NextFlex's San Jose-based pilot production line helps prepare for future of flexible hybrid electronics.
adphos cure oven for drying and curing.
Meyer Burger PiXDRO Printer, for digital printing of conductive inks on flexible substrates.
Besi Datacon 2200 EVO Die Bonder high-accuracy multi-chip die bonder, capable of handling ultra-thin dies.
BTU International Pyramax high-throughput reflow oven that features optimized lead-free solder curing for packaging, assembly and printed conductors.
Universal Instruments Fusion SC1-06, for surface mount and pick-and-place of discrete components and final assembly processes.