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    Breaking News

    CPES2018 Expands Lineup of Keynotes and International Speakers

    Conference will be held May 23-24 at Centennial College’s Conference Centre in Toronto.

    Related CONTENT
    • intelliFLEX Innovation Alliance Holds Virtual CPES2021
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    • CPES2018 Lineup of Speakers, Pre-Conference Workshops Announced
    • intelliFLEX Congratulates Supercluster Winners
    • Support Builds for CPES2018
    03.23.18
    CPES2018, Canada’s annual conference and tradeshow exhibition for printable and flexible electronics, is pulling together a strong Canadian and international slate of participants.
     
    Masterclasses, keynotes, plenary sessions, panel discussions, a Women in FHE STEM Networking Breakfast, startup pitch sessions and an awards program are all packed into a 2.5-day agenda.
     
    “Now in our fourth year, it’s become clear to us where we can add real value to attendees by putting that emphasis on networking, as well as the collaborations that are required to commercialize new products and applications that have real market pull,” said Peter Kallai, co-chair and chief executive of the organization behind CPES2018, Canada’s intelliFLEX Innovation Alliance.
     
    intelliFLEX members and these international industry leaders will come together on May 23-24 at Centennial College’s Conference Centre in Toronto to share ideas and forge new relationships. For those who arrive early, masterclasses on human-centered design, smart textiles, standards development and intellectual property take place on May 22.
     
    “At CPES2018, we explore how flexible and hybrid electronics are enabling this transformation and migrating us toward the Internet of Everything in industries ranging from aerospace and automotive, to smart packaging and retail, and smart textiles and wearables,” Kallai concluded.
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    • wearables
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    Related Breaking News

    • Breaking News | Flexible and Printed Electronics | Manufacturers News | Research Institutions | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities
      intelliFLEX Innovation Alliance Holds Virtual CPES2021

      intelliFLEX Innovation Alliance Holds Virtual CPES2021

      More than 180 colleagues from over 80 organizations in 15 countries around the world connected, contributed, and learned, organizers said.
      03.25.21

    • Breaking News | Flexible and Printed Electronics | Manufacturers News | Mergers and Acquisitions
      intelliPACK Leadership Council names Mark Baldwin, James Lee New Co-Chairs

      intelliPACK Leadership Council names Mark Baldwin, James Lee New Co-Chairs

      Baldwin is president and co-founder at TUKU, and Lee is director, technology and innovation, Jones Packaging.
      03.02.18

    • Breaking News | Flexible and Printed Electronics | Manufacturers News | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Research Institutions | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Suppliers News | Universities

      CPES2018 Lineup of Speakers, Pre-Conference Workshops Announced

      CPES2018 takes place from May 23-24 at Centennial College's Conference Centre in Toronto.
      02.23.18


    • Breaking News | Conductive Inks and Coatings | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Nanomaterials | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Research Institutions | RFID and NFC | Sensors and Wearables | Smart Cards and Packaging | Universities

      intelliFLEX Congratulates Supercluster Winners

      Real work now begins with Advanced Manufacturing Supercluster partners.
      02.20.18

    • Conductive Inks and Coatings | Electronic Materials | Energy Curing/Sintering | Film, Paper, Glass and Substrates | Flexible and Printed Electronics | Lab and Testing | Manufacturing | Printing | Research Institutions | Sensors and Wearables | Smart Cards and Packaging | Universities
      Support Builds for CPES2018

      Support Builds for CPES2018

      CPES2018 is Canada’s top event for flexible and hybrid electronics.
      01.25.18

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