Following the conference, there was a private presentation at the University of California Berkeley, Electrical Engineering & Computer Sciences (EECS) Dept. Laboratory of Advanced 3D Electronic Printing. The Printed Electronics USA 2015 Conference was hosted by IDTechEx at the Santa Clara Convention Center in California from November 18-19. The UC Berkely EECS Lab tour was held on November 20.
Attendees learned about new scientific discoveries and emerging commercial applications for 3D printed electronics, and witnessed recent Ceradrop developments in inkjet production processes. Discussion topics included materials, methods and systems. Participants will received key 3D electronic printing research insights, valuable technical knowledge and an introduction to Ceradrop technology.
During the UC Berkeley EECS lab tour, scientists demonstrated how to put 3D Printed Electronics theory into practice via Ceradrop technology, educational presentations and audience Q&A. The tour was hosted by Professor Vivek Subramanian, whose research has been focused on cost-effectively printing high-resolution micro-electronic circuitry and 2D/3D structural components with nano-particle materials, conductive metal inks, semiconductors and other bio-chemical formulations. The Ceradrop X-Series offers integrated functions for achieving application development goals from prototyping to full production.
MGI and Ceradrop also recently announced a joint venture with Agfa Specialty Products to create a new generation of industrial inkjet solutions for the printed electronics market based on MGI’s engineering expertise, Ceradrop’s technical innovation and Agfa’s renowned scientific research in conductive ink materials.