• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Online Exclusives

    MicroConnex Keeps Focus on Custom Flexible Circuits

    Company is developing advanced technology for prototyping, manufacturing specialized circuitry.

    MicroConnex Keeps Focus on Custom Flexible Circuits
    This Flex PCB is thin and light, has intricate laser slots and copper “bumps.’ (Source: MicroConnex)
    David Savastano, Editor10.10.18
    Developing flexible circuitry is an essential component of flexible hybrid electronics systems. Manufacturers are looking for smaller, more densely packed circuits or their applications, and this is proving to be an ideal opportunity for MicroConnex.
     
    A specialist in commercial flexible circuits fabrication and laser micromachining services, Snoqualmie, WA-based MicroConnex develops high-density flex interconnects (HDI) solutions for the electronic packaging market. The company uses its proprietary photolithographic patterning systems to produce custom flexible circuitry. Key markets include medical ultrasound systems, semiconductor and defense and aerospace industries.
     
    Steve Leith, MicroConnex’s VP engineering and technology, said that MicroConnex was formed as an R&D company called MicroSound Systems in the mid-1990s.
     
    “The initial business concept was to develop next generation, complex medical ultrasound transducers and this early work were partially funded by DARPA and the US Navy,” Leith said. “The company co-founders were experts in ultrasound, but during the course of the project found that the 2D ultrasonic transducers required complex interconnects not readily available from third parties. By necessity they had to develop high-density flex interconnects (HDI) in-house to enable demonstration of the ultrasonic device.
     
    “In developing the skill in fabricating specialty flex circuits, it became clear that the real value proposition of the company wasn’t ultrasonic devices, but fabricating the interconnects required to interface with the mesoscale world,” he added. “The team then created MicroConnex as a technology-centric business focused on high-density flex circuit fabrication leveraging the company expertise in laser micro-machining and thin film deposition.”
     
    The HDI business is highly competitive. MicroConnex is working with the Washington Clean Energy Test Beds (WCET) to overcome the cost vs. performance pressure in the HDI marketplace.
     
    “We believe that we can address a portion of the market needs using a hybrid circuit fabrication process that utilizes elements of printing and electrodeposition; our colleagues at WCET are experts in printing on plastic technology and MicroConnex has a very deep bench in electrodeposition of nano- and micro-scale architectures,” Leith noted. “The idea to combine these two technologies resulted from an assessment of circuit functional requirements vs. available, reasonably mature fabrication processes.”
     
    Leith said that ideal markets for MicroConnex are those that require the smallest and thinnest densely populated flexible circuitry.
     
    “Examples abound in the medical device space in which small and thin circuit design elements are required for functionality,” he reported. “Specifically, electrophysiology (EP) mapping/ablation applications (i.e. cardiac mapping and ablation) are platforms that benefit from HDI circuit technology. Hearing aids (including cochlear implants), vision enhancement devices, drug delivery, and medical ultrasound are other applications in which HDI plays a key role. The motivation for the technology under development is that flex circuits made with the hybrid process may be used to fabrication these types of devices with disruptive performance vs cost metrics.”
     
    One of the biggest challenges has been the ability to use roll-to-roll fabrication techniques. NextFlex is funding MicroConnex’s project to develop a two-step “hybrid” printing process in which fine circuit patterns are first printed using an R2R process.
     
    “In the last 10-15 years, significant resources (people and R&D funds) have been spent trying to solve some fundamental material and processing challenges in R2R printed electronics fabrication,” said Leith. “The technology has evolved and improved based on hard work and wide-ranging contributions by numerous industrial and academic developers around the globe, yet many of the same issues remain. The primary technical challenges include demonstrating adequate adhesion of the printed material to the substrate (does the circuit stick to the plastic), achieving targeted dimensional control of the circuits (how accurately circuit widths and thickness can be controlled) and fabricating circuits with sufficient electrical performance to be useful (primarily high enough conductivity).
     
    “Adhesion is influenced by the chemical and physical attributes of the substrate, the chemical and physical attributes of the printed ‘ink’ that becomes the circuit and the specific process used in ‘rolling’ the ink onto the substrate (think pressure, speed, temperature, roller material, etc.),” Leith continued. “We are working with our colleagues at WCET to evaluate the interactions and results of using different inks, different substrates and a range of clean and ink application processes to identify optimized print conditions for adhesion.”
     
    Leith noted that many of the same substrate, ink and R2R process attributes that impact adhesion also play a role in the ability to control the circuit dimensions.
     
    “We use a similar experimental approach to evaluate optimum process conditions for printing circuits of different dimensions as described above; i.e. we are exploring a range of ink formulations, substrates and application methods to identify which process combinations can be used to fabricate circuits of certain dimensions. Again, our colleagues at WCET are leaders in this field and are driving the experimental plan and execution,” he said.
     
