While flexible electronics have been around for years, either as flexible PCBs or genuinely printed electronics, there has always been a trade-off between flexibility and capability.    Circuits with a few printed transistors based on organic semiconductors could be printed onto flexible substrates but were not generally capable of significant data processing. On the other hand, thanks to adherence with Moore’s law, very capable silicon ICs (integrated circuits) are incredibly cheap on a per transistor basis but impose a rigid form factor and require careful placement onto a substrate.   A prototypical flexible hybrid electronics circuit (left), which must, as a minimum, include conductive interconnects printed onto a flexible substrate along with a placed integrated circuit. Additional functionality may include thin-film photovoltaics (PV), a thin film battery and printed sensors. Schematic (right) showing how FHE breaks the existing compromise bet