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    Online Exclusives

    LOPEC 2017 Examines Key Markets, Technologies

    Sessions will include Flexible Displays & Lighting, Wearable Electronics, Automotive & Aerospace, IoT, Devices and more.

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    • LOPEC 2017 Examines Key Markets, Technologies
    David Savastano, Editor03.29.17
    With topics ranging from flexible displays and lighting, wearables, automotive and aerospace, Internet of Things (IoT), devices, substrates and encapsulation, and much more, the closing session of LOPEC 2017 has a great deal of information for attendees.
     
    Wolfgang Mildner, LOPEC general chair and founder/CEO of MSW, willonce again welcome attendees to the Plenary Session, and will be followed by Dr. Giovanni Nisato, business and technology development senior manager for CSEM, who will cover “Printed Sensors: Approaches from Consumer Health to Lifesciences.”
     
    Jennifer Y.C. Lin, associate VP of advanced technology research center, AU Optronics, will discuss “Toward Flexible Future of Electronics.” Dr. Melissa Grupen-Shemansky, CTO SEMI/FlexTech, is next, with her talk on “Collaboration and the Development of a Flexible Hybrid Electronics Ecosystem.” ISORG founder and CEO Jean-Yves Gomez will close the Plenary Session with a talk on “Fully Printed Organic Sensors.”
     
    On the Technical Conference segments, there will be six topics, with sessions covering Flexible Displays & Lighting, Wearable Electronics, Automotive & Aerospace, IoT (Internet of Things), Publicly Funded Projects and Substrate and Encapsulation.
     
    Flexible Displays & Lighting will be covered by four presenters: E Ink Corporation CTO Dr. Michael McCreary; Dr. Stefan Mogck, head of department R2R Organik-Technologie, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP; Dr. Richard Wilson, director, new technology for CDT Ltd.; and Konica Minolta Inc. manager Kei Hyodo.
     
    Four speakers will bring their insights to the session on Wearable Electronics: Prof. Dr. Matti Mäntysalo, assistant professor, adj. professor and academy research fellow, Tampere University of Technology; Dr. João Gomes, R&D manager, CENTI - Centre for Nanotechnology and Smart Materials; Dr. Jan-Laurens van der Steen, senior scientist, Holst Centre/TNO; and Dr. Thomas Knieling, head of Business Field Wearable Electronics, Fraunhofer ISIT.
     
    The topic of Automotive & Aerospace is of huge importance, and LOPEC has three speakers here: Dr. Matthias Ogonda, expert for Opto-Mechatronic Technology, Hella KGaA Hueck & Co.; Dr. André Pinto, a researcher at CeNTI; and Dr. Dirk Godlinski, project manager at Fraunhofer IFAM.
     
    The IoT (Internet of Things) is another important topic, with speakers Thin Film Electronics COO Dr. Peter Fischer, Cambridge Display Technology Ltd. principal scientist Dr. Thomas Kugler and Dr. Michael Korell, project manager – intrapreneur, Evonik Creavis  offering their expertise.
     
    The topic of Publicly Funded Projects will be covered by Prof. Jong Min Kim of University of Cambridge; Dr. Erno Langendijk, business development and program manager – Flexible OLEDs at Holst Centre; and Prof. Dr. Pim Groen, also of the Holst Centre.
     
    Substrate and Encapsulation will bring together presenters Dr. Paul Poodt, program manager, Holst Centre; Prof. Tadahiro Furukawa, associate professor, Yamagata University; and ETRI senior engineer Dr. Doo-Hee Cho.
     
    On the Scientific Conference side, there will be three sessions on Devices, as well as singles sessions on 2.5D and 3D Printed Electronics /Washability and Stretchability of Printed Electronics and Circuit Design, Simulations and Systems.
     
    Devices I will feature talks by Prof. Sungjune Jung, professor, Pohang University of Science & Technology; Sunchon National University researcher Dr. Younsu Jung; Junfeng Sun, a doctoral candidate from Sunchon National University; and Dr. Herbert Gold, senior scientist at Joanneum Research.
     
    Concurrent with Devices I, 2.5D and 3D Printed Electronics/Washability and Stretchability of Printed Electronics brings together as speakers Cai-Fu Li, specially appointed researcher at Osaka University; Yousef Farraj, a PhD student ay huji; Lisa-Marie Faller, university assistant at Alpen Adria University; and Sripathi Raja Jeyakumar, a student at Fraunhofer Institute For Silicon Technology.
     
    During the early afternoon, Devices II and Circuit Design, Simulations and Systems are on the schedule. Devices II features talks by Min Zhang, a PhD student at Karlsruhe Institute of Technology; Dr. João Gomes, R&D manager, CeNTI - Centre of Nanotechnology and Smart Materials; and Dr. Stefan Höfle, R&D scientist at CYNORA GmbH.

     
    Circuit Design, Simulations and Systems includes presenters Dr. Danick Briand, team leader MEMS and Printed Microsystems for Ecole Polytechnique Fédérale de Lausanne; and Dr. Oleksandr Glushko, project leader at Erich Schmid Institute.
     
    Devices III, which closes the Scientific Conference, will offer three presenters: Dr. Toby Cull, R&D manager, Merck Chemicals Ltd.; Dr. Bernd Ebenhoch, postdoctoral researcher; Karlsruhe Institute of Technology; and Andreas Albrecht, doctoral candidate, Technische Universität München.
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      04.12.17

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      LOPEC 2017 Comes to Successful Conclusion

      OE-A reports major growth in attendance, exhibitors and exhibition space, as well as increasing interest from end-users.
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    • 3D Printing | Adhesives, Barriers and Encapsulants | Conductive Inks and Coatings | Displays and Lighting | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Lab and Testing | Manufacturers News | Manufacturing | Printing | Research Institutions | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities

      LOPEC 2017 Comes to Successful Conclusion

      OE-A reports major growth in attendance, exhibitors and exhibition space, as well as increasing interest from end-users.
      David Savastano, Editor 04.05.17

    • LOPEC 2017 Examines Key Markets, Technologies

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