    “Printing circuits with acceptable adhesion and controlled dimensions is not new and a large body of work exists upon which we are expanding our understanding. Printing very narrow circuits in a high-density design, however, remains super challenging and is a primary focus of our work,” Leith added.
     
    In order to improve conductivity, MicroConnex and WCET are using a hybrid production process.
     
    “The R2R process is being “tuned” to create narrow circuits in high-density designs,” Leith said. “The downside is that after the first step (printing), the circuits are typically poor conductors and have low electrical functionality. The second step in the hybrid process is designed to add additional, high conductivity metal to the circuit printed in step one. This additional metal increases the conductivity of the circuit to acceptable levels without compromising the dimensions or adhesion of the originally printed trace. The result of the hybrid process is a circuit that achieves a commercially viable combination of small dimensions, good adhesion and acceptable electrical properties.
     
    “When successful, the proposed hybrid circuit fabrication process will not only enable MicroConnex to increase revenue, but the R2R process should be lower cost, ultimately leading to higher profit margins and/or lower pricing for our medical customers,” Leith concluded.
     
    Leith sees NextFlex as being an ideal partner in developing a manufacturing ecosystem, adding that the funded project will demonstrate production volume capability and commercial viability.
     
    “We face unrelenting pricing pressure from lower-cost labor markets, especially in the volume production segment of our business,” said Leith. “In the big picture, we see investments in technology and automation as a key element in maintaining our competitive advantage in both performance and pricing. The NextFlex-funded project is one example of how the domestic PCB/FHE sector, in general, can spend resources to create and maintain a high tech industrial manufacturing base in the US. Without the funding from NextFlex, a company of our size likely wouldn’t be able to invest the resources to tackle such a risky and expensive R&D project.”
     


    This Flex PCB is thin and light has intricate laser slots and copper “bumps.’ (Source: MicroConnex)
    Related Searches
    • flex
    • nextflex
    • electronics
    • ink
    Suggested For You
    RFID is Improving the World of Healthcare RFID is Improving the World of Healthcare
    Graphene Enables 10 Times Higher Data Storage in Computer Memories Graphene Enables 10 Times Higher Data Storage in Computer Memories
    Sustainability, Innovation Will Be Highlights for 2021 FLEX Sustainability, Innovation Will Be Highlights for 2021 FLEX
    Manufacturing USA Institutes Plan Two Upcoming October Events Manufacturing USA Institutes Plan Two Upcoming October Events
    Nextflex Announces Two Affiliated ‘Nodes’ to Support FHE Community in Massachusetts, New York Nextflex Announces Two Affiliated ‘Nodes’ to Support FHE Community in Massachusetts, New York
    Komori, Seria Partner on Pepio F6 for Printed Electronics Applications Komori, Seria Partner on Pepio F6 for Printed Electronics Applications
    ON Semiconductor Wins Top 10 Power Product Award 2018 in China ON Semiconductor Wins Top 10 Power Product Award 2018 in China
    nScrypt Brings Newton Cyberfacturing Contract Design & Manufacturing Services In-House nScrypt Brings Newton Cyberfacturing Contract Design & Manufacturing Services In-House
    Government Confirms £1 Billion Funding for British Innovation Government Confirms £1 Billion Funding for British Innovation
    NextFlex Launches $10 Million Funding Round for Flexible Hybrid Electronics Innovations NextFlex Launches $10 Million Funding Round for Flexible Hybrid Electronics Innovations
    CPI Receives $140 Million in Government Funding Boost CPI Receives $140 Million in Government Funding Boost
    Xaar Wins ‘Innovation of the Year’ at 3D Printing Industry Awards Xaar Wins ‘Innovation of the Year’ at 3D Printing Industry Awards
    Universal Display Corporation Showcases Phosphorescent OLEDs, Organic Vapor Jet Printing at SID 2018 Universal Display Corporation Showcases Phosphorescent OLEDs, Organic Vapor Jet Printing at SID 2018
    Foundational Work for NextFlex Materials & Process Database Now Underway Foundational Work for NextFlex Materials & Process Database Now Underway

    Related Online Exclusives

    • Flexible and Printed Electronics | Manufacturers News | RFID and NFC | Suppliers News
      RFID is Improving the World of Healthcare

      RFID is Improving the World of Healthcare

      Connectivity, inventory control, monitoring patients’ use of medicine are among the many examples of how RFID and NFC are improving our healthcare.
      David Savastano, Editor 07.28.21

    • Breaking News | Graphene, Perovskites and Carbon Nanotubes | Research Institutions
      Graphene Enables 10 Times Higher Data Storage in Computer Memories

      Graphene Enables 10 Times Higher Data Storage in Computer Memories

      Could lead to a big jump from the current one terabit per square inch (Tb/in2) to 10 terabits over the same area.
      06.02.21

    • Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Printed Batteries | Sensors and Wearables | Suppliers News
      Sustainability, Innovation Will Be Highlights for 2021 FLEX

