• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Add Your Company
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Breaking News

    Smart Packaging: Printed Electronics as Growth Driver

    LOPEC 2019 in Munich will highlight benefits, possibilities of printed electronics for packaging.

    Smart packaging is a cross-sector trend and near-field communication, NFC for short, plays a key role. (Source: LOPEC)
    Smart packaging is a cross-sector trend and near-field communication, NFC for short, plays a key role. (Source: LOPEC)
    Related CONTENT
    • RFID Innovations You Can Touch: Smartrac at RFID Journal Live! 2018
    • STMicroelectronics Exhibits Latest Solutions for Smart Industry at TECHNO-FRONTIER 2018
    • RISE Acreo Brings Together Sweden’s Research Expertise for Printed Electronics
    • A Look at Flexible Electronics: Printed Electronics Now Interview with Dr. Mike Idacavage
    • Grand View Research Forecasts IoT in Retail Market Size From 2018-2025
    10.02.18
    When pharmaceutical packages sound an alarm or food cartons measure the temperature, printed electronics are involved. LOPEC, the International Exhibition and Conference for the Printed Electronics Industry in Munich, will provide information about next generation packaging from March 19-21, 2019.
     
    Who says it is merely a cardboard box? Printed circuits, displays and the like let packages become truly multi-talented.
     
    “Since printed electronics are thin, lightweight, flexible and yet robust, they can be integrated very well into packaging, either during production or as an affixed e-label,” said Dr. Klaus Hecker, managing director of the OE-A (Organic and Printed Electronics Association), a working group within the VDMA, the co-organizer of LOPEC.
     
    Packaging with integrated electronics opens up new communication channels because it links the real world with the digital world. For instance, in healthcare: Prototypes of drug packages with integrated e-paper display already exist. That way, using apps and Bluetooth, doctors can notify their patients of their individual dosages and easily adjust those if their state of health changes. “Printed electronics is becoming increasingly important in personalized medicine,” says Hecker.
     
    The pressure to optimize costs is driving smart pharmaceutical packaging. About one-fifth of all patients do not take their medication correctly—leading to expensive consequences such as antibiotic resistance or follow-up treatments. Blister packs with integrated clocks and circuits that register tablet removal are supposed to solve that problem: In case the intake is forgotten, the package flashes, emits an alarm or sends a reminder message. Smart packaging is already being used in clinical studies in which drug manufacturers test new drug substances on thousands of subjects, thus helping to reduce costs. Packaging with built-in temperature and humidity sensors can monitor the correct storage of drugs. Sensor technology is also of interest for food and other sensitive goods.
     
    Smart packaging is a cross-sector trend. Near-field communication, NFC for short, plays a key role here, and is widely known from metro tickets, ski passes and more recently also from contactless payment by mobile phone. Packaging with NFC chips brings a breath of fresh air into marketing, because they connect brand products directly with the customer. Product information, videos and more are sent to the consumer’s smartphone as soon as it is held close to the packaging. As a seal of authenticity, NFC tags also protect perfumes, wine and other luxury goods against counterfeiting.
     
    The global market for smart packaging is developing faster than anticipated and is expected to reach a volume of over 48 billion US dollars in 2024. “Printed electronics is making a significant contribution to this growth,” emphasizes Hecker. “We are thrilled that LOPEC 2019 will once again cover the entire value chain of printed electronics, from materials development to plant construction to the end product.” With its extensive exhibition and conference program, LOPEC is not only targeting insiders but also representatives of all sectors and industries that want to increase their competitiveness with the aid of printed electronics.
    Related Searches
    • displays
    • sensors
    • nfc
    • circuits
    Suggested For You
    STMicroelectronics Launches New NFC Dynamic Tag ICs STMicroelectronics Launches New NFC Dynamic Tag ICs
    Conductive Inks Conference to Examine Smart Packaging, New Technologies and More Conductive Inks Conference to Examine Smart Packaging, New Technologies and More
    QUAD INDUSTRIES QUAD INDUSTRIES
    TUKU Connects Brands and Retailers to Their Customers TUKU Connects Brands and Retailers to Their Customers
    Liquid X, Bonbouton Agree to Collaborate on Creating Advanced Textile-Based Sensors Liquid X, Bonbouton Agree to Collaborate on Creating Advanced Textile-Based Sensors
    Introducing a Conference on Electronic and Conductive Inks Introducing a Conference on Electronic and Conductive Inks
    YUNI Beauty Interacts with Customers through NFC YUNI Beauty Interacts with Customers through NFC
    Opportunities Lie Ahead for Commercialization of Printed Electronics Opportunities Lie Ahead for Commercialization of Printed Electronics
    Confidex, Sasken Finalists for NFC Forum Confidex, Sasken Finalists for NFC Forum's NFC Innovation Awards 2018
    Flexible Electronics and the 2018 FIFA World Cup Flexible Electronics and the 2018 FIFA World Cup
    Smartrac Expands NFC Portfolio for Challenging Applications Smartrac Expands NFC Portfolio for Challenging Applications
    Inno-Flex Brings Nearly 50 Years of Experience to World of Printed Electronics Inno-Flex Brings Nearly 50 Years of Experience to World of Printed Electronics
    InSCOPE Promotes Innovation in Printed Electronics InSCOPE Promotes Innovation in Printed Electronics
    Varitron Joins intelliFLEX Varitron Joins intelliFLEX
    Avery Dennison Details State of Smart Labeling Market (Part I) Avery Dennison Details State of Smart Labeling Market (Part I)

