David Savastano, Editor07.25.12
Sensors are quickly becoming one of the best potential uses for printed electronics (PE), as the combination of flexible form factors, functionality and cost are indeed intriguing.
Thus, the news that Bemis Company, a leading supplier of flexible packaging and pressure sensitive materials with sales of $5.3 billion in 2011, and Thin Film Electronics ASA (Thinfilm) are working together on Thinfilm’s Intelligent Packaging Platform to develop a flexible sensing platform for the packaging market makes a lot of sense.
The stated goal is to create a new category of packaging that can collect and wirelessly communicate information such as important physical properties and environmental data in packaged perishable products. In addition to partnering with PARC on development of printed logic, Thinfilm has announced technology partnerships with a number of key PE companies, including Acreo, Imprint Energy, Inktec, Polyera, PST Sensors and Solvay to develop integrated printed syst
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