David Savastano, Editor04.06.16
LOPEC 2016, the 8th International Exhibition and Conference for the Organic and Printed Electronics Industry, is opening today at Messe Munich, with some leading manufacturers on hand to discuss how flexible and printed electronics is being used to differentiate their products and benefit consumers.
Organized by the OE-A and Messe Munich, LOPEC 2016 will begin with talks by leaders from Audi AG, Sumitomo Chemical and adidas, before breaking into tracks focusing on leading topics in the field.
The conference will open with the Plenary Session. After introductory remarks by Wolfgang Mildner, founder and CEO of MSW, the Plenary Session will hear from Dr. Werner Thomas, project manager for innovation projects for Audi AG, who will discuss “ OLED Technology in Automotive Lighting.”
Ikuzo Ogawa, managing executive officer, Sumitomo Chemical, will follow with “Printed Electronics Materials and Their Applications.” Burkhard Dümler, director Program & Projects/IT Innovation, adidas group, will close the Plenary Session with “Wearables Grown Up - Status Quo.”
Technical Conference Sessions
LOPEC will them separate into four concurrent sessions, with two dedicated to the Technical Conference and two other sessions for Scientific Conference presentations.
The first Technical Conference Track will feature sessions on Lighting, Substrates and Encapsulation, and Upscaling Production and Manufacturing Processes .
Lighting will be covered by four speakers. Dr. Eric Meulenkamp, GM, OLEDWorks GmbH, will analyze “How OLED Lighting Can Succeed.” He will be followed by Takeshi Hakii, Konica Minolta’s OLED R&D manager, who will discuss “Roll-to-Roll Production of Flexble OLED Lighting Panels.” Dr. Robert Abbel, research scientist from the Holst Centre – TNO, will cover “Process Development for Industrial Scale Manufacturing of Flexible OLEDs,” and Sukhan Kim, principal researcher, GJM Co., Ltd., will close the Lighting session with a talk on “Development of a R2R Evaporation System for Flexible OLED Lighting.”
The Substrates and Encapsulation session will feature talks from three organizations, beginning with Dr. John Fahlteich, senior scientist-project manager, Fraunhofer FEP, whose talk is on “Encapsulation of Flexible Electronics: Technologies and Challenges for Bringing Barrier Products to Application.” Next up is Vitriflex CTO and co-founder Dr. Ravi Prasad, who will discuss “Roll to Roll Production of Transparent Ultra-Barrier Films.” Dr. Stéphane Cros, research engineer, University Grenoble Alpes, INES, CEA/LITEN, who will analyze “A Comprehensive Approach for a Better Choice of Flexible Encapsulation Materials and Processes.”
Seven industry leaders will offer their insights during the Upscaling Production and Manufacturing Processes session. They are
Andrea Glawe, regional sales director Asia-Pacific, KROENERT GmbH & Co KG (“Technology Transfer for Intermitted Slot Die Coating Processes Developed for Battery Electrodes to Conductive Layer Application and OPV Products”); CERADROP deputy managing director Nicolas Bernardin (“ Digital Functional Materials Deposition System for Printed Electronics and Smart 3D Printing Applications”);
Dr. Marja Vilkman, senior scientist, VTT Technical Research Centre of Finland (“Organic Photovoltaics and Transistors Enabled by Printing, Plasma Treatment, Direct Etching, Lift-Off and Self-Alignment – All Transferred into a R2R Printing Line”); Dr. Piotr Wierzchowiec, Merck KGaA scientist (“Printed Thin Film Transistors with Merck’s High Performance Organic Semiconductors and Dielectrics.”
In addition, Thomas Kolbusch, VP, Coatema Coating Machinery GmbH, will discuss “Integration of Nano Imprint R2R into the Production Processes for Printed Electronic Products”; Naoki Rikita, technical director, MMC Ryotec by Mitsubishi Materials, will focus on “Optimization of Adhesive Coating by High Precision Slot Die”; and Hans Niessen, project manager, Bosch Rexroth, will analyze “Industry 4.0: Creating Competitive Edge for Equipment Manufacturers.”
The second track of the Technical Conference features sessions on Publicly Funded Projects, Technological Challenges of Printed Electronics Applications I and Technological Challenges of Printed Electronics Applications II.
