next-generation technology and construct a mass production line for Flip Chip Ball Grid Arrays (FC-BGAs) that meet demand for high-speed transmission and chiplet use.
FC-BGAs are high-density semiconductor packages for which significant growth is anticipated due to increased demand centered on use for data centers and generative AI. TOPPAN expects to launch the new line in 2027 or thereafter and is also considering the production of its existing electronics products at the Nomi site.
With society’s digitalization progressing at pace, the volume of data traffic is increasing every year. This is focusing attention on 2.xD packages and other next-generation semiconductor packages that respond to needs for high-speed, large-volume transmission.
TOPPAN is currently expanding FC-BGA production capacity at its Niigata Plant in Japan, but room for future expansion at the plant is limited in the face of fierce demand. The company has therefore been considering how to secure a new production base and identified the JOLED Nomi site as a location that meets the requirements for next-generation semiconductor package manufacturing processes.
TOPPAN plans to use the site to develop next-generation technology and construct a mass production line for Flip Chip Ball Grid Arrays (FC-BGAs) that meet demand for high-speed transmission and chiplet use.
FC-BGAs are high-density semiconductor packages for which significant growth is anticipated due to increased demand centered on use for data centers and generative AI. TOPPAN expects to launch the new line in 2027 or thereafter and is also considering the production of its existing electronics products at the Nomi site.
With society’s digitalization progressing at pace, the volume of data traffic is increasing every year. This is focusing attention on 2.xD packages and other next-generation semiconductor packages that respond to needs for high-speed, large-volume transmission.
TOPPAN is currently expanding FC-BGA production capacity at its Niigata Plant in Japan, but room for future expansion at the plant is limited in the face of fierce demand. The company has therefore been considering how to secure a new production base and identified the JOLED Nomi site as a location that meets the requirements for next-generation semiconductor package manufacturing processes.