IDTechEx09.22.21
In-mold electronics enables electronic functionality to be embedded within molded and thermoformed plastic components. With the integration of capacitive touch, lighting, and even haptics alongside size and weight reductions of up to 70%, IME is an efficient approach to making curved touch-sensitive interfaces. Given these benefits, IDTechEx forecasts IME to be a $1.5 billion market by 2032, with applications mainly within the automotive and consumer goods sectors.
Greater integration of electronics within 3D structures is an ever-increasing trend, representing a more sophisticated solution compared to the current approach of encasing rigid printed circuit boards. In-mold electronics (IME) facilitates this trend, by enabling multiple integrated functionalities to be incorporated into components with thermoformed 3D surfaces.
A New Manufacturing Approach
IME can be regarded as an extension of the well-established in-mold decorating (IMD) process, in which thermoforming plastic with a
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