In the Publicly Funded Projects session, Dr. Fabrice Domingues Dos Santos, president, Arkema – Piezotech, will open with “The HAPPINESS Project, a New Approach for Human/Machine Interface.” Jukka-Tapani Mäkinen, senior scientist, VTT - Technical Research Centre of Finland,, will follow with a talk on “Optical Features on Printed Electronics by Hybrid Integration.”
Dr. Joanne Wilson, program manager, senior research fellow TNO, Holst Centre, will cover “PI-SCALE: Creating an Open Access European Flexible OLED Pilot Line,” and Dr. Giovanni Nisato, business and technology development senior manager, CSEM, will close with “Towards High Performance OPV and Related Technologies: Experiences from the Sunflower FP7 Project.”
The subject of Technological Challenges of Printed Electronics Applications I will feature two speakers: Tactotek CTO Antti Keränen, whose topic is “Injection Molded Structural Electronics,” and Christoph Bay, who will speak on “Continuous Monitoring of Manufacturing Processes Dedicated to PE.”
Technological Challenges of Printed Electronics Applications II will have four industry leaders offering their insights. Thin Film Electronics COO Dr. Peter Fischer, who will open the session with “Printed Electronics – The Real Challenge Has Just Begun.” Dr. Ton van Mol, managing director, Holst Centre, will present on “Printed Electronics for Medical Devices and Wearables.”
Dr. Christine Ho, co-founder and CEO, Imprint Energy, Inc., will discuss The Challenges of Integrating Ultrathin and Flexible Printed Batteries into Functional Electronic Devices, and the Strategies to Enable Truly Embedded Power.” Dr. Michael Korell, project manager – intrapreneur, Evonik Creavis GmbH, will close the second track with “A New Energy Storage Technology for the Internet of Things .”
Scientific Conference Tracks
As is the case with the Technical Conference, the Scientific Conference also features two concurrent tracks, The first track of the April 6 Scientific Conference will cover the topics of Circuit Design and Smart Systems, Sensor Systems and Printing and Patterning Processes I.
Circuit Design and Smart Systems will features talks by Prof. Dr. Matti Mäntysalo of Tampere University of Technology, who will discuss “Printed Epidermal Electronic System.” Dr. Richard Wilson of CDT Ltd, will focus on “Printable Water Sensor Systems Utilising Organic Electronic Transducers.” Dr. Neil Graddage of National Research Council of Canada will offer insights on “Smart Drug Packaging Incorporating Printed Resistance Based Multiplexing.” Bernhard Polzinger of Hahn-Schickard will conclude the session with “Current Carrying Capacity of Inkjet Printed Silver Tracks.”
Sensor Systems will feature talks by Dr. Weiyuan Cheng of Display Technology Center (DTC), Industrial Technology Research Institute (ITRI) (“Technical Challenges of Ultrathin Foldable AMOLED with On-cell Touch Sensor”); Dr. Younsu Jung of Sunchon National University (“Fully Printed SWNT-TFT for Sensor Tags and TFT-Active Matrix-Based Sensors”)’; Dr. Sandro Tedde, Siemens Healthcare GmbH (“Hybrid Photodetectors for X-Ray Imaging”); and Elisa Starruß of Fraunhofer Institut für Werkstoff- und Strahltechnik (“Fully Organic Aerosol Jet Printed Piezoelectric Sensor”).
Printing and Patterning Processes I be covered by Prof. Nir Tessler of Technion Israel Institute of Technology, who will analyze “Direct Printing of 10 µ Resolution Patterns Using Commercial Pad Printer and Commercial Inks.” Martin Ungerer, Karlsruhe Institute of Technology, will focus on “Extrusion Printing Process for the Manufacturing of Electrodes on Planar and Curved Substrates.”
16:20 - 16:40
Dr. Martin Bolduc of INO - National Optics Institute will cover “Pulse Shaping Effect on Laser Sintering of Ag Nanoparticle-based Inks.” Swansea University’s Dr. Davide Deganello will discuss “Towards Improved Printed Electronics: Assessing the Role of Fluid Elasticity on Extensional Surface Instabilities Formation for Improving Uniform Deposition in Printing.” Prof. Dr. Pim Groen of Holst Centre will close the session with “High Volume Solution Based Roll-to-Roll Processing of Plastic Electronic Devices.”
The second Scientific Conference track features sessions covering Recent Progress in Material Performances, Additive Manufacturing in Printed Electronics, and Photovoltaic Devices.
