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    Breaking News

    Optomec to Feature Systems for 3D Printed Electronics at UK Advanced Packaging Conference

    Will show how additive manufacturing is being used to print functional circuits onto both planar and non-planar substrates.

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    03.16.17
    Optomec will feature its Aerosol Jet systems for 3D electronics at the iMAPS MicroTech Advanced Packaging and Technology Trends conference. The conference will take place at the Rutherford Appleton Laboratory (RAL) in England on March 16. Urs Berger, director of European sales for Optomec, will give a presentation in the Advanced Packaging track entitled “Using Additive Manufacturing to Add Value to Products Produced with Conventional Manufacturing Methods” at 14:00 on March 16.
     
    Berger’s presentation will discuss how additive manufacturing is being used to print functional circuits onto both planar and non-planar substrates, whereas 3D printing is usually assumed to mean building complete products in 3D space.
     
    This important difference broadens the scope of additive manufacturing solutions to include the ability to print conformal electronics including, antennas, sensors, and flexible circuits onto substrates produced by conventional manufacturing methods. This creates a landscape where additive manufacturing can co-exist with traditional manufacturing techniques, offering the ability to enhance existing 2D and 3D substrates with conformal electronics. The presentation will provide more details on additive manufacturing, especially as it relates to printed electronics.
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    • circuits
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    • optomec
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