• Login
    • Join
  • FOLLOW:
  • Subscribe Free
    • Magazine
    • eNewsletter
    Checkout
    • Magazine
    • News
    • Printed Electronics
    • Raw Materials
    • Equipment
    • Services
    • Suppliers Guide
    • Resources
    • More
  • Magazine
  • News
  • Printed Electronics
  • Raw Materials
  • Equipment
  • Services
  • Suppliers Guide
  • Resources
  • Current & Past Issues
    Features
    Editorials
    Digital Edition
    Subscribe Now
    Advertise Now
    eNewsletter Archive
    Our Team
    Editorial Guidelines
    Breaking News
    Experts Opinion
    Financial News
    Manufacturers News
    Mergers and Acquisitions
    Online Exclusives
    Personnel
    Product Releases
    Suppliers News
    Live From Shows
    Displays and Lighting
    Photovoltaics
    Printed Batteries
    Printed Circuit Boards/Membrane Switches/In Mold Electronics
    Flexible and Printed Electronics
    RFID and NFC
    Sensors and Wearables
    Smart Cards and Packaging
    Touch Screens
    Adhesives, Barriers and Encapsulants
    Chemicals, Metals and Powders
    Conductive Inks and Coatings
    Electronic Materials
    Film, Paper, Glass and Substrates
    Graphene, Perovskites and Carbon Nanotubes
    Nanomaterials
    Printed Electronic Components
    Research Reports
    Semiconductors and Quantum Dots
    Energy Curing Equipment
    Lab and Testing Equipment
    Manufacturing Equipment
    Printing Equipment
    3D Printing
    Contract Manufacturing Services
    Product Design and Testing
    Research and Consulting
    Research Institutions
    Research Reports
    Universities
    Equipment
    All Companies
    Materials
    Categories
    Converting
    Printed Electronics Systems
    Associations
    Research and Services
    Used Machinery
    Add New Company
    Industry Events
    Live from show events
    Podcasts
    Videos
    Blogs
    Slideshows
    Infographics
    Webinars
    Whitepapers
    Equipment and Services
    Glossary
    • Magazine
      • Current & Past Issues
      • Features
      • Editorial
      • Columns
      • Digital Edition
      • eNewsletter Archive
      • Editorial Guidelines
      • Subscribe Now
      • Advertise Now
    • Breaking News
    • Suppliers Guide
      • Add Your Company
      • Suppliers Guide
    • Printed Electronics
      • Photovoltaics
      • Printed Batteries
      • Printed Circuit Boards/Membrane Switches/In Mold Electronics
      • Flexible and Printed Electronics
      • RFID and NFC
      • Sensors and Wearables
      • Smart Cards and Packaging
      • Touch Screens
    • Raw Materials
      • Adhesives, Barriers and Encapsulants
      • Chemicals, Metals and Powders
      • Conductive Inks and Coatings
      • Electronic Materials
      • Film, Paper, Glass and Substrates
      • Graphene, Perovskites and Carbon Nanotubes
      • Nanomaterials
      • Semiconductors and Quantum Dots
    • Equipment
      • Energy Curing Equipment
      • Lab and Testing Equipment
      • Manufacturing Equipment
      • Printing Equipment
      • 3D Printing
    • Services
      • Contract Manufacturing Services
      • Product Design and Testing
      • Research and Consulting
      • Research Institutions
      • Research Reports
      • Universities
    • Online Exclusives
    • Slideshows
    • Blog
    • Videos
    • Podcasts
    • Infographics
    • Events
      • Industry Events
      • Live from show events
      • Webinars
    • About Us
      • About Us
      • Contact Us
      • Advertise With Us
      • Privacy Policy
      • Terms of Use
    Live From Shows

    American Semiconductor, HDM Announce JDA

    Will produce world’s first high reliability ultra-thin packaged ICs.