Four presenters will discuss their recent findings during Recent Progress in Material Performances. Prof. Dr. Pim Groen of Holst Centre will cover “Thin-Film Barriers for OLED Devices and Photovoltaics.” Dr. Tobias Stubhan, Nanograde AG, will present on “Low-Yemperature Printable Charge Extraction Materials for Large-Scale Production of Perovskite Solar Cells.”
Will Scheideler, UC Berkeley, will focis on “Designing Inorganic Sol-gel Metal Oxide Inks for Gravure Printed Transparent, High-Performance Electronics,” and Dr. Oleksandr Glushko, Erich Schmid Institute, will close with “Measuring Mechanical Reliability of Flexible Electronics: An Overview of Testing and Characterization Techniques.”
Additive Manufacturing in Printed Electronics is a hot topic, and four presenters will offer their insights in this session. Lisa-Marie Faller, Alpen Adria University, will analyze “3D-Printed Steel Capacitive Force/Pressure Sensor with Inkjet-Printed Electrodes.” Dr. Ana Moya, IMB-CNM (CSIC), will cover “Inkjet-Printed Dissolved Oxygen Sensors on Flexible Plastic Substrates.”
Dr. Matic Krivec, CTR Carinthian Tech Research AG, will discuss “Ink-Jet Printing of Conductive Ag Electrodes on 3D Printed Polymer Substrates for Advanced Packaging.” Joachim Bahr, Technische Hochschule Nürnberg, will talk on the topic of “Influence of the Surface Roughness of Polymer Substrates on the Printing Quality of Ink Jet Printed Silver Nano Ink.”
Photovoltaic Devices, which closes the second Scientific Conference track, will feature three presentations, beginning with CSEM’s Jan Mayer, whose talk is on “Diffractive Nanostructures for Enhanced Light-Harvesting in OPV Devices.” Jens Czolk, Karlsruhe Institute of Technology (KIT), will analyze “Highly Efficient, All-Solution Processed, Mechanically Flexible, Semi-Transparent Organic Solar Modules,” while Prof. Dr. Pierre Beaujuge, King Abdullah University of Science and Technology (KAUST), will close the Photovoltaic Devices program with “Solution-Processed Organic Solar Cells and Tandems.”
Organized by the OE-A and Messe Munich, LOPEC 2016 will begin with talks by leaders from Audi AG, Sumitomo Chemical and adidas, before breaking into tracks focusing on leading topics in the field.
The conference will open with the Plenary Session. After introductory remarks by Wolfgang Mildner, founder and CEO of MSW, the Plenary Session will hear from Dr. Werner Thomas, project manager for innovation projects for Audi AG, who will discuss “ OLED Technology in Automotive Lighting.”
Ikuzo Ogawa, managing executive officer, Sumitomo Chemical, will follow with “Printed Electronics Materials and Their Applications.” Burkhard Dümler, director Program & Projects/IT Innovation, adidas group, will close the Plenary Session with “Wearables Grown Up - Status Quo.”
Technical Conference Sessions
LOPEC will them separate into four concurrent sessions, with two dedicated to the Technical Conference and two other sessions for Scientific Conference presentations.
The first Technical Conference Track will feature sessions on Lighting, Substrates and Encapsulation, and Upscaling Production and Manufacturing Processes .
Lighting will be covered by four speakers. Dr. Eric Meulenkamp, GM, OLEDWorks GmbH, will analyze “How OLED Lighting Can Succeed.” He will be followed by Takeshi Hakii, Konica Minolta’s OLED R&D manager, who will discuss “Roll-to-Roll Production of Flexble OLED Lighting Panels.” Dr. Robert Abbel, research scientist from the Holst Centre – TNO, will cover “Process Development for Industrial Scale Manufacturing of Flexible OLEDs,” and Sukhan Kim, principal researcher, GJM Co., Ltd., will close the Lighting session with a talk on “Development of a R2R Evaporation System for Flexible OLED Lighting.”
