David Savastano, Editor09.22.10
There is a tremendous amount of research being done in the field of printed electronics at the university level, and many of the successful small companies have been formed out of start-ups that were launched out of universities.
While the field of research is the best-known aspect of the involvement of universities in PE, there is also a growing interest in developing standards and testing facilities. To this end, there are a number of universities in the U.S. and worldwide that have formed significant operations to study PE. It would be almost impossible to highlight all of these efforts, but here are but three examples of university efforts in the field of PE.
The Georgia Institute of Technology is the home for the Center for Organic Photonics and Electronics (COPE). Established in 2003, COPE works closely with many of the research centers and institutes at Georgia Tech to provide a focal point for campus-wide efforts on functional organic optical and electronic materials. All told, there are 27 faculty members covering a wide range of disciplines that are involved with COPE.
Led by co-directors Bernard Kippelen and Seth Marder, COPE is developing new materials and device concepts for organic light-emitting diodes (OLEDs), organic field-effect transistors, memories, capacitors, photodiodes and solar cells, which can then be incorporated into displays, image sensors, and radio-frequency identification tags. COPE is also working with Solvay S.A. to develop organics-based thin-film transistors that can be fabricated onto low-cost flexible substrates at low temperature for applications in plastic electronics.
In 2008, Western Michigan University (WMU) formed the Center for the Advancement of Printed Electronics (CAPE). It was an ideal fit, as WMU is well-known for its knowledge on printing. Led by its director, Dr. Margaret Joyce, CAPE is utilizing its inkjet, gravure, screen and flexo capabilities to look at some of the challenges facing the PE field, most notably the ability to integrate materials into the printing process.
Most recently, WMU and the FlexTech Alliance announced that CAPE will create a user-friendly database for accessing technical information on functional materials. The registry will enable more timely, efficient and accurate selection of the most appropriate material-sets for flexible, printed electronics industry product developments, and serve all manufacturing platforms. CAPE has also been hosting workshops to help printers learn about the potential of PE for their business.
FlexTech is also working with Clemson University’s Sonoco Institute of Packaging Design & Graphics, in this case a project to perform research and compile a registry to benchmark processes in roll-to-roll manufacturing of printed electronics components. In particular, the study will examine flexography, gravure and rotary screenprinting’s capabilities as high-speed, commercially available roll-to-roll technologies for the manufacture of functionally active or passive advanced devices.
Much like WMU, Clemson has a strong background in the field of printing, with its highly regarded Graphic Communications and Packaging Science departments. As PE can add functionality to packaging in areas as diverse as displays, RFID and sensors, it fits Clemson’s area of expertise. Clemson began its research efforts with a look at silver-based conductive inks for RFID antennas printed by flexography, and the university also since worked on P-OLEDs and other projects. Clemson also hosts its own series of workshops to introduce the possibilities of PE.
For printed electronics to grow, there will need to be advances made throughout the entire PE community, and leading universities will certainly be among the leaders in these efforts.
While the field of research is the best-known aspect of the involvement of universities in PE, there is also a growing interest in developing standards and testing facilities. To this end, there are a number of universities in the U.S. and worldwide that have formed significant operations to study PE. It would be almost impossible to highlight all of these efforts, but here are but three examples of university efforts in the field of PE.
Led by co-directors Bernard Kippelen and Seth Marder, COPE is developing new materials and device concepts for organic light-emitting diodes (OLEDs), organic field-effect transistors, memories, capacitors, photodiodes and solar cells, which can then be incorporated into displays, image sensors, and radio-frequency identification tags. COPE is also working with Solvay S.A. to develop organics-based thin-film transistors that can be fabricated onto low-cost flexible substrates at low temperature for applications in plastic electronics.
In 2008, Western Michigan University (WMU) formed the Center for the Advancement of Printed Electronics (CAPE). It was an ideal fit, as WMU is well-known for its knowledge on printing. Led by its director, Dr. Margaret Joyce, CAPE is utilizing its inkjet, gravure, screen and flexo capabilities to look at some of the challenges facing the PE field, most notably the ability to integrate materials into the printing process.
Most recently, WMU and the FlexTech Alliance announced that CAPE will create a user-friendly database for accessing technical information on functional materials. The registry will enable more timely, efficient and accurate selection of the most appropriate material-sets for flexible, printed electronics industry product developments, and serve all manufacturing platforms. CAPE has also been hosting workshops to help printers learn about the potential of PE for their business.
FlexTech is also working with Clemson University’s Sonoco Institute of Packaging Design & Graphics, in this case a project to perform research and compile a registry to benchmark processes in roll-to-roll manufacturing of printed electronics components. In particular, the study will examine flexography, gravure and rotary screenprinting’s capabilities as high-speed, commercially available roll-to-roll technologies for the manufacture of functionally active or passive advanced devices.
Much like WMU, Clemson has a strong background in the field of printing, with its highly regarded Graphic Communications and Packaging Science departments. As PE can add functionality to packaging in areas as diverse as displays, RFID and sensors, it fits Clemson’s area of expertise. Clemson began its research efforts with a look at silver-based conductive inks for RFID antennas printed by flexography, and the university also since worked on P-OLEDs and other projects. Clemson also hosts its own series of workshops to introduce the possibilities of PE.
For printed electronics to grow, there will need to be advances made throughout the entire PE community, and leading universities will certainly be among the leaders in these efforts.