02.23.18
CPES2018 is assembling a world-class roster of session chairs, keynotes, panelists and subject matter experts to explore what’s new and what’s possible.
Organized by the intelliFLEX Innovation Alliance, CPES2018 takes place from May 23-24 at Centennial College’s Conference Centre in Toronto.
Some 2,000 companies are involved in the design, development or manufacturing of electronics-based products in Canada. They face increasing pressure to innovate and adapt in the face of stiff global competition. FHE offer fresh ways to grow revenue and compete with new products and applications for verticals like Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Aerospace, Health and Wellness, Intelligent Documents and Wearables.
CPES2018 is the place to learn about the materials, components, tools and manufacturing technologies and applications needed to capitalize on these opportunities.
“Whether your interests lie in the latest in materials science or in the practical considerations of commercializing new products and applications, we have you covered,” said Peter Kallai, CPES2018 co-chair and president and CEO of intelliFLEX.
Keynotes speakers announced include:
• Melissa Grupen-Shemansky, CTO of FlexTech Alliance, who will deliver a keynote on the FHE Technology Road Map.
• Christine DeFabio, head of Global Connected Packaging Capability at Unilever, who will discuss in her keynote the consumer products giant’s journey from trial to large-scale implementation of FHE technologies.
Speakers announced:
• Warren Ali, director of emerging technologies initiatives at APMA, Canada’s national association representing OEM producers for the worldwide automotive industry.
• Simon Fried, president at Israel’s Nano Dimension, which researches and develops advanced 3D printed electronics, including a 3D printer for multilayer printed circuit boards.
• Rick Larson, head of technical sales at NovaCentrix. This CPES2018 Diamond Sponsor is a leading product innovator in printable electronics manufacturing known for its Metalon conductive inks and PulseForge photonic curing tools. Larson will discuss scaling up from the lab to commercial production.
• James Lee, director of technology innovations for Smart Packaging at Jones Packaging. Jones is a pioneer in adding intelligence to packaging on high-speed production lines.
• Erika Rebrosova, electronic materials technology manager at Sun Chemical, the world’s largest producer of printing inks. Rebrosova will discuss material advances for in-mould electronics.
• Brodie Stanfield, founder and co-CEO of Inventing Future Technologies. This R&D hardware and software company has developed ARAIG, the world’s first multi-sensory and multi-directional force feedback suit.
• Ilaria Varoli, SVP at Myant.
• Industrial Design Workshop Leader – Dylan Horvath, president of Cortex Design, a product design and manufacturing firm in Toronto’s art and design district.
• Evolving International Standards Workshop Leaders –
Chris Jorgensen, director technology transfer with IPC – Association Connecting Electronics Industries; and Haridoss Sarma, research and technology scout and Go 2 Scout 4 R&T. He and Jorgensen will discuss evolving new standards for FHE.
• Intellectual Property Protection Workshop Leader – David Lotimer, MBM Intellectual Property Law, who works with entrepreneurs to support their businesses and to help them manage their IP assets.
Attendees can save $100 off the regular admission cost for CPES2018 if they register before March 31. Visit CPES2018 today to register and learn more about sponsorship opportunities and to book a tabletop exhibit. Contact Marie Bilodeau, event manager, at mbilodeau@intelliflex.org for more information.
Organized by the intelliFLEX Innovation Alliance, CPES2018 takes place from May 23-24 at Centennial College’s Conference Centre in Toronto.
Some 2,000 companies are involved in the design, development or manufacturing of electronics-based products in Canada. They face increasing pressure to innovate and adapt in the face of stiff global competition. FHE offer fresh ways to grow revenue and compete with new products and applications for verticals like Smart Packaging and Retail, Intelligent Buildings and Connected Homes, Aerospace and Defence, Automotive and Aerospace, Health and Wellness, Intelligent Documents and Wearables.
CPES2018 is the place to learn about the materials, components, tools and manufacturing technologies and applications needed to capitalize on these opportunities.
“Whether your interests lie in the latest in materials science or in the practical considerations of commercializing new products and applications, we have you covered,” said Peter Kallai, CPES2018 co-chair and president and CEO of intelliFLEX.
Keynotes speakers announced include:
• Melissa Grupen-Shemansky, CTO of FlexTech Alliance, who will deliver a keynote on the FHE Technology Road Map.
• Christine DeFabio, head of Global Connected Packaging Capability at Unilever, who will discuss in her keynote the consumer products giant’s journey from trial to large-scale implementation of FHE technologies.
Speakers announced:
• Warren Ali, director of emerging technologies initiatives at APMA, Canada’s national association representing OEM producers for the worldwide automotive industry.
• Simon Fried, president at Israel’s Nano Dimension, which researches and develops advanced 3D printed electronics, including a 3D printer for multilayer printed circuit boards.
• Rick Larson, head of technical sales at NovaCentrix. This CPES2018 Diamond Sponsor is a leading product innovator in printable electronics manufacturing known for its Metalon conductive inks and PulseForge photonic curing tools. Larson will discuss scaling up from the lab to commercial production.
• James Lee, director of technology innovations for Smart Packaging at Jones Packaging. Jones is a pioneer in adding intelligence to packaging on high-speed production lines.
• Erika Rebrosova, electronic materials technology manager at Sun Chemical, the world’s largest producer of printing inks. Rebrosova will discuss material advances for in-mould electronics.
• Brodie Stanfield, founder and co-CEO of Inventing Future Technologies. This R&D hardware and software company has developed ARAIG, the world’s first multi-sensory and multi-directional force feedback suit.
• Ilaria Varoli, SVP at Myant.
• Industrial Design Workshop Leader – Dylan Horvath, president of Cortex Design, a product design and manufacturing firm in Toronto’s art and design district.
• Evolving International Standards Workshop Leaders –
Chris Jorgensen, director technology transfer with IPC – Association Connecting Electronics Industries; and Haridoss Sarma, research and technology scout and Go 2 Scout 4 R&T. He and Jorgensen will discuss evolving new standards for FHE.
• Intellectual Property Protection Workshop Leader – David Lotimer, MBM Intellectual Property Law, who works with entrepreneurs to support their businesses and to help them manage their IP assets.
Attendees can save $100 off the regular admission cost for CPES2018 if they register before March 31. Visit CPES2018 today to register and learn more about sponsorship opportunities and to book a tabletop exhibit. Contact Marie Bilodeau, event manager, at mbilodeau@intelliflex.org for more information.