The Substrates and Encapsulation session will feature talks from three organizations, beginning with Dr. John Fahlteich, senior scientist-project manager, Fraunhofer FEP, whose talk is on “Encapsulation of Flexible Electronics: Technologies and Challenges for Bringing Barrier Products to Application.” Next up is Vitriflex CTO and co-founder Dr. Ravi Prasad, who will discuss “Roll to Roll Production of Transparent Ultra-Barrier Films.” Dr. Stéphane Cros, research engineer, University Grenoble Alpes, INES, CEA/LITEN, who will analyze “A Comprehensive Approach for a Better Choice of Flexible Encapsulation Materials and Processes.”
Seven industry leaders will offer their insights during the Upscaling Production and Manufacturing Processes session. They are
Andrea Glawe, regional sales director Asia-Pacific, KROENERT GmbH & Co KG (“Technology Transfer for Intermitted Slot Die Coating Processes Developed for Battery Electrodes to Conductive Layer Application and OPV Products”); CERADROP deputy managing director Nicolas Bernardin (“ Digital Functional Materials Deposition System for Printed Electronics and Smart 3D Printing Applications”);
Dr. Marja Vilkman, senior scientist, VTT Technical Research Centre of Finland (“Organic Photovoltaics and Transistors Enabled by Printing, Plasma Treatment, Direct Etching, Lift-Off and Self-Alignment – All Transferred into a R2R Printing Line”); Dr. Piotr Wierzchowiec, Merck KGaA scientist (“Printed Thin Film Transistors with Merck’s High Performance Organic Semiconductors and Dielectrics.”
In addition, Thomas Kolbusch, VP, Coatema Coating Machinery GmbH, will discuss “Integration of Nano Imprint R2R into the Production Processes for Printed Electronic Products”; Naoki Rikita, technical director, MMC Ryotec by Mitsubishi Materials, will focus on “Optimization of Adhesive Coating by High Precision Slot Die”; and Hans Niessen, project manager, Bosch Rexroth, will analyze “Industry 4.0: Creating Competitive Edge for Equipment Manufacturers.”
The second track of the Technical Conference features sessions on Publicly Funded Projects, Technological Challenges of Printed Electronics Applications I and Technological Challenges of Printed Electronics Applications II.
In the Publicly Funded Projects session, Dr. Fabrice Domingues Dos Santos, president, Arkema – Piezotech, will open with “The HAPPINESS Project, a New Approach for Human/Machine Interface.” Jukka-Tapani Mäkinen, senior scientist, VTT - Technical Research Centre of Finland,, will follow with a talk on “Optical Features on Printed Electronics by Hybrid Integration.”
Dr. Joanne Wilson, program manager, senior research fellow TNO, Holst Centre, will cover “PI-SCALE: Creating an Open Access European Flexible OLED Pilot Line,” and Dr. Giovanni Nisato, business and technology development senior manager, CSEM, will close with “Towards High Performance OPV and Related Technologies: Experiences from the Sunflower FP7 Project.”
The subject of Technological Challenges of Printed Electronics Applications I will feature two speakers: Tactotek CTO Antti Keränen, whose topic is “Injection Molded Structural Electronics,” and Christoph Bay, who will speak on “Continuous Monitoring of Manufacturing Processes Dedicated to PE.”
Technological Challenges of Printed Electronics Applications II will have four industry leaders offering their insights. Thin Film Electronics COO Dr. Peter Fischer, who will open the session with “Printed Electronics – The Real Challenge Has Just Begun.” Dr. Ton van Mol, managing director, Holst Centre, will present on “Printed Electronics for Medical Devices and Wearables.”
Dr. Christine Ho, co-founder and CEO, Imprint Energy, Inc., will discuss The Challenges of Integrating Ultrathin and Flexible Printed Batteries into Functional Electronic Devices, and the Strategies to Enable Truly Embedded Power.” Dr. Michael Korell, project manager – intrapreneur, Evonik Creavis GmbH, will close the second track with “A New Energy Storage Technology for the Internet of Things .”
Scientific Conference Tracks
As is the case with the Technical Conference, the Scientific Conference also features two concurrent tracks, The first track of the April 6 Scientific Conference will cover the topics of Circuit Design and Smart Systems, Sensor Systems and Printing and Patterning Processes I.
Circuit Design and Smart Systems will features talks by Prof. Dr. Matti Mäntysalo of Tampere University of Technology, who will discuss “Printed Epidermal Electronic System.” Dr. Richard Wilson of CDT Ltd, will focus on “Printable Water Sensor Systems Utilising Organic Electronic Transducers.” Dr. Neil Graddage of National Research Council of Canada will offer insights on “Smart Drug Packaging Incorporating Printed Resistance Based Multiplexing.” Bernhard Polzinger of Hahn-Schickard will conclude the session with “Current Carrying Capacity of Inkjet Printed Silver Tracks.”