    Related CONTENT
    • North American Semiconductor Equipment Industry Posts November 2020 Billings
    • North American Semiconductor Equipment Industry Posts October 2020 Billings
    • North American Semiconductor Equipment Industry Posts September 2020 Billings
    • North American Semiconductor Equipment Industry Posts August 2020 Billings
    • North American Semiconductor Equipment Industry Posts July 2020 Billings
    02.19.19
    HD MicroSystems (HDM) and American Semiconductor, Inc. (ASI) announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets. 
     
    The joint development will leverage American Semiconductor’s patented wafer-level chip scale packaging technologies that are encapsulated with advanced polyimide materials provided by HD MicroSystems. 
     
    “We are honored to collaborate with HDM to establish production capacity for our new technology implemented with HDM’s unparalleled polyimide materials expertise combining large-scale processing, leading-edge technology and early consumer market insight,” said Doug Hackler, president and CEO of ASI. “Together, we are elevating and redefining the electronic world to be more seamless and personalized for all of us – whether at work or play.”
     
    “By forming this partnership, we are pairing our polyimide materials expertise with ASI’s novel wafer-level CSP process to drive a new age of electronics that will be embedded throughout our physical world in places never-before-possible,” Shigenori Kobayashi, VP/COO, HDM said.
     
    Drawing on resources from both ASI and HDM, the joint development will enable the rapid scaling of ultra-thin IC packages for high-end multilayer electronic designs (HDI), flexible hybrid electronics (FHE), and “smart structures” for the Internet of Things (IoT).
    Related Searches
    • electronics
    • inc
    • electronic
    • semiconductor
    Suggested For You
    North American Semiconductor Equipment Industry Posts November 2020 Billings North American Semiconductor Equipment Industry Posts November 2020 Billings
     North American Semiconductor Equipment Industry Posts October 2020 Billings North American Semiconductor Equipment Industry Posts October 2020 Billings
    North American Semiconductor Equipment Industry Posts September 2020 Billings North American Semiconductor Equipment Industry Posts September 2020 Billings
    North American Semiconductor Equipment Industry Posts August 2020 Billings North American Semiconductor Equipment Industry Posts August 2020 Billings
    North American Semiconductor Equipment Industry Posts July 2020 Billings North American Semiconductor Equipment Industry Posts July 2020 Billings
    North American Semiconductor Equipment Industry Posts June 2020 Billings North American Semiconductor Equipment Industry Posts June 2020 Billings
    Flexible and Printed Electronics to be Featured at CES 2019 Flexible and Printed Electronics to be Featured at CES 2019
    The Benefits of Smart Packaging The Benefits of Smart Packaging
    IDTechEx LIVE! 2018 Shows New Applications for Flexible and Printed Electronics IDTechEx LIVE! 2018 Shows New Applications for Flexible and Printed Electronics
    IDTechEx LIVE! 2018 Shows New Applications for Flexible and Printed Electronics IDTechEx LIVE! 2018 Shows New Applications for Flexible and Printed Electronics
    ASI Launches World ASI Launches World's First Smart Wine Bottle
    ASI Wins IoT Award at IDTechEx 2018 ASI Wins IoT Award at IDTechEx 2018
    ASI Wins IoT Award at IDTechEx 2018 ASI Wins IoT Award at IDTechEx 2018
    PE USA 2018 Opens with Look at New Technologies PE USA 2018 Opens with Look at New Technologies
    PE USA 2018 Opens with Look at New Technologies PE USA 2018 Opens with Look at New Technologies

    Related Live From Shows

    • FLEX/MSTC 2020 Focuses on New Applications, Opportunities for FHE

      Presenters highlight the latest developments, research in the world of flexible hybrid electronics and sensors.
      David Savastano, Editor 03.03.20

    • Displays and Lighting | Flexible and Printed Electronics | Manufacturers News | Printed Batteries | Printed Circuit Boards/Membrane Switches/In Mold Electronics | Sensors and Wearables | Suppliers News
      Scenes from FLEX/MSTC 2020

      Scenes from FLEX/MSTC 2020

      Topics included flexible and hybrid electronics applications, sensors, displays, materials and applications.
      David Savastano, Editor 03.02.20

    • SEMI Industry Strategy Symposium Europe Explores Tech's Role in Region's Most Pressing Needs