    Related Breaking News

    • Breaking News | Displays and Lighting | Research Institutions

      Fraunhofer FEP: Hybrid OLED Creates Innovative, Functional Luminous Surfaces

      Presenting hybrid flexible OLEDs integrated into textile designs within the EU-funded project PI-SCALE for the first time at LOPEC.
      02.21.19

    • 3D Printing | Breaking News
      BASF Invests in Alchemist Accelerator

      BASF Invests in Alchemist Accelerator

      BASF accelerates its outreach towards technologies like artificial intelligence, internet of things and robotics.
      02.21.19

    • 3D Printing | Breaking News | Manufacturing

      Arkema Showcases Collaborative Innovations in 3D Printing Technologies at TCT Asia 2019

      TCT Asia took place in Shanghai Feb. 21-23.
      02.21.19


    • Breaking News | Flexible and Printed Electronics | Printed Circuit Boards/Membrane Switches/In Mold Electronics

      TactoTek, Geely Design, CEVT Initiate Automotive Interiors Project in Printed, In-Mold Electronics

      Geely Design to lead Injection Molded Structural Electronics design solutions of interior smart surfaces with CEVT.
      02.20.19

    • Breaking News | RFID and NFC
      America Today Selects Nedap’s RFID Solution

      America Today Selects Nedap’s RFID Solution

      First RFID rollout on the Dutch retail market.
      02.20.19

    • Breaking News | Semiconductors and Quantum Dots | Sensors and Wearables

      STMicroelectronics Releases Full-color Ambient Light Sensor for Smartphones

      The VD6281 is in production and available now from ST sales channels.
      02.20.19


    • Breaking News | Semiconductors and Quantum Dots

      American Semiconductor Launches Fully Flexible, Ultra Bluetooth IC

      The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth Low Energy (BLE) communication.
      02.20.19

    • 3D Printing | Breaking News
      Massivit 3D Printed 1:1 Concept Car Signals the Future of Concept Prototyping

      Massivit 3D Printed 1:1 Concept Car Signals the Future of Concept Prototyping

      First full-scale 3D printed concept car to ever be exhibited at Festival Automobile International.
      02.20.19

    • 3D Printing | Breaking News | Manufacturing

      Air Force Awards nScrypt’s Research Company Phase 2 Contract for 3D printed Conformal Antenna Arrays

      Sciperio developed a fully printed phased array antenna for the Air Force in 2016.
      02.19.19


    • Breaking News | Research Institutions | Semiconductors and Quantum Dots | Sensors and Wearables
      imec Designs Sub-mW Radar for Presence Detection in Smart Buildings

      imec Designs Sub-mW Radar for Presence Detection in Smart Buildings

      The imec chip was designed in standard 40nm CMOS and has a die size of 1.8mm2.
      02.19.19

    • Breaking News | RFID and NFC | Semiconductors and Quantum Dots | Sensors and Wearables
      STMicroelectronics

      STMicroelectronics' NFC Universal Device Eases EMVCo 3.0 Compliance

      The ST25R3916 is in production now, available in a 5mm x 5mm 32-pin QFN package.
      02.19.19

    • Breaking News | RFID and NFC
      Smartrac at LogiMAT: Green Tags, Sensors, Solutions for Industry 4.0

      Smartrac at LogiMAT: Green Tags, Sensors, Solutions for Industry 4.0

      Smartrac will be in Hall 4 at booth B09, Feb. 19-21. LogiMAT takes place in Neue Messe, Stuttgart, Germany.
      02.19.19

    • Breaking News | Graphene, Perovskites and Carbon Nanotubes | Research Institutions | Sensors and Wearables
      Graphene Pavilion Presents 20+ Prototypes at MWC 2019

      Graphene Pavilion Presents 20+ Prototypes at MWC 2019

      Graphene Pavilion will be in NEXTech Hall 8.0 at Stand 8.0K31 on Feb. 25-28.
      02.19.19

    • Breaking News | Suppliers News
      Harper Corporation of America Presents at 2019 GAA Global Summit

      Harper Corporation of America Presents at 2019 GAA Global Summit

      The 2019 GAA Global Summit will be held March 4-6 at the Hyatt Regency Clearwater Beach in Clearwater, FL.
      02.19.19

    • Breaking News | RFID and NFC

      Small ‘Glass Tag NFC’ Enlarges Range for Embedded Tagging

      It is resistant to most chemicals and made from biocompatible glass.
      02.18.19

    Breaking News
    • Fraunhofer FEP: Hybrid OLED Creates Innovative, Functional Luminous Surfaces
    • BASF Invests in Alchemist Accelerator
    • Arkema Showcases Collaborative Innovations in 3D Printing Technologies at TCT Asia 2019
    • TactoTek, Geely Design, CEVT Initiate Automotive Interiors Project in Printed, In-Mold Electronics
    • America Today Selects Nedap’s RFID Solution
    View Breaking News >
    CURRENT ISSUE

    Fall 2018

    • Printed Electronics Now’s International Suppliers’ Directory
    • Brand Owners See Benefits of Smart Packaging
    • OLEDs, Quantum Dots Make Gains in the Display Market
    • New Opportunities for Flexible Sensors
    • Flexible Electronics Applied to the Development of Sensors
    • Conference Gives Glimpse into Future of Printed Electronics, Conductive Inks
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • privacy policy
    • term and condition
    • about us
    • contact us

    follow us

    Subscribe

    magazines

    Image
    Image
    Image
    Image
    Image
    Image
    Image
    Image
    Image
    Image
    Image

    Copyright © 2019 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login