David Savastano, Editor07.25.12
Sensors are quickly becoming one of the best potential uses for printed electronics (PE), as the combination of flexible form factors, functionality and cost are indeed intriguing.
Thus, the news that Bemis Company, a leading supplier of flexible packaging and pressure sensitive materials with sales of $5.3 billion in 2011, and Thin Film Electronics ASA (Thinfilm) are working together on Thinfilm’s Intelligent Packaging Platform to develop a flexible sensing platform for the packaging market makes a lot of sense.
The stated goal is to create a new category of packaging that can collect and wirelessly communicate information such as important physical properties and environmental data in packaged perishable products. In addition to partnering with PARC on development of printed logic, Thinfilm has announced technology partnerships with a number of key PE companies, including Acreo, Imprint Energy, Inktec, Polyera, PST Sensors and Solvay to develop integrated printed systems, such as an inexpensive, integrated time-temperature sensor for use in monitoring perishable goods and pharmaceuticals.
This type of sensor would be utilized by industries ranging from food and consumer products to healthcare. The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.
Thinfilm executives noted that the project has been under discussion for a year.
“Initial introduction happened at LOPE-C in 2011,” said Davor Sutija, CEO, Thin Film Electronics ASA. “After this, we began exploring how our roadmaps could intersect, and discovered interesting strategic intersections, both short and long term.”
As a major international leader in flexible packaging and pressure sensitive materials, Bemis works closely with numerous consumer product companies.
“Bemis is a global leader in flexible packaging and pressure sensitive materials, and an expert on ultra high volume manufacturing. Their customers include several leading consumer brands,” said Sutija. “It's fair to say you can find Bemis products in every aisle of a food store. “
There are different sensing requirements for products as diverse as food and pharmaceuticals, and Thinfilm’s ability to customize its sensors is a key differentiator.
“Different product categories require varying sensing capabilities, and this is why the sensing platform is customizable,” Sutija said. “Bemis has stated Thinfilm's technology could eventually be part of every package they manufacture.”
“These low cost sensor tags bring several benefits to consumers and brand owners,” Sutija added. “For brand owners, especially in fresh produce, it's crucial to ensure products are fresh when they reach the hands of the consumer. The sensor tags are able to monitor and store physical and environmental data of the products, and wirelessly communicate this information. This enables more informed decisions in every step of the lifecycle, from manufacturing to the point when the product is consumed. A ‘use by’ or ‘best before’ date is a general guideline, but what if there is trouble in cold chain management? Intelligent packaging helps make better informed decisions.”
Thus, the news that Bemis Company, a leading supplier of flexible packaging and pressure sensitive materials with sales of $5.3 billion in 2011, and Thin Film Electronics ASA (Thinfilm) are working together on Thinfilm’s Intelligent Packaging Platform to develop a flexible sensing platform for the packaging market makes a lot of sense.
The stated goal is to create a new category of packaging that can collect and wirelessly communicate information such as important physical properties and environmental data in packaged perishable products. In addition to partnering with PARC on development of printed logic, Thinfilm has announced technology partnerships with a number of key PE companies, including Acreo, Imprint Energy, Inktec, Polyera, PST Sensors and Solvay to develop integrated printed systems, such as an inexpensive, integrated time-temperature sensor for use in monitoring perishable goods and pharmaceuticals.
This type of sensor would be utilized by industries ranging from food and consumer products to healthcare. The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.
Thinfilm executives noted that the project has been under discussion for a year.
“Initial introduction happened at LOPE-C in 2011,” said Davor Sutija, CEO, Thin Film Electronics ASA. “After this, we began exploring how our roadmaps could intersect, and discovered interesting strategic intersections, both short and long term.”
As a major international leader in flexible packaging and pressure sensitive materials, Bemis works closely with numerous consumer product companies.
“Bemis is a global leader in flexible packaging and pressure sensitive materials, and an expert on ultra high volume manufacturing. Their customers include several leading consumer brands,” said Sutija. “It's fair to say you can find Bemis products in every aisle of a food store. “
There are different sensing requirements for products as diverse as food and pharmaceuticals, and Thinfilm’s ability to customize its sensors is a key differentiator.
“Different product categories require varying sensing capabilities, and this is why the sensing platform is customizable,” Sutija said. “Bemis has stated Thinfilm's technology could eventually be part of every package they manufacture.”
“These low cost sensor tags bring several benefits to consumers and brand owners,” Sutija added. “For brand owners, especially in fresh produce, it's crucial to ensure products are fresh when they reach the hands of the consumer. The sensor tags are able to monitor and store physical and environmental data of the products, and wirelessly communicate this information. This enables more informed decisions in every step of the lifecycle, from manufacturing to the point when the product is consumed. A ‘use by’ or ‘best before’ date is a general guideline, but what if there is trouble in cold chain management? Intelligent packaging helps make better informed decisions.”