      Set for April 1-3, 2020, in Brussels, Belgium.
      03.02.20


    • SEMI-FlexTech Announces 2020 FLEXI Awards Winners

      SEMI-FlexTech Announces 2020 FLEXI Awards Winners

      SEMI-FlexTech, a SEMI Strategic Association Partner, presented the 2020 FLEXI Awards at the 19th annual FLEX 2020 Conference and Exhibition in San Jose, CA.
      02.27.20

    • Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020

      Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020

      ASMC 2020 takes place May 4-7, 2020, in Saratoga Springs, NY.
      02.27.20

    • 2020 FLEX/MSTC Examines Present, Looks Toward the Future

      2020 FLEX/MSTC Examines Present, Looks Toward the Future

      Autonomous driving, innovative contact lenses and implantable wearables among the topics as conference opens in San Jose.
      David Savastano, Editor 02.25.20


    • 2020 FLEX/MSTC to Highlight Latest Technologies, Research

      ...
      David Savastano, Editor 02.25.20

    • Volkswagen Joins SEMI

      Volkswagen Joins SEMI

      Volkswagen is a founding member of the SEMI Global Automotive Advisory Council.
      02.25.20

    • SEMI, Partners Launch Largest Microelectronics Education Initiative

      SEMI, Partners Launch Largest Microelectronics Education Initiative

      The initiative is co-funded by Erasmus+ Program.
      02.25.20


    • Breaking News | Semiconductors and Quantum Dots
      North American Semiconductor Equipment Industry Posts January 2020 Billings

      North American Semiconductor Equipment Industry Posts January 2020 Billings

      The billings figure is 5.9% lower than the final December 2019 level of $2.49 billion and is 22.9% higher than the January 2019 billings level of $1.90 billion.
      02.25.20

    • 2020 FLEX/MSTC Begins with Keynote, Concurrent Sessions

      Topics include flexible and hybrid electronics, sensors, displays, materials and applications.
      David Savastano, Editor 02.24.20

    • Tim Brosnihan Appointed Executive Director of SEMI MEMS & Sensors Industry Group

      Tim Brosnihan Appointed Executive Director of SEMI MEMS & Sensors Industry Group

      He will direct MSIG global activities including its R&D, standards, and technical programs.
      02.19.20


    • SEMI President & CEO Ajit Manocha Being Inducted into Silicon Valley Engineering Hall of Fame

      SEMI President & CEO Ajit Manocha Being Inducted into Silicon Valley Engineering Hall of Fame

      SVEC honoring Manocha for 'championing industry collaboration and driving manufacturing efficiency in multiple leadership roles.'
      02.19.20

    • SEMI-FlexTech Launches Six New FHE Projects

      SEMI-FlexTech Launches Six New FHE Projects

      Organizations including UTEP, American Semiconductor, PARC, Tekscan, Alertgy and SAFI-Tech will lead the initiatives.
      02.19.20

    • SEMI Releases Global Semiconductor Equipment Sales Forecast

      SEMI Releases Global Semiconductor Equipment Sales Forecast

      Sales will drop 10.5% to $57.6 billion in 2019 from last year’s historic peak of $64.4 billion but stage a 2020 recovery, per SEMI.
      02.19.20

    Trending
    • InnovationLab, Bitquadrat Launch Smart Mattress Cover For Patient Monitoring
    • Global Printed, Flexible, Hybrid, Textile Electronics Community Gathers Online
    • JOLED, LG Collaborate To Deliver Superior Productivity For Creative Professionals
    • Graphene Flagship Launches Redesigned Website
    • Imec: Novel Approach For Improving Gate-stack Reliability
    Breaking News
    • Graphene Flagship Launches Redesigned Website
    • TNO at Holst Centre Develops Cuddle Vest
    • Annual Outlooks at Virtual ISS 2021 Point to Global Economic, Chip Industry Growth
    • InnovationLab, Bitquadrat Launch Smart Mattress Cover for Patient Monitoring
    • imec: Novel Approach for Improving Gate-stack Reliability
    View Breaking News >
    CURRENT ISSUE

    Fall 2020

    • Flexible Electronics Is Proving to Be Ideal for Healthcare
    • COVID-19 and the Printed Electronics Industry
    • Smart Packaging Looks to Move Forward
    • Electronic & Conductive Ink Conference Showcases Future of Ink Technology
    • Printed Electronics Now’s International Suppliers’ Directory
    • View More >

    Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies.
    You can obtain detailed information about the use of cookies on our website by clicking on "More information”.

    • About Us
    • Privacy Policy
    • Terms And Conditions
    • Contact Us

    follow us

    Subscribe
    Nutraceuticals World

    Latest Breaking News From Nutraceuticals World

    BGG Obtains U.S. Patent on AstaZine Natural Astaxanthin for Heart Function During Exercise
    Qualitas Health/iwi Raises $10 Million in Investment Round
    Aker BioMarine Expands Krill Portfolio with Novel Protein Hydrolysate
    Coatings World

    Latest Breaking News From Coatings World

    IGL Coatings Launches Graphene Reinforced Dual System Ceramic Coating
    Miller Paint Declares Simple Serenity its 2021 Color of the Year
    TAUBMANS Paint by PPG Releases ‘Chromatic Joy’ Palettes
    Medical Product Outsourcing

    Latest Breaking News From Medical Product Outsourcing

    CHF Solutions Appoints CEO
    Freehand Partners with Imperial Medial Solutions
    Intersect ENT Announces CMS Approval of Coding Application for Sinus Implant
    Contract Pharma

    Latest Breaking News From Contract Pharma

    Bone Therapeutics, Rigenerand Ink Cell Therapy Deal
    NovaQuest Private Equity Acquires CoreRx
    JS Bio and Etta Biotech Advancing Partnership
    Beauty Packaging

    Latest Breaking News From Beauty Packaging

    Marino Belotti Presents New Website
    Essence Cosmetics Expands in the U.S.
    Sigma Beauty Launches 'Brush Care' Sets at Sephora
    Happi

    Latest Breaking News From Happi

    Mix:Bar Launches at Target
    Crystal Deodorant Unveils Magnesium-Enriched Sticks
    Euromonitor Reveals Top 10 Global Consumer Trends for 2021
    Ink World

    Latest Breaking News From Ink World

    Cowan Graphics Adds Fujifilm Inca OnsetX3 HS
    Packaging Printing Market Worth $433.4 Billion by 2025: MarketsandMarkets
    O-I Foundation Gifts $50k to Facilitate COVID-19 Vaccine Access
    Label & Narrow Web

    Latest Breaking News From Label & Narrow Web

    Domino grows installation and service teams
    ABG keeps pace with demand with recruitment drive
    Acucote expands FSC-certified portfolio
    Nonwovens Industry

    Latest Breaking News From Nonwovens Industry

    Honeywell Delivered 225 Million Masks in December
    Techtextil, Texprocess Postponed to 2022
    Super Strong Inks Survive Tough Environments
    Orthopedic Design & Technology

    Latest Breaking News From Orthopedic Design & Technology

    Bioventus Appoints SVP of Operations
    DePuy Synthes Receives 510(k) FDA Clearance for VELYS Robotic-Assisted Solution
    OrthoPediatrics Expands Agent Network in Three European Countries
    Printed Electronics Now

    Latest Breaking News From Printed Electronics Now

    UDC Subsidiary Adesis' Website Wins 2020 MarCom Platinum Award
    Roadsimple Modernizes Warehouse Ops with Zebra Technologies
    Graphene Flagship Launches Redesigned Website

    Copyright © 2021 Rodman Media. All rights reserved. Use of this constitutes acceptance of our privacy policy The material on this site may not be reproduced, distributed, transmitted, or otherwise used, except with the prior written permission of Rodman Media.

    AD BLOCKER DETECTED

    Our website is made possible by displaying online advertisements to our visitors.
    Please consider supporting us by disabling your ad blocker.


    FREE SUBSCRIPTION Already a subscriber? Login