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    Breaking News

    CPES2018: Flexible, Hybrid Electronics Go Mainstream with Major Manufacturers, Brands

    CPES2018 takes place from May 23-24 at Centennial College’s Conference Centre in Toronto.

    Related Content
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    • intelliPACK Leadership Council names Mark Baldwin, James Lee New Co-Chairs
    04.20.18
    CPES2018, Canada’s premier conference and trade show exhibition for flexible and hybrid electronics (FHE), is the place where industry and academia meet to do business and find opportunity.
     
    Organized by the intelliFLEX Innovation Alliance, CPES2018 takes place from May 23-24 at Centennial College’s Conference Centre in Toronto. 

    “What happens over coffee and on the exhibition floor at CPES2018 is just as valuable, if not more so, than the insights gained from who’s on the stage,” said Peter Kallai, CPES2018 co-chair, president and CEO of intelliFLEX.

    It all begins on Day Zero (May 22) – extend your skills with one of four Masterclasses led by industry experts. Choose from Human-Centered Design, Smart Textiles, Evolving Standards or Intellectual Property.

    This is followed by two days of engagement with scores of innovators and thought leaders from around the world through keynotes, plenary sessions, panel discussions, the Women in FHE STEM Networking Breakfast, startup pitch sessions and multiple networking opportunities.

    Masterclasses
    Justine Decaens, Program Manager CTT Group, has been confirmed to lead the Smart Textiles Masterclass. This workshop will cover a wide variety of pitfalls, key market trends and case studies, to equip your team for success.

    New additions to the Day 1 lineup of industry speakers exploring FHE applications:
    • Sam Alesio, managing director, Tyco Electronics, will take part in the Session on Automotive FHE applications for the automotive industry;
    • Gautam Debnath, packaging development manager, GlaxoSmithKline Health, who will take part in the Smart Packaging & Retail panel to discuss expectations and realities in smart packaging for over-the-counter medications;
    • Luc Frechette, professor at the University of Sherbrooke and its Interdisciplinary Institute for Technological Innovation – 3IT. He will discuss flexible sensors for intelligent tire monitoring and energy harvesting from tire deformation, to improve active stability control and noise reduction in automobiles;
    • Ganesh Iyer, VP of Engineering, Martinrea International, will take part in the Session on Automotive and discuss how this diversified global automotive supplier is responding to OEM needs with new materials and FHE applications;
    • Ralf Lenigk, senior microfluids researcher, GE Global Health Research, who will take part in the Session on Smart Textiles & Wearables. He will discuss sweat and how it’s a great source of health data.
    Day 2: From Materials, to Components and Manufacturing
    • Martin Bolduc, researcher with INO, Canada’s leading design and development firm of optic and photonic solutions. Martin will discuss fabrication strategies for creating the flexible, low-cost sensors required by intelligent systems for the Internet of Things;
    • Doyle Edwards, director of Government Programs, Brewer Science, who will introduce and lead the Scaling Up 2D Flexible Electronics session;
    • Chantal Paquet, research officer, the National Research Council of Canada, who will discuss new ink development at the NRC as part of the Scaling Up 2D Flexible Electronics session;
    • Doug Suerich, product evangelist, The Peer Group Inc. He will take part in the Scaling Up Manufacturing Session to discuss using software tools to achieve high-volume FHE manufacturing with standards, by drawing on the lessons learned from the semiconductor industry;
    • Sara Vella, senior research scientist, PE Group, XRCC, who will give a Gold Sponsor presentation on FHE developments and applications at XRCC as part of the Scaling Up 2D Flexible Electronics session.
     For a list of speakers, click here.

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    Related Breaking News

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      Foundational Work for NextFlex Materials & Process Database Now Underway

      Foundational Work for NextFlex Materials & Process Database Now Underway

      NextFlex just kicked off an 18-month Air Force Research Laboratory (AFRL)-sponsored project.
      04.17.18

    • Breaking News | Flexible and Printed Electronics | Sensors and Wearables | Smart Cards and Packaging

      CPES2018 Expands Lineup of Keynotes and International Speakers

      Conference will be held May 23-24 at Centennial College’s Conference Centre in Toronto.
      03.23.18

    • Breaking News | Semiconductors and Quantum Dots | Suppliers News

      Brewer Science Ramps Capabilities to Support China’s Growing Semiconductor Market

      Company to demonstrate wafer-level packaging and advanced lithography capabilities at CSTIC and SEMICON China.
      03.15.18


    • Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Printed Batteries | Sensors and Wearables | Smart Cards and Packaging | Suppliers News
      2018FLEX Highlights Opportunities for Flexible Hybrid Electronics

      2018FLEX Highlights Opportunities for Flexible Hybrid Electronics

      Conference shows new developments in sensors, wearables and more.
      David Savastano, Editor 03.06.18

    • Breaking News | Flexible and Printed Electronics | Manufacturers News | Mergers and Acquisitions
      intelliPACK Leadership Council names Mark Baldwin, James Lee New Co-Chairs

      intelliPACK Leadership Council names Mark Baldwin, James Lee New Co-Chairs

      Baldwin is president and co-founder at TUKU, and Lee is director, technology and innovation, Jones Packaging.
      03.02.18

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