Sensor Systems will feature talks by Dr. Weiyuan Cheng of Display Technology Center (DTC), Industrial Technology Research Institute (ITRI) (“Technical Challenges of Ultrathin Foldable AMOLED with On-cell Touch Sensor”); Dr. Younsu Jung of Sunchon National University (“Fully Printed SWNT-TFT for Sensor Tags and TFT-Active Matrix-Based Sensors”)’; Dr. Sandro Tedde, Siemens Healthcare GmbH (“Hybrid Photodetectors for X-Ray Imaging”); and Elisa Starruß of Fraunhofer Institut für Werkstoff- und Strahltechnik (“Fully Organic Aerosol Jet Printed Piezoelectric Sensor”).
Printing and Patterning Processes I be covered by Prof. Nir Tessler of Technion Israel Institute of Technology, who will analyze “Direct Printing of 10 µ Resolution Patterns Using Commercial Pad Printer and Commercial Inks.” Martin Ungerer, Karlsruhe Institute of Technology, will focus on “Extrusion Printing Process for the Manufacturing of Electrodes on Planar and Curved Substrates.”
16:20 - 16:40
Dr. Martin Bolduc of INO - National Optics Institute will cover “Pulse Shaping Effect on Laser Sintering of Ag Nanoparticle-based Inks.” Swansea University’s Dr. Davide Deganello will discuss “Towards Improved Printed Electronics: Assessing the Role of Fluid Elasticity on Extensional Surface Instabilities Formation for Improving Uniform Deposition in Printing.” Prof. Dr. Pim Groen of Holst Centre will close the session with “High Volume Solution Based Roll-to-Roll Processing of Plastic Electronic Devices.”
The second Scientific Conference track features sessions covering Recent Progress in Material Performances, Additive Manufacturing in Printed Electronics, and Photovoltaic Devices.
Four presenters will discuss their recent findings during Recent Progress in Material Performances. Prof. Dr. Pim Groen of Holst Centre will cover “Thin-Film Barriers for OLED Devices and Photovoltaics.” Dr. Tobias Stubhan, Nanograde AG, will present on “Low-Yemperature Printable Charge Extraction Materials for Large-Scale Production of Perovskite Solar Cells.”
Will Scheideler, UC Berkeley, will focis on “Designing Inorganic Sol-gel Metal Oxide Inks for Gravure Printed Transparent, High-Performance Electronics,” and Dr. Oleksandr Glushko, Erich Schmid Institute, will close with “Measuring Mechanical Reliability of Flexible Electronics: An Overview of Testing and Characterization Techniques.”
Additive Manufacturing in Printed Electronics is a hot topic, and four presenters will offer their insights in this session. Lisa-Marie Faller, Alpen Adria University, will analyze “3D-Printed Steel Capacitive Force/Pressure Sensor with Inkjet-Printed Electrodes.” Dr. Ana Moya, IMB-CNM (CSIC), will cover “Inkjet-Printed Dissolved Oxygen Sensors on Flexible Plastic Substrates.”
Dr. Matic Krivec, CTR Carinthian Tech Research AG, will discuss “Ink-Jet Printing of Conductive Ag Electrodes on 3D Printed Polymer Substrates for Advanced Packaging.” Joachim Bahr, Technische Hochschule Nürnberg, will talk on the topic of “Influence of the Surface Roughness of Polymer Substrates on the Printing Quality of Ink Jet Printed Silver Nano Ink.”
Photovoltaic Devices, which closes the second Scientific Conference track, will feature three presentations, beginning with CSEM’s Jan Mayer, whose talk is on “Diffractive Nanostructures for Enhanced Light-Harvesting in OPV Devices.” Jens Czolk, Karlsruhe Institute of Technology (KIT), will analyze “Highly Efficient, All-Solution Processed, Mechanically Flexible, Semi-Transparent Organic Solar Modules,” while Prof. Dr. Pierre Beaujuge, King Abdullah University of Science and Technology (KAUST), will close the Photovoltaic Devices program with “Solution-Processed Organic Solar Cells and Tandems.”
