Smart packaging, in-mold electronics, flexible displays and more are among the topics for today’s sessions.
David Savastano, Editor11.20.19
Led by speakers from corporate giants including AB-inbev, United Technologies Research Center, Microsoft and Intel, IDTechEx Show! USA 2019 in Santa Clara, CA will hold its closing session today in Santa Clara, CA with an eye on end users as well as the latest developments in the industry.
Organized by IDTechEx, PE USA 2019 features seven co-located concurrent programs during its eight tracks, including two sessions on Printed Electronics as well as single sessions on Sensors, Wearables, Internet of Things, Graphene, Electric Vehicles and Energy Storage.
Printed Electronics is the focus of two tracks. The first track opens with Smart Packaging and Integrated Systems, with presenters from United Technologies Research Center, AB-inbev, Inuru GmbH, SES RFID Solutions GmbH and US ARMY RDECOM ARDEC (US).
3D Printed Electronics and In-Mold Electronics is up next, and will be covered by Parsons, Neotech AMT GmbH, Optomec, TactoTek and Sun Chemical.
After lunch, Conductive Inks: Ne
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