      Sustainability, Innovation Will Be Highlights for 2021 FLEX

      Healthcare, automotive and communications and ML/AI will be among the important areas that will be covered during virtual conference.
      David Savastano, Editor 02.03.21


    • Breaking News | Flexible and Printed Electronics | Manufacturing | Research Institutions | Universities

      Manufacturing USA Institutes Plan Two Upcoming October Events

      Manufacturing Extension Partnerships in Massachusetts and New York have each planned regional events.
      09.20.18

    • Adhesives, Barriers and Encapsulants | Conductive Inks and Coatings | Contract Manufacturing/Printing | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Lab and Testing | Manufacturing | Printed Batteries | Printing | Research Institutions | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Universities

      Nextflex Announces Two Affiliated ‘Nodes’ to Support FHE Community in Massachusetts, New York

      Nodes to provide regional supply chain support and catalyze FHE development.
      09.19.18

    Loading, Please Wait..
    Trending
    • Jabil Posts Fourth Quarter, Fiscal Year 2023 Results
    • Nearly Six In 10 Warehouse Leaders Plan To Deploy RFID By 2028: Zebra
    • Wiliot To Show Enhanced Version Of Wiliot Cloud, IoT Pixels, At MWC Las Vegas 2023
    • Jabil Announces Definitive Agreement To Divest Mobility Business For $2.2B
    • Ink-Borne ‘Chiplets’ Could Lead To Printable Displays, Electronics And More
    Breaking News
    • Weekly Recap: Mergers and Acquisitions, First Solar Top This Week’s Stories
    • Jabil Posts Fourth Quarter, Fiscal Year 2023 Results
    • Ink-Borne ‘Chiplets’ Could Lead to Printable Displays, Electronics and More
    • SCHOTT Strengthens Glass Substrate Portfolio
    • Emerson Ventures Invests in First Resonance
    View Breaking News >
    CURRENT ISSUE

    Winter 2021

    • Printed Electronics Now’s International Suppliers’ Directory
    • The Automotive Market and Flexible and Printed Electronics
    • Flexible and Printed Electronics in Healthcare
    • Flexible and Printed Electronics Make Gains in Smart Packaging
    • PAPERONICS: Low-cost multisensory paper and packaging applications
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    D2C Supplement Brand Launches Blood Sugar Support Supplement, Gluco-Control
    Natrol Launches First Non-Melatonin Sleep Supplement
    Metagenics Releases Consumer Survey on Menopausal Support Supplement
    Coatings World

    Latest Breaking News From Coatings World

    Coating Additives Market Worth $10.5B by 2028: MarketsandMarkets
    California Sports Surfaces Celebrates 70 Years
    ROSS Offers Cost-Effective, Expertly Reconditioned Equipment
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    MPO's Most-Read Stories This Week—Sept. 30
    Dentsply Sirona Names Former NuVasive CEO Lucier as Chairman
    SeaStar Medical Gets Breakthrough Nod for Selective Cytopheretic Device
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Univercells Expands into the U.S. With New Offices in Andover, MA
    Evecxia Therapeutics, Quotient Sciences Complete Clinical Milestone for Depression Treatment
    Ionis, Roche Partner on RNA-targeted Programs for AD and HD
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    MAV Beauty Recruits Former Elizabeth Arden CEO Scott Beattie
    YSL Beauty Taps Finn Wolfhard, Lil Yachty & More for Fragrance Campaign
    74% of Makeup Users Open to Affordable ‘Dupes,’ Mintel Says
    Happi

    Latest Breaking News From Happi

    Is Dr. Barbara Sturm Skincare Considering a Sale?
    YSL Beauty Welcomes Five Foremost Artists to Represent New Fragrance
    Christian Siriano Appointed Olay’s First Chief Drop Officer
    Ink World

    Latest Breaking News From Ink World

    MicroDynamics, All Printing Resources Partner to Represent Veritas
    Weekly Recap: Wikoff Color, BASF, Latin America Top This Week’s Stories
    Siegwerk’s Climate Targets Validated by SBTi
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    SABIC and partners launch bio-based IML solution for food packaging
    tesa completes expansion of Michigan manufacturing facility
    Comexi and Asahi to host 'Effortless Platemaking' event
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Greentech Introduces Air Filter with Advanced Odor Elimination
    Ontex Divests Pakistan Operations to ASAIA Holding
    Goodnites Bedwetting Underwear Recognized by Good Housekeeping
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    ODT's Most-Read Stories This Week—Sept. 30
    Lazurite Adds Benchmark Medical as a Distributor for its ArthroFree Wireless Camera System
    ChitogenX Granted New U.S., Canadian ORTHO-R Patent
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    Weekly Recap: Mergers and Acquisitions, First Solar Top This Week’s Stories
    Jabil Posts Fourth Quarter, Fiscal Year 2023 Results
    Ink-Borne ‘Chiplets’ Could Lead to Printable Displays, Electronics and More

    Copyright © 2023 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login