HD MicroSystems (HDM) and American Semiconductor, Inc. (ASI) announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets. 
 
The joint development will leverage American Semiconductor’s patented wafer-level chip scale packaging technologies that are encapsulated with advanced polyimide materials provided by HD MicroSystems. 
 
“We are honored to collaborate with HDM to establish production capacity for our new technology implemented with HDM’s unparalleled polyimide materials expertise combining large-scale processing, leading-edge technology and early consumer market insight,” said Doug Hackler, president and CEO of ASI. “Together, we are elevating and redefining the electronic world to be more seamless and personalized for all of us – whether at work or play.”
 
“By forming this partnership, we are pairing our polyimide materials expertise with ASI’s novel wafer-level CSP process to drive a new age of electronics that will be embedded throughout our physical world in places never-before-possible,” Shigenori Kobayashi, VP/COO, HDM said.
 
Drawing on resources from both ASI and HDM, the joint development will enable the rapid scaling of ultra-thin IC packages for high-end multilayer electronic designs (HDI), flexible hybrid electronics (FHE), and “smart structures” for the Internet of Things (